• 비파괴검사학회지
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• 제35권3호
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• pp.200-205
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• 2015

현대의 컴팩트 반도체 소자들은 정확한 품질검사를 위해 비파괴, 고분해능의 검사 장비가 요구되고 있다. 검사 장비 중 고분해능 적외선 대물렌즈와 적외선 센서로 구성된 초정밀 열영상 현미경은 반도체 내부의 결함에서 발생되는 국소적 열원의 위치와 깊이 정보를 얻는데 유용하게 활용되고 있다. 본 연구에서는 위 상잠금기법이 적용된 적외선열영상 현미경을 이용하여 다층구조로 된 반도체 소자 내부 열원의 위치와 깊이 정보에 대해 분석하였다. 시편은 내부에 3개의 열원을 포함한 TSV(through silicon via technology) 기반 4단 적층구조로서 측정 표면으로부터 열원의 깊이는 $240{\mu}m$이다. 본 실험에서는 위상잠금기법을 통해 시편 내부열원의 위치와 깊이를 정확히 찾을 수 있는 초점면 위치, 노출시간 그리고 위상잠금주파수 등 최적의 조건을 찾고 그 조건에서 적외선 대물렌즈와 시편의 거리 변화에 따른 위상 변이와 깊이 정보에 대한 영향을 알아보았다. 이와 같은 반도체 내부결함에 의한 열원의 위치와 깊이 분석에 대한 연구는 품질검사용 열영상 분석장비 개발에 큰 도움을 줄 것으로 예상한다.

• Current Photovoltaic Research
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• 제4권3호
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• pp.124-129
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• 2016

Recently industry has voiced a need for optimally designing the production process of low-cost, high-quality ingots by improving productivity and reducing production costs with the Czochralski process. Crystalline defect control is important for the production of high-quality ingots. Also oxygen is one of the most important impurities that influence crystalline defects in single crystals. Oxygen is dissolved into the silicon melt from the silica crucible and incorporated into the crystalline a far larger amount than other additives or impurities. Then it is eluted during the cooling process, there by causing various defect. Excessive quantities of oxygen degrade the quality of silicone. However an appropriate amount of oxygen can be beneficial. because it eliminates metallic impurities within the silicone. Therefore, when growing crystals, an attempt should be made not to eliminate oxygen, but to uniformly maintain its concentration. Thus, the control of oxygen concentration is essential for crystalline growth. At present, the control of oxygen concentration is actively being studied based on the interdependence of various factors such as crystal rotation, crucible rotation, argon flow, pressure, magnet position and magnetic strength. However for methods using a magnetic field, the initial investment and operating costs of the equipment affect the wafer pricing. Hence in this study simulations were performed with the purpose of producing low-cost, high-quality ingots through the development of a process to optimize oxygen concentration without the use of magnets and through the following. a process appropriate to the defect-free range was determined by regulating the pulling rate of the crystals.

• 한국분말재료학회지
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• 제20권4호
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• pp.269-274
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• 2013

The present work investigated the dispersion behavior of $Y_2O_3$ particles into AISI 316L SS manufactured using laser cladding technology. The starting particles were produced by high energy ball milling in 10 min for prealloying, which has a trapping effect and homogeneous dispersion of $Y_2O_3$ particles, followed by laser cladding using $CO_2$ laser source. The phase and crystal structures of the cladded alloys were examined by XRD, and the cross section was characterized using SEM. The detailed microstructure was also studied through FE-TEM. The results clearly indicated that as the amount of $Y_2O_3$ increased, micro-sized defects consisted of coarse $Y_2O_3$ were increased. It was also revealed that homogeneously distributed spherical precipitates were amorphous silicon oxides containing yttrium. This study represents much to a new technology for the manufacture and maintenance of ODS alloys.

• 한국군사과학기술학회지
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• 제1권1호
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• pp.227-237
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• 1998

HgCdTe Is the most versatile material for the developing infrared devices. Not like III-V compound semiconductors or silicon-based photo-detecting materials, HgCdTe has unique characteristics such as adjustable bandgap, very high electron mobility, and large difference between electron and hole mobilities. Many research groups have been interested in this material since early 70's, but mainly due to its thermodynamic difficulties for preparing materials, no single growth technique is appreciated as a standard growth technique in this research field. Solid state recrystallization(SSR), travelling heater method(THM), and Bridgman growth are major techniques used to grow bulk HgCdTe material. Materials with high quality and purity can be grown using these bulk growth techniques, however, due to the large separation between solidus and liquidus line on the phase diagram, it is very difficult to grow large materials with minimun defects. Various epitaxial growth techniques were adopted to get large area HgCdTe and among them liquid phase epitaxy(LPE), metal organic chemical vapor deposition(MOCVD), and molecular beam epitaxy(MBE) are most frequently used techniques. There are also various types of photo-detectors utilizing HgCdTe materials, and photovoltaic and photoconductive devices are most interested types of detectors up to these days. For the larger may detectors, photovoltaic devices have some advantages over power-requiring photoconductive devices. In this paper we reported the main results on the HgCdTe growing and characterization including LPE and MOCVD, device fabrication and its characteristics such as single element and linear array($8{\times}1$ PC, $128{\times}1$ PV and 4120{\times}1$ PC). Also we included the results of the dewar manufacturing, assembling, and optical and environmental test of the detectors.

