• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.87-90
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• 2002

For the broad band wireless communications system, the composition of the millimeter wave system is needed. In other to commercialize that system, satisfaction of high frequency characteristic and low cost process is required. In this study, BPF which is very sensitive to the characteristic of fine line designed and fabricated using photoimageable thick film technology.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.1
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• pp.17-21
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• 2019

In this paper, a high precision straightness measurement system has been developed at low cost using a visible laser and CMOS image sensor. CMOS image sensor detected optical image and the variation of straightness was calculated by image processing. We have observed that the error of the developed straightness measurement system was 0.9% when a distance of 3m between laser and image sensor. And it can be applied to 3D printer and any other areas.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.55-60
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• 2001

RF MEMS is an exciting emerging technology that has great potential to develop TOC (Transceiver-on-Chip). Applications of the RF MEMS to wireless communications systems are presented. The ability of the RF MEMS technology to enhance the performance and to reduce the size of passive components, in particular, switches, inductors, and tunable capacitors, is addressed. A number of potential wireless system opportunities for the TOC are awaiting the maturation of the RF MEMS technology.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.7-12
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• 2000

Copper-based leadframe sheets were oxidized in a black-oxide forming solution, and molded with epoxy molding compound (EMC) to form sandwiched double-cantilever beam (SDCB) specimens. The adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using SDCB specimens and the fracture surfaces were analyzed by various equipments such as glancing-angle XRD, AFM, and SEM. Results showed that three types of failure paths, which were closely related to the surface condition of leadframes before molding.

• The monthly packaging world
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• s.245
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• pp.113-121
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• 2013

GHS는 화학물질의 분류 표시에 대한 세계조화시스템(Globally Harmonized System of Classification and Labelling of Chemicals)으로 동일한 화학물질에 대해 국제적으로 동일한 유해 위험성 분류 표시를 하기 위한 새로운 규정이다. 화학물질의 분류 표시는 화학물질이 갖는 여러 가지 유해성, 위험성을 적절히 판별하고, 그 정도에 따라 분류한 다음, 가장 이해하기 쉬운 형태로 표시하는 것이 그 목적이며 올바른 정보제공을 통한 안전관리를 강화하고 국제적인 조화를 통하여 화학물질의 적정 평가 및 국제적 교역을 증대하고자 하는데 있다. 본 고에서는 유독물 등의 분류기준 및 표시방법에 관한 규정과 유독물의 표시규격에 대해 살펴보도록 한다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.183-199
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• 2002

Reliability.The reliability strongly depended on the CTE of underfill resin..The fractured portion was identical with the maximum plastic equivalent strain..1 % or less value of the maximum plastic equivalent strain certified more than 1000 cycle of TCT life. UFB.Bonding accuracy was confirmed within2$2{\mu}{\textrm}{m}$..The fundamental bondability of UFB was confirmed with no damage around aluminum pads. Some dislocations and vacancies were observed at the interface, however, the atomic level bonding was confirmed. CBB.Dry process was applied to UBM removal.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.27-36
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• 1998

통신시스템의 고발열 전자부품 냉각을 위해 3종류의 써모싸이폰을 각각의 용도에 따라 개 발하였으며 그 각각의 설계변수에 대한 냉각특성을 실험적으로 구하였다. TS-I에서는 증발부 내부 에 금속스크린 메쉬형심지를 삽입함으로써 시간에 따른 온도 변화를 작게 하여 냉각성능 안정성을 확보하였고, TS-II에서는 9W/cm2의 높은 냉각성능을 가진 루프형 써모사이폰을 개발하였으며 TS-III에서는 작동유체의 종류, 파이프개수 와이어 삽입여부등 써모사이폰의 주요 설계변수에 따 른 냉각특성을 구하였다.

• Journal of the Microelectronics and Packaging Society
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• v.4 no.1
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• pp.31-38
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• 1997

대용량, 고속정보처리가 요구되는 B-ISDN용 스위칭 모듈은 90년초부터 MCM으로 제작후 사용되어 왔다. 특히 MCM은 Data 처리의 고속성 및 회로의 고집적이 요구되는 ATM, GPS 및 개인휴대 통신 분야에 광범위하게 개발 및 응용되고 있다. 따라서 본논문에 서는 고속, 고집적 ATM 교환기의 Switching Module을 제품의 Low Cost와 다충회로를 간 단하게 구현할수 있는"Diffusion patterning"(이하 DP)공정과 기보유중인 Thin Film 공정으 로 MCM을 구현하였다.CM을 구현하였다.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.1-5
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• 2012

Long-term reliability of Si photovoltaic modules is a crucial issue for the cost-reduction on the power-supply system. To elevate this reliability, several environmental tests have been created as qualification and certification procedures. This paper gives an overview about recent researches of reliability tests for Si photovoltaic modules.

• Resources Recycling
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• v.8 no.2
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• pp.46-61
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• 1999