• Restorative Dentistry and Endodontics
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• v.49 no.1
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• pp.3.1-3.8
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• 2024

This article is a narrative review that discusses the recommended sample size requirements to design a pilot study to assess the reliability of a questionnaire. A list of various sample size tables that are based on the kappa agreement test, intra-class correlation test and Cronbach's alpha test has been compiled together. For all calculations, type I error (alpha) was set at a maximum value of 0.05, and power was set at a minimum value of 80.0%. For the kappa agreement test, intra-class correlation test, and Cronbach's alpha test, the recommended minimum sample size requirement based on the ideal effect sizes shall be at least 15, 22, and 24 subjects respectively. By making allowances for a non-response rate of 20.0%, a minimum sample size of 30 respondents will be sufficient to assess the reliability of the questionnaire. The clear guideline of minimum sample size requirement for the pilot study to assess the reliability of a questionnaire is discussed and this will ease researchers in preparation for the pilot study. This study provides justification for a minimum requirement of a sample size of 30 respondents specifically to test the reliability of a questionnaire.

• Journal of dental hygiene science
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• v.14 no.2
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• pp.198-206
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• 2014

The purpose of this study was to develop and validate tool for measuring the communication skills of dental hygienist. The survey was modified and revised to fit into Korean culture. Also the reliability and validity was tested in order to ensure the survey was properly evaluating communication skills of dental hygienists. A survey was conducted with outpatients in dental clinics located in Seoul, Gyeonggi, and Daejeon area. The 483 answers out of the total collected answers were used for the final analysis of the study, using PASW Statistics 18.0 and IBM SPSS AMOS 7.0 to measure the validity and reliability. The factor analysis showed that the communication skill of the dental hygienists was composed of three elements, namely 'being caring and respectful' communications, 'sharing information' communications and 'tending to comfort' communications to reduce pain and anxiety. The validity of the model examined by a confirmatory factor analysis satisfied most of the relevant requirements. All of the factors had the conceptual reliability and variant extracted index above the minimum requirements, ensuring reliability and concentrated validity. Also, the value of the square of the correlations between all latent factors which was larger than the square of the correlation between all of the factors, thus proving the discriment validity. Cronbach's ${\alpha}$ was 0.8, which shows high reliability level. In conclusion, it was proven that dental hygienist's communication skill measurement tool has high validity and reliability. Further, this study can be used to improve dental hygienists' communication skills. Therefore, this will improve oral health of clients and manage them.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.157-162
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• 2003

Piezoelectric ink jet offers a promising combination of productivity, reliability and uniformity that are appropriate for jetting organic electronic materials. Spectra is manufacturing a printhead specifically for display manufacturing. This printhead contains a robust material set and is intended to allow calibration of individual nozzles to meet uniformity requirements of+/-2% for display manufacture.

• Journal of Digital Convergence
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• v.9 no.5
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• pp.141-156
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• 2011

Auditors' subjective opinions m audit activities weaken reliability in audit judgments. This paper suggests fixed quantity models through requirement priority for improving objective evaluation and priorities of requirements in information system audit. The value of requirements was evaluated based on customers' requirements with a premise that they are not in the same level. Furthermore, the audit objective judgments were enhanced to enable fixed quantity of subjective audit by subdividing detailed evaluation index of requirement priority standards into importance of service and function on orderers' perspective, and sectioning cost and schedule on contractors' perspective.

• Journal of Korea Society of Digital Industry and Information Management
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• v.18 no.2
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• pp.61-75
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• 2022

The purpose of this study is to analyze the impact of quality management system requirements, a management innovation technique, on business performance to secure the competitiveness of SMEs in an environment of increasing uncertainty in the global economy and intensifying competition. To this end, a survey was conducted on small and medium-sized enterprises (SMEs) operating a quality management system, and statistical analysis was performed through validity and reliability analysis, regression analysis, and group analysis using IBM SPSS 26.0. As a result of the study, it was found that planning, operation, support, and improvement, which are the core requirements of a quality management system, have a positive effect on business performance. In addition, through group analysis, it was found that the effect of quality management system requirements on business performance varies according to the level of the company. This means that the importance of quality management requirements required for strategy establishment varies according to the quality management introduction level of small and medium-sized manufacturers, and it can be used for small and medium-sized manufacturers to set strategic directions.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• Journal of the Korean Society for Aviation and Aeronautics
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• v.25 no.3
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• pp.115-122
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• 2017

To achieve designed quality and reliability from R&D to force integration, an establishment of precise and distinct specifications and standards are required. However, the recent process of R&D standardization on defense acquisition system, has brought plenty of corrections on specifications and standards that may cause not only difficulties to production line and retardation to the military forces, but also a degradation of provided weapon systems. Therefore, a technical review should be performed by the developer, the producer, and the client, establishing the standard that include mass production requirements as well as clients' requirements. This paper propose a specified solution on process of R&D standardization, by applying a substantial FCA(Functional Configuration Audit) and PCA(Physical Configuration Audit) which implies participation of related agencies. By the improved PCA, 2,023 corrections on 74 types of QAR(Quality Assurance Requirement)s and 12,715 corrections on drawings are identified.

• Journal of Satellite, Information and Communications
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• v.10 no.3
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• pp.114-120
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• 2015

In this paper, we show the design requirements of the cryptographic module and its security algorithm designed to prevent the exposure of the command signal applied to Flight Termination System. The cryptographic module consists of two separate devices that are Command Insertion Device and Command Generation Device. The cryptographic module designed to meet the 3 principles(Confidentiality, Integrity and Availability) for the information security. AES-256 block encryption algorithm and SHA-256 Hash function were applied to the encrypted symmetric key encryption method. The proposed cryptographic module is expected to contribute to the security and reliability of the Flight Termination System for Space Launch Vehicle.

• Journal of Applied Reliability
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• v.10 no.1
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• pp.39-56
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• 2010

Statistical process control (SPC) is a powerful technique for monitoring, managing, analysing and improving the process performance. However, its has limitations such as lack of engineering, statistical skill and training, and lesser importance of activity. To solve the problems, this study proposes an intelligent SPC system using specified agents which are derived through analysis and evaluation of the SPC activities. The activities investigated by the relevant researches are categorized as collection, process analysis, diagnosis, detection, cause analysis and rule generation. Also, the evaluation criteria are established as feasibility of automation, frequency, level and time. The requirements of the agent functions are derived by the evaluation, and the types of customized agents are as data collection, store, analysis, diagnosis, monitoring, alarm and reporting. A prototype SPC system represents that the functions of the proposed agents are successfully validated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.151-155
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• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.