Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Failure Paths Analyses of the Leadframe/EMC System

  • Lee, H.Y. (Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, S.R. (Senior Scientist, Polymeric Materials Gr., Sam Yang Central R&D Center)
  • Published : 2000.06.01
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Abstract

Copper-based leadframe sheets were oxidized in a black-oxide forming solution, and molded with epoxy molding compound (EMC) to form sandwiched double-cantilever beam (SDCB) specimens. The adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using SDCB specimens and the fracture surfaces were analyzed by various equipments such as glancing-angle XRD, AFM, and SEM. Results showed that three types of failure paths, which were closely related to the surface condition of leadframes before molding.

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