• 대한조선학회 특별논문집
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• 대한조선학회 2006년도 특별논문집
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• pp.46-52
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• 2006

For ships, heat resistant coating is applied on the aluminized steel pipe systems dealing with high temperature steam over $200^{\circ}C$. The coatings on these steam pipes should retain both heat resistance and anti-corrosion properties to provide long-term resistance against coating defects (rust, delamination and crack) under the harsh outdoor environment including repeated seawater wetting and condensation. Thus, it is important to improve the coating qualities and to reduce maintenance works for these steam pipe systems. In this study, five different commercial heat resistant coatings (A, B, C, D, E) were selected for evaluation. Various physical properties of these coatings were evaluated on the coatings applied on the aluminized steam pipes. FT-IR analysis was also employed to identify the factors contributing the degree of heat resistance and durability of each coating material. The results indicated that the heat resistance capacity of coatings increased with the increase of silicon content as well as the decrease of substituent content. Both products C and D showed the best coating qualifies, which can be standard coating systems for future steam pipe areas.

• Transactions on Electrical and Electronic Materials
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• 제18권1호
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• pp.55-57
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• 2017

Amorphous oxide thin film transistors (TFTs) were fabricated with 0.5 wt% silicon doped zinc tin oxide (a-0.5SZTO) thin film deposited by radio frequency (RF) magnetron sputtering. In order to investigate the effect of annealing treatment on the electrical properties of TFTs, a-0.5SZTO thin films were annealed at three different temperatures ($300^{\circ}C$, $500^{\circ}C$, and $700^{\circ}C$ for 2 hours in a air atmosphere. The structural and electrical properties of a-0.5SZTO TFTs were measured using X-ray diffraction and a semiconductor analyzer. As annealing temperature increased from $300^{\circ}C$ to $500^{\circ}C$, no peak was observed. This provided crystalline properties indicating that the amorphous phase was observed up to $500^{\circ}C$. The electrical properties of a-0.5SZTO TFTs, such as the field effect mobility (${\mu}_{FE}$) of $24.31cm^2/Vs$, on current ($I_{ON}$) of $2.38{\times}10^{-4}A$, and subthreshold swing (S.S) of 0.59 V/decade improved with the thermal annealing treatment. This improvement was mainly due to the increased carrier concentration and decreased structural defects by rearranged atoms. However, when a-0.5SZTO TFTs were annealed at $700^{\circ}C$, a crystalline peak was observed. As a result, electrical properties degraded. ${\mu}_{FE}$ was $0.06cm^2/Vs$, $I_{ON}$ was $5.27{\times}10^{-7}A$, and S.S was 2.09 V/decade. This degradation of electrical properties was mainly due to increased interfacial and bulk trap densities of forming grain boundaries caused by the annealing treatment.

• 한국진공학회지
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• 제8권1호
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• pp.20-25
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• 1999

여러 가지 방법의 plasma 표면 처리와 산화 공정이 $SiO_2-Si$(100) 계면에 미치는 물리적 영향을 angle resolved uv-photoelectron spectroscopy(ARUPS)를 이용하여 연구하였다. 표면은 ex situ 방법과 함께 in situ 수소 플라즈마를 이용하여 처리되어 졌으며, 이것은 고진공 고온 열 처리 방법과 비교되어졌다. ARUPS 빛띠 상에 나타난 산화물 가전자 띠에 대한 특징적인 peak 위치는 표면 처리 및 산화 공정 방법에 따라 이동하였다. 이러한 peak의 이동은 Si에서의 띠휨에 의한 것으로 분석되어졌다. 또한 peak 이동의 원인으로 Si-SiO2 계면에 형성된 결점과 표면 처리 공정에 따라 달라지는 표면 거칠기 등을 고려할 수 있었다. 여러 공정에 대한 ARUPS 결과를 비교함으로써 $Si--SiO_2$(계면 결합이 표면 처리 및 산화 방법에 깊이 관련되어 있음을 결론지을 수 있었다. 산소 plasma 공정은 가장 작은 band bending을 보여주었다.

