• Journal of Korean Society for Quality Management
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• v.51 no.4
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• pp.633-642
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• 2023

Purpose: The variation of the internal diameters of gun barrel incurs a lot of reworks in gun barrel manufacturing process and the significant quality problem of gun barrel. And it is likely to stem from the current measurement system for the internal diameter of gun barrel and the related manufacturing process as well. The purpose of this study is to improve the gun barrel manufacturing process through improving measurement system. Methods: The improved measurement system using laser can measure the internal diameters of gun barrel more accurately, and the properly adjusted honing process reduces the variation of internal diameters of gun barrel. Results: Comparing the mean square error of internal diameters for 6 gun barrels measured before and after process improvement shows that the variation of gun barrel internal diameters was significantly reduced after the process improvement. Conclusion: The introduction of improved measurement system for the internal diameters of gun barrel and the adjustment of related honing process results in the reduction of reworks of gun barrels and their internal diameter variations.

• Journal of Advanced Information Technology and Convergence
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• v.8 no.2
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• pp.59-67
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• 2018

The minimum power supply voltage of a typical bandgap current reference (BGCR) is limited by operating temperature and input common mode range (ICMR) of a feedback amplifier. A new BGCR using a bandgap voltage generator (BGVG) is proposed to minimize the effect of temperature, supply voltage, and process variation. The BGVG is designed with proportional to absolute temperature (PTAT) characteristic, and a feedback amplifier is designed with weak-inversion transistors for low voltage operation. It is verified with a $0.18-{\mu}m$ CMOS process with five corners for MOS transistors and three corners for BJTs. The proposed circuit is superior to other reported current references under temperature variation from $-40^{\circ}C$ to $120^{\circ}C$ and power supply variation from 1.2 V to 1.8 V. The total power consumption is $126{\mu}W$ under the conditions that the power supply voltage is 1.2 V, the output current is $10{\mu}A$, and the operating temperature is $20^{\circ}C$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.9
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• pp.882-888
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• 2002

This paper proposed a bias stability circuit that compensates the degradation of MMIC's performance for the variation of the process and temperature. The proposed bias circuit proved the superior effect compared with the conventional bias circuit using the constant current source. It designed and fabricated simultaneously two amplifier on one layout for comparison in same conditions. One is amplifier with conventional bias circuit using constant current source and the other is amplifier with proposed bias stability circuit. The chip was measured the microwave performances under process variation that classed the level NOM, MIN and MAX. The amplifier with a conventional bias circuit using constant current source has 6.4 dB gain variation and 7 mA Ids variation at 1.8 GHz, but the amplifier with the proposed bias circuit has the 2.1 dB gain variation and 3 mA Ids variation. As the result, MMIC having the proposed bias circuit shows the superior compensation of the quiescent point than the MMIC having the conventional bias circuit under the variations of the process and temperature and can improve the yield of the MMIC. The fabricated chip size is 1.2 mm $\times$ 1.4 mm.

• Journal of Korean Society for Quality Management
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• v.24 no.4
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• pp.90-102
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• 1996

Process incapability index which is intended to evaluate the process capability by measuring process incapability provides more detailed information by dividing information about the process mean and variance. But when the target value is not consistent with the center of specification, it is very difficult to evaluate the process capability accurately. Thus it is necessary to improve the existing process incapability index. The improved process incapability index can identify the variation of the process faster than other process capability indices when applied firstly, to the precision process which can be affected sensitively by the change of the process, secondly, to the ordinary process where cost difference from the change of process is noticeable. By using subindices such as inaccuracy index and imprecision index, it is easier for quality manager to find where the cause of the variation of process is, and to take necessary action in advance.

• Proceedings of the Korean Society for Quality Management Conference
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• 2006.11a
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• pp.211-216
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• 2006

Monitoring variability is a vital part of modem statistical process control. The conventional Shewhart Rand S charts address the setting where the in-control process readings have a constant variance. In some settings, however, it is the coefficient of variation, rather than the variance, that should be constant. This paper develops a chart, equivalent to the S chart, for monitoring the coefficient of variation using rational groups of observations.

• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.4
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• pp.292-299
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• 2010

With scaled technology, timing analysis of circuits becomes more and more difficult. In this paper, we review recently developed circuit simulation techniques created to deal with the cost issues of transistor-level simulations. Various techniques for fast SPICE simulations and Monte Carlo simulations are introduced. Moreover, process and aging variation issues are mentioned, along with promising methodologies.

• Journal of the Korean Data and Information Science Society
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• v.14 no.4
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• pp.939-950
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• 2003

Control charts are very useful tool for monitoring of process characteristics. This paper discusses the problem of design of control limits when the subgroups are composed by cluster sampling type. As an alternative method of design of control limits XbBar chart is proposed, which uses the control limits based on the variation between subgroups instead of using classical variation within subgroups. Two examples are presented for reasonable design of control limits and conditions of subgroups based on the cluster sampling. Through examples the guidelines for making proper control limits are proposed.

• Communications for Statistical Applications and Methods
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• v.7 no.3
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• pp.773-788
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• 2000

Statistical process control (SPC) and engineering process control (EPC) are based on different strategies for processes quality improvement. SPC reduces process variability by detecting and eliminating special causes of process variation. while EPC reduces process variability by adjusting compensatory variables to keep the quality variable close to target. Recently there has been needs for a process control proceduce which combines the tow strategies. This paper considers a combined scheme which simultaneously applies SPC and EPC techniques to reduce the variation of a process. The process model under consideration is an integrated moving average(IMA) process with a step shift. The EPC part of the scheme adjusts the process back to target at every fixed monitoring intervals, which is referred to a repeated adjustment scheme. The SPC part of the scheme uses an exponentially weighted moving average(EWMA) of observed deviation from target to detect special causes. A Markov chain model is developed to relate the scheme's expected cost per unit time to the design parameters of he combined control scheme. The expected cost per unit time is composed of off-target cost, adjustment cost, monitoring cost, and false alarm cost.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.4
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• pp.50-56
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• 2011

Injection molding process is one of the popular manufacturing methods to produce plastic parts with high efficiency and low cost. Ball seat for automobile suspension is made by an injection molding process as a part to support pivot function of ball joint consisted of ball stud and housing. It is necessary for a ball seat to have a dimensional stability in the three dimensional inner area to be contacted with ball stud. In this paper, the dimensional stability of inner surface is indirectly analyzed by checking the difference of inner diameter around the circumferential direction and the thickness variation at the top part of ball seat. Measurement was performed by using the coordinate measuring machine and the fixture to hold ball seat. Optimization of injection molding processes such as injection time, cooling time and temperatures of cylinder barrel was derived to reduce the difference of inner diameter and the thickness variation at the top part of ball seat based on the Taguchi method.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.2
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• pp.41-48
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• 2013

Springback is a very typical dimensional discrepancy phenomenon, which occurs usually on the final stamping parts after the tool loading is removed. Variation of springback leads to amplified variations and problems during assembly of the stamped components, in turn, resulting in quality issues. The variations in the properties of the incoming material and process parameters are the main causes of springback variation. In this research, a robust design methodology which combines orthogonal array based experimental design and design space reduction skim to reduce the springback variation for advanced high strength steel parts in sheet metal forming is suggested. The concept of design space reduction is adapted in the experimental design setup to improve the quality of the obtained solution. The effectiveness of the proposed procedures is illustrated through a robust design of springback in metal forming process of a cross member of auto body.