• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.23-27
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• 2006

Semiconductor industry has been dramatically developed with the information era of 21C, and the trend now is to consider that the technology of management system of the computer utility that has a high efficiency is important. This study investigated the intelligent decision system for residual gas purge process to effectively remove the residual gas in the tube after replacing the cylinder that is used for the gas cabinet or BSGS(Bulk Specialty Gas Supply System) of the semiconductor process. It was suggest from this study that it is possible to decide the type, frequency and volume of purge gas using various toxic gases which is necessary for each process. Also, this result will be utilized for operating the system, increasing the efficiency of management and saving energy.

• Clean Technology
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• v.5 no.1
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• pp.62-77
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• 1999

Semiconductor industry has rapidly grown because of the need from electronic and computer industries. However the global environmental regulations for various hazardous chemical compounds, which are indispensably used in semiconductor manufacturing process, are getting stronger. The semiconductor industries should develop the cleaner technologies in order to both lead the future world market and avoid the regulations form environmentally developed countries. In this paper, cleaner technologies for semiconductor cleaning processes are surveyed, such as gas phase process, UV process, and plasma process. Advantages and disadvantages of these processes are discussed.

• Journal of the Semiconductor & Display Technology
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• v.9 no.4
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• pp.71-76
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• 2010

According to recent changes in industry for semiconductor devices, a low-temperature treatment has become a necessity. These changes relate to size refinement and the development of new materials. While variation in cooling efficiency does not affect the yield when using a high-temperature treatment, uniform cooling efficiency is necessary avoid "inconsistencies/bends" in low temperature treatments. However it is difficult to increase temperature stabilization in low temperature treatments. In this paper, using CFD (Computer Fluid Dynamics), we analyze and manipulate the design and input of the low-temperature system to attempt to control for temperature variations within the quartz tube, of which airflow appears to be a predominant factor. This simulation includes variable inputs such as airflow rate, head pressure, and design manipulations in the S.C.U. (Super Cooling Unit).

• Journal of the Semiconductor & Display Technology
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• v.20 no.1
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• pp.59-63
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• 2021

Upper electrode is one of core parts using plasma etching process at semiconductor. The purpose of this study is to analyze effects of cutting conditions for mechanical machining of silicon upper electrode. For this research, surface roughness of machined workpiece and depth of damage inside of silicon electrode are experimented and analyzed and different values of feed rate and depth of cut are applied for the experiments. From these experiments, it is verified that the surface roughness and internal damaged layer get worse according to take more fast feed rate. In conclusion, cutting condition is very important factor for machining. Results of this study can use to develop various parts which are made from single crystal silicon and affect various benefits to the semiconductor industry for better productivity.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• The Transactions of the Korean Institute of Power Electronics
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• v.1 no.1
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• pp.1-6
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• 1996

Recent trends of the power electronic industry in China have been summarized in this paper. Based on the applications of the power electronic products in the chinese industries the production trends of power semiconductor devices, drives, power supplies, power electronic industry used in power systems in China have been briefly reviewed.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.27 no.3
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• pp.187-192
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• 2017

Objectives: It is difficult to identify exposure factors in the semiconductor industry due to low exposure levels to hazardous substances and because various processes take place in fabrication (FAB). Furthermore, a single worker often experiences a variety of job histories, so it is difficult to classify similar exposure groups (SEG) in the semiconductor industry. Therefore, we intend to develop a new exposure index, the period of working in FAB, that is applicable to the semiconductor industry. Methods: First, in specifying the classification of jobs, we clearly distinguished whether they were FAB workers or non-FAB workers. We checked FAB working hours per week through questionnaires administered to FAB workers. We derived an exposure index called FAB-Year that can represent the period of working in FAB. FAB-Year is an index that can quantitatively indicate the period of working in FAB, and one FAB-Year is defined as working in FAB for 40 hours per week for one year. Results: A total of 8,453 persons were surveyed, and male engineers and female operators occupied 90% of the total. The average total years of service of the subjects was 9.7 years, and the average FAB-Year value was 6.8. This means that the FAB-working ratio occupies 70% of total years of service. The average FAB-Year value for female operators was 8.4, for male facility engineers it was 7.7, and for male process engineers it was 3.5. A FAB-Year standardization value according to personal information (gender, job group, entry year, retirement year) for the survey subjects can be calculated, and standardized estimation values can be applied to workers who are not participating in the survey, such as retirees and workers on a leave of absence (LOA). Conclusions: This study suggests an alternative method for overcoming the limitations on epidemiological study of the semiconductor industry where it is difficult to classify exposure groups by developing a new exposure index called FAB-Year. Since FAB-Year is a quantitative index, we expect that various approaches will be possible in future epidemiological studies.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.23-34
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• 2013

Over the past several decades in the microelectronics industry, devices have gotten smaller, thinner, and lighter, without any accompanying degradation in quality, performance, and reliability. One permanent and deniable trend in packaging as well as wafer fabrication industry is system integration. The proliferating options for system integration, recently, are driving change across the overall semiconductor industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solution. The trend toward 3D system integration and miniaturization in a small form factor has accelerated even more with the introduction of smartphones and tablets. In this paper, the key issues and state of the art for system integration in the packaging process are introduced, especially, focusing on ease transition to next generation packaging technologies like through silicon via (TSV), 3D wafer-level fan-out (WLFO), and chip-on-chip interconnection. In addition, effective solutions like fine pitch copper pillar and MEMS packaing of both advanced and legacy products are described with several examples.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.98-105
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• 2017

In the display industry, the residual vibration of the transfer robot can increase the process time and cause the breakage of the glass substrate, which is critical to productivity of display manufacturing. In this paper, the natural frequencies of transfer robot are analyzed by finite element method. On the basis of the analyzed data, we investigated the response characteristics of input shaping control with or without the glass presence on the hand of the transfer robot using MATLAB program, and compared with the current response characteristics of input shaping control applied to the industry. Based on this, we suggest an optimal residual vibration control method for the practical application in display industry.

• Journal of the Semiconductor & Display Technology
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• v.20 no.1
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• pp.94-98
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• 2021

As the world's population grows, the food industry becomes increasingly important. Among them, agriculture is an industry that produces stocks of people all over the world, which is very important food industry. Despite the growing importance of agriculture, however, a large number of crops are lost every year due to pests and malnutrition. So, we propose a plant anomaly detection system for managing crops incorporating deep learning and drones with various possibilities. In this paper, we develop a system that analyzes images taken by drones and GPS of the drone's movement path and visually displays them on a map. Our system detects plant anomalies with 97% accuracy. The system is expected to enable efficient crop management at low cost.