• 대한공업교육학회지
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• 제33권1호
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• pp.249-264
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• 2008

본 연구에서는 저 에너지 이온 주입과 이중 열처리를 통하여 박막 $p^+-n$ 접합을 형성하였고, 보론 확산 모델을 가지고 새로운 시뮬레이터를 설계하여 이온 주입과 열처리 후의 보론 분포를 재현하였다. $BF_2$ 이온을 가지고 실리콘 기판에 저 에너지 이온 주입을 하였고, 이후 RTA(Rapid Thermal Annealing)와 FA(Furnace Annealing)를 통하여 열처리 과정을 수행하였다. 시뮬레이션을 위한 확산 모델은 점결함의 생성과 재결합, BI 쌍의 생성, 보론의 활성화와 침전 현상 등을 고려하였다. FA+RTA 열처리가 RTA+FA 보다 면저항 측면의 접합 특성에서 우수한 결과를 나타내었고, 시뮬레이터에서도 동일한 결과를 나타내었다. 따라서 본 연구를 통하여 박막접합을 형성할 때 열적 효율성을 고려하면 제안된 확산 시뮬레이터와 FA+RTA 공정 방법의 유용성을 기대할 수 있다.

• 펄프종이기술
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• 제32권5호
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• pp.72-79
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• 2000

On the other hand, the fiber orientation at the surface and middle layer of the sheet controls the bending stiffness of paperboard. Therefore, a reliable measurement of paper surface fiber orientation gives us a magnificent tool to investigate and predict paper curling and cockling tendency, and provides the necessary information to fine-tune the manufacturing process for optimum quality. Many papers, especially heavily calendered and coated grades, do resist liquid and gas penetration very much, being beyond the measurement range of the traditional instruments or resulting inconveniently long measuring time per sample. The increased surface hardness and use of filler minerals and mechanical pulp make a reliable, non-leaking sample contact to the measurement head a challenge of its own. Paper surface coating causes, as expected, a layer which has completely different permeability characteristics compared to the other layers of the sheet. The latest developments in sensor technologies have made it possible to reliably measure gas flow n well controlled conditions, allowing us to investigate the gas penetration of open structures, such as cigarette paper, tissue or sack paper, and in the low permeability range analyze even fully greaseproof papers, silicon papers, heavily coated papers and boards or even detect defects in barrier coatings! Even nitrogen or helium may be used as the gas, giving us completely new possibilities to rank the products or to find correlation to critical process or converting parameters. All the modern paper machines include many on-line measuring instruments which are used to give the necessary information for automatic process control systems. Hence, the reliability of this information obtained from different sensors is vital for good optimizing and process stability. If any of these on-line sensors do not operate perfectly as planned (having even small measurement error or malfunction), the process control will set the machine to operate away from the optimum, resulting loss of profit or eventual problems in quality or runnability. To assure optimum operation of the paper machines, a novel quality assurance policy for the on-line measurements has been developed, including control procedures utilizing traceable, accredited standards for the best reliability and performance.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.9-10
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• 2010

Since the discovery of graphene by mechanical exfoliation from graphite[1], various fabrication methods are available today such as chemical exfoliation, epitaxial graphene on SiC substrates, etc. In view of industrialization, the mechanical exfoliation method may not be an option. Epitaxial graphene on SiC substrates, in this respect, is by far more practical because the method consists of conventional thermal treatments familiar to semiconductor industry. Still, the use of the SiC substrate itself, and hence the incompatibility with the Si technology, lessens the importance of this technology in its future industrialization. In this context, we have tackled the problem of forming graphene on Si substrates (GOS). Our strategy is to form an ultrathin (~80 nm) SiC layer on top of a Si substrate, and to graphitize the top SiC layers by a vacuum annealing. We have actually succeeded in forming the GOS structure [2,3,4]. Raman-scattering microscopy indicates presence of few-layer graphene (FLG) formed on our annealed SiC/Si heterostructure, with the G ($1580\;cm^{-1}$) and the G'($2700\;cm^{-1}$) bands, both related to ideal graphene, clearly observed. Presence of the D ($1350\;cm^{-1}$) band indicates presence of defects in our GOS films, whose elimination remains as a challenge in the future. To obtain qualified graphene films on Si substrate, formation of qualified SiC films is crucial in the first place, and is achieved by tuning the growth parameters into a process window[5]. With a potential for forming graphene films on large-scale Si wafers, GOS is a powerful candidate as a key technology in bringing graphene into silicon technology.