• Journal of the Society of Naval Architects of Korea
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• 제30권2호
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• pp.161-176
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• 1993

For the purpose of assessing structural integrity at a level of complexity and accuracy appropriate for the situation, integrity assessment methods are formulated with the following methods. One is three-tier assessment method of the revised BSI PD 6493 which considers stable crack growth effect, the others are limit load analysis which estimates the plastic collapse load and stability assessment method which considers stable crack growth of ductile material exactly using J-integral and tearing modulus. Besides, integrity assessments for center cracked panel(CCP) specimen and the circumferential through-cracked pipe are carried out and reliability analysis is accomplished by the first order reliability method which is one of the conventional reliability methods. Also the accuracy of the present method is verified by Monte Carlo method.

• Journal of the Microelectronics and Packaging Society
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• 제9권3호
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• pp.31-36
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• 2002

The 2nd level solder joint reliability of 153 FC-BGA for high-speed SRAM (Static Random Access Memory) with the large chip on laminate substrate comparing to PBGA(Plastic Ball Grid Array) was studied in this paper. This work has been done to understand an influence as the mounting with single side or double sides, structure of package, properties of underfill, properties and thickness of substrate and size of solder ball on the thermal cycling test. It was confirmed that thickness of BT(bismaleimide tiazine) substrate increased from 0.95 mm to 1.20 mm and solder joint fatigue life improved about 30% in the underfill with the low young's modulus. And resistance against the solder ball crack became twice with an increase of the solder ball size from 0.76 mm to 0.89 mm in solder joints.

• Polymer(Korea)
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• 제37권5호
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• pp.613-617
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• 2013

The effects of nano size kenaf cellulose fiber on mechanical property of polypropylene (PP) composite were investigated. The addition of nano-kenaf in place of natural kenaf showed higher tensile strength, flexural strength, impact strength, and heat deflection temperature compared to the natural kenaf filled PP composite, while it shows lower melt flow index, elongation%, and flexural modulus. These seemed to be due to the increased surface area of nano-kenaf fiber contacting PP matrix and reduced impurities such as volatile extractives on the fiber surface.

• Magazine of the Korea Concrete Institute
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• 제8권2호
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• pp.119-127
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• 1996

Objection of this study is to present the three-dimensional material nonlinear analysis of reinforced concrete. A concrete is idealized with three-dimensional 16-node solid element including triaxial nonlinear stress-strain behavior, cracking, crushing and strain softening: a steel with three-dimensional 3 node truss element including elastic-plastic behavior with strain hardening. The cracked shear retention factor is introduced to estimate the effective shear modulus con sidering aggregate interlock after c:racking and a modified newton method is used to obtain a nu merical solution. Numerical results in a gauss point is displayed graphically. Numerical examples of Krahl's reinforced concrete beam and Hedgreds shell are selected to compare with the experimental and numerical results.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• 제40권1호
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• pp.1-8
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• 2008

It is essential to use base papers having proper surface characteristics in coating operation for improving coated paper quality and coater runnability. To fulfill these purposes, surface sizing of coating base stock with oxidized starch is commonly practiced. Use of cationic starch for surface sizing improves coated paper quality since cationic starch penetrates less into paper structure. The immediate objective of this study was to examine the influence of surface sizing with starch solutions containing cationic polymers on the rheology of coating colors and the effect on physical properties of coated papers. Changes of rheological characteristics of coating colors placed on the plastic substrate surface sized with cationic and anionic starch were determined. Results of rheological test showed that cationic polymer surface sizing agent increased electrostatic interaction with coating colors and increased storage modulus. This new technology of using cationic polymer as surface sizing additive was considered to be advantageous for base papers at low basis weights since it would improve the coverage and optical properties of coated papers.

