• 제목/요약/키워드: sacrificial layer

검색결과 94건 처리시간 0.024초

Magni 565 코팅 볼트의 내식성 및 토오크 특성에 대한 연구 (A Study of Corrosion Resistance and Torque in Bolt Coated with Magni 565)

  • 김상수;김무길;정병호
    • 열처리공학회지
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    • 제20권4호
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    • pp.195-202
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    • 2007
  • Corrosion resistance and torque of M10 bolt coated with Magni 565 were investigated. Corrosion protection mechanism were also studied with the microstructure of coating film. The bolts with the optimum conditions showed around $10{\mu}m$ layer thickness, a great corrosion resistance in salt spray test and a proper torque in torque/tension test. But torque coefficient k increased with the number of bolting and clamping force of M10 bolt showed significantly lower than that of specified value 28.3kN. It was thought that the repeated bolting made the coating film peel off and powdery. The sample coated with optimum coating conditions showed more higher polarization resistance and corrosion potential than the specimens of top and base coat only. The base coating film was composed of lamellar zinc flakes, which provides a large sacrificial cathodic protection. Meanwhile, the top coating film was composed of organic aluminium pigments layer, which provides barrier protection to the corrosion circumstances.

실리콘 트랜치 구조 형성용 유전체 평탄화 공정 (Dielectric Layer Planarization Process for Silicon Trench Structure)

  • 조일환;서동선
    • 전기전자학회논문지
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    • 제19권1호
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    • pp.41-44
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    • 2015
  • 소자의 집적화에 필수적인 소자 분리공정에서 화학약품의 오염 문제등을 발생시키는 화학적 기계연마기술(CMP) 공정을 사용하지 않고 벌크 finFET(fin field effect transistor) 의 트랜치 구조를 형성할 수 있는 공정에 대하여 제안하였다. 사진 감광막 도포시 발생하는 두께차이와 희생층으로 사용되는 실리콘 질화막을 사용하면 에칭 공정만을 사용하여 상대적으로 표면 위로 돌출된 부분의 실리콘 산화막 층을 에칭하는 것은 물론 finFET 의 채널로 사용되는 실리콘 트랜치 구조를 한번에 형성할 수 있는 특징을 갖는다. 본 연구에서는 AZ1512 사진 감광막을 사용하여 50 나노미터급 실리콘 트랜치 구조를 형성하는 공정을 수행하였으며 그 결과를 소개한다.

이광자 흡수 광중합에 의한 3차원 마이크로 쉘 구조물 제작 (Fabrication of Three-Dimensional Micro-Shell Structures Using Two-Photon Polymerization)

  • 박상후;임태우;양동열
    • 대한기계학회논문집A
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    • 제29권7호
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    • pp.998-1004
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    • 2005
  • A nano-stereolithography (NSL) process has been developed for fabrication of 3D shell structures which can be applied to various nano/micro-fluidic devices. By the process, a complicated 3D shell structure on a scale of several microns can be fabricated using lamination of layers with a resolution of 150 nm in size, so it does not require the use of my sacrificial layer or any supporting structure. A layer was fabricated by means of solidifying liquid-state monomers using two-photon absorption (TPA) induced using a femtosecond laser processing. When the polymerization process is finished, unsolidified liquid state resins can be removed easily by dropping several droplets of ethanol fur developing the fabricated structure. Through this work, some 3D shell structures, which can be applied to various applications such as nano/micro-fluidic devices and MEMS system, were fabricated using the developed process.

E-T(Electro-Thermal) 액츄에이터를 이용한 microgripper (Microgripper driven by E-T(Electro-Thermal) actuator)

  • 박호준;이현기;박정호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 G
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    • pp.3325-3327
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    • 1999
  • A microgripper driven by E-T (electro-thermal) actuators has been designed and fabricated by surface micromachining. This microgripper consists of two E-T actuators. Each actuator has two arms with different widths joined at the end to form a 'U' shape. The wider 'cold' arm has a narrow flexure at the end (anchor or electrode side) for easy bending, This actuator can be fabricated with only two masks - one for the sacrificial layer and the other for the poly-Si structure layer. An E-T actuator bends its arm due to unequal thermal expansion between the 'cold' arm and the 'hot' arm, This actuator tip moves laterally in an arcing motion towards the cold arm side when the structure is unevenly heated by the applied current. Therefore each microgripper is actuated inwards and can hold a micro object. The fabricated E-T actuator was operated in the range of $2{\sim}12V$ and $1{\sim}5mA$. and maximum tip displacement was $13.6{\mu}m$. This device may become useful in many applications because an E-T actuator can be designed and fabricated easily, and obtain large displacement.

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윤활유가 침지된 나노구조 전기아연도금층의 젖음성 (Wettability of Lubricant-Impregnated Electroplated Zinc Surface with Nanostructure)

  • 정해창;김왕렬;정찬영;이정훈
    • 한국표면공학회지
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    • 제52권1호
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    • pp.37-42
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    • 2019
  • Electrodeposited zinc layer is widely used as a sacrificial anode for a corrosion protection of steel. In this study, we modified the surface of electrodeposited zinc to have a hydrophobicity, which shows various advanced functionalities, such as anti-corrosion, anti-biofouling, anti-icing and self-cleaning, due to its repellency to liquids. Superhydrophobicity was realized on electrodeposited zinc layer with a hydrothermal treatment, creating nanostructures on the surface, and following Teflon coating. The superhydrophobic surface shows a great repellency to water with high surface tension, while liquid droplets with low surface tension easily adhered on the superhydrophobic surface. However, immiscible lubricant-impregnated superhydrophobic surface shows a great repellency to various liquids, regardless of their surface tension. Therefore, it is expected that the lubricant-impregnated surface can be an alternative of superhydrophobic surface, which have a drawback for some liquids with a low surface tension.