• Journal of Mechanical Science and Technology
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• 제20권6호
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• pp.819-827
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• 2006

The stress-strain relation of aluminum (Al) alloy foam cell wall was evaluated by the instrumented sharp indentation method. The indentation in a few micron ranges was performed on the cell wall of Al-alloy foam having a composition or Al-3wt.%Si-2wt.%Cu-2wt.%Mg as well as its precursor (material prior to foaming). To extract the stress-stram relation in terms of yield stress ${\sigma}_y$, strain hardening exponent n and elastic modulus E, the closed-form dimensionless relationships between load-indentation depth curve and elasto-plastic property were used. The tensile properties of precursor material of Al-alloy foam were also measured independently by uni-axial tensile test. In order to verify the validity of the extracted stress-strain relation, it was compared with the results of tensile test and finite element (FE) analysis. A modified cubic-spherical lattice model was proposed to analyze the compressive behavior of the Al-alloy foam. The material parameters extracted by the instrumented nanoindentation method allowed the model to predict the compressive behavior of the Al-alloy foam accurately.

• Transactions of the Korean Society of Mechanical Engineers A
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• 제21권6호
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• International Journal of Reliability and Applications
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• 제17권2호
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• pp.137-147
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• 2016

The engine mount of a car subjected to a pre-load related to the weight of the engine, and acts to insulate the vibration coming from the engine by moving on large or small displacement depending on the driving condition of the car. The vibration insulation of the engine mount is an effect obtained by dissipating the mechanical energy into heat by the viscosity characteristic of the rubber and the microscopic behavior of the additive carbon black. Therefore, dynamic stiffness from the intrinsic properties of rubber filled with carbon black at the design stage is an important design consideration. In this paper, we introduced a hyper-elastic, visco-elastic and elasto-plastic model to predict the dynamic characteristics of rubber, and developed a fitting program to determine the material model parameters using MATLAB. The dynamic characteristics analysis of the rubber insulator of the ACTIVE MOUNT was carried out by using MSC.MARC nonlinear structural analysis software, which provides the dynamic characteristics material model. The analysis results were compared with the dynamic characteristics test results of the rubber insulator, which is one of the active mount components, and the analysis results were confirmed to be valid.

• Journal of Surface Science and Engineering
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• 제54권3호
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• pp.139-143
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• 2021

Cr-Al-N coatings were deposited onto WC-Co substrates using a cathodic arc evaporation (CAE) system. CAE technique is recognized to be a very useful process for hard coatings because it has many advantages such as high packing density and good adhesion to metallic substrates. In this study, the influence of deposition temperature as a key process parameter on film growth behavior and mechanical properties of Cr-Al-N coatings were systematically investigated and correlated with microstructural changes. From various analyses, the Cr-Al-N coatings prepared at deposition temperature of 450℃ in the CAE process showed excellent mechanical properties with higher deposition rate. The Cr-Al-N coatings with deposition temperature around 450℃ exhibited the highest hardness of about 35 GPa and elastic modulus of 442 GPa. The resistance to elastic strain to failure (H/E ratio) and the index of plastic deformation (H³/E² ratio) were also good values of 0.079 and 0.221 GPa, respectively, at the deposition temperature of 450℃. Based on the XRD, SEM and TEM analyses, the Cr-Al-N coatings exhibited a dense columnar structure with f.c.c. (Cr,Al)N multi-oriented phases in which crystallites showed irregular shapes (50~100nm in size) with many edge dislocations and lattice mismatches.

• Journal of Hydrogen and New Energy
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• 제33권5호
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• pp.566-573
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• 2022

In this study, the mechanical properties of the polymer electrolyte membrane according to the temperature were studied. The test specimens of polymer electrolyte membrane were heat treated at 40℃, 60℃, 80℃, 100℃, and 120℃, and then the tensile tests were performed. As results of this study, the residual stress of the polymer electrolyte membrane was removes by the heat treatment and the elastic modulus decreased due to the decrease in internal energy. In addition, in the plastic region, the mechanical properties and crystallization rate of the polymer electrolyte membrane increased in proportion according to increase of the heat treatment temperature.