Plasma Etch Damage가 (100) SOI에 미치는 영향의 C-V 특성 분석 (C-V Characterization of Plasma Etch-damage Effect on (100) SOI)

  • 조영득;김지홍;조대형;문병무;조원주;정홍배;구상모
    • 한국전기전자재료학회논문지
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    • 제21권8호
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    • pp.711-714
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    • 2008
  • Metal-oxide-semiconductor (MOS) capacitors were fabricated to investigate the plasma damage caused by reactive ion etching (RIE) on (100) oriented silicon-on-insulator (SOI) substrates. The thickness of the top-gate oxide, SOI, and buried oxide layers were 10 nm, 50 nm, and 100 nm, respectively. The MOS/SOI capacitors with an etch-damaged SOI layer were characterized by capacitance-voltage (C-V) measurements and compared to the sacrificial oxidation treated samples and the reference samples without etching. The measured C-V curves were compared to the numerical results from corresponding 2-dimensional (2-D) structures by using a Silvaco Atlas simulator.

화상처리용 마이크로 미러의 동특성 측정기술 (Dynamic Characteristics Measurement of Micro Mirror for Image Display)

  • 이은호;김규로
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 춘계학술대회 논문집
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    • pp.371-376
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    • 1997
  • A 100*100.mu.m$^{2}$ aluminum micro mirror is designed and fabricated using a thick photoresist as a sacrificial layer andas a mold for nickel electroplating. The micro mirror is composed of aluminum mirror plate, two nickel support posts, two aluminum hinges, two address eletrodes, and two landing electrodes. The aluminum mirror plate,which is supported by two nickel support posts, is overhung about 10.mu.m from the silicon substrate. THe aluminum mirror plate is actuated like a seesaw by electrostatic force generated by electic potential difference applied between the mirror plate and the address electrode. This paper presents some methods to measure the optical and the dynamic characteristics of the fabricated micro mirror.

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결정립 식각 기술을 이용한 다결정 실리콘 부착 방지 구조 (Polysilicon anti-sticking structure by grain etching technique)

  • 이영주;박명규;전국진
    • 전자공학회논문지D
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    • 제35D권2호
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    • pp.60-69
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    • 1998
  • Polysilicon surface mdoification tecnique is developed to reduce the sticking of microstructures fabricated by micromachining. Modified anti-sticking grain holes are simply formed by two-step dry eth without additional photolithography nor deposition of thin films. Both process-induced sticking and in-use sticking are successfully reduced more than two times by adopting grain holed polysilicon substrate. A sticking model for cantilever beam is derived. This model includes bending moment stems from stress gradient along the thickness directionof structural polysilicon. Because the surface tension of rinse liquid and the surface energy of the solids to be stuk tend to decrease in recently developed anti-sticking techniques, the effect of stress gradient will play an important role to analyze the sticking phenomena. Effect of the temperature during post-release rinse and dry is modelled and verified experimentally. Based on developed anti-sticking polysilicon structure and the sticking model, sticking of microstructure, fabricated by simple wet process including sacrificial layer etch and rinse with deionized water without special equimpment for post-release rinse and dry was alleviated more than 3.5 times.

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$O_2$ RIE 공정을 이용한 20{\mu}m$ 두께의 폴리이미드 마이크로 구조물의 제작 (Fabrication of the 20{\mu}m$-height Polyimide Microstructure Using $O_2$ RIE Process)

  • 백창욱;김용권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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    • pp.600-602
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    • 1995
  • Using the $O_2$ RIE process, 20{\mu}m$-height polyimide microstructures are fabricated. In LIGA-like process, metal microstructure can be formed by the electroplating using these polyimide microstructures as a plating mould. Reactive ion Etching technique using oxygen gas is used for the patterning of polyimide. The etching rate of the polyimide is increased with increased pressure and RF power. The anisotropic vertical sidewall can be obtained at low pressure, but the etched surface state is not so good yet. "Micrograss", which is formed during the RIE and disturbs uniform electroplating, can be removed effectively by the wet itching of the chromium sacrificial layer. More studies about the improvement of an etched surface state and the removal of microsgrass are needed.

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전자빔 리소그래피와 열처리를 이용한 탄소 나노구조물의 제작 및 바이오센싱 응용연구 (Fabrication of carbon nanostructures using electron beam lithography and pyrolysis for biosensing applications)

  • 이정아;이광철;박세일;이승섭
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1727-1732
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    • 2008
  • We present a facile, yet versatile carbon nanofabrication method using electron beam lithography and resist pyrolysis. Various resist nanopatterns were fabricated using a negative electron beam resist, SAL-601, and were then subjected to heat treatment in an inert atmosphere to obtain carbon nanopatterns. Suspended carbon nanostructures were fabricated by wet-etching of an underlying sacrificial oxide layer. Free-standing carbon nanostructures, which contain 122 nm-wide, 15 nm-thick, and 2 ${\mu}m$-long nanobridges, were fabricated by resist pyrolysis and nanomachining processes. Electron beam exposure dose effects on resist thickness and pattern widening were studied. The thickness of the carbon nanostructures was thinned down by etching with oxygen plasma. An electrical biosensor utilizing carbon nanostructures as a conducting channel was studied. Conductance modulations of the carbon device due to streptavidin-biotin binding and pH variations were observed.

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