• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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• pp.1-19
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• 2003

The electronic market thrust for many hybrid circuit manufacturers is changing because commercial market segments such as telecommunications, automotive and consumer electronics have increased the demand world wide for environmentally friendly thick film products. This, in turn, places a stronger emphasis on the material suppliers within the circuit fabrication industry to provide toxin free products with equal or higher performance than traditional technology. A new group of silver based thick film conductors, which are totally free of such toxins as cadmium, nickel and Bead have been developed to meet new environmental requirements. Traditional thick film products and newly developed toxin free compositions will be compared and data will be presented. To evaluate their performance, both groups of conductors were tested for solder acceptance, leach resistance and aged adhesion with standard lead-containing solder and higher temperature lead-free solder.

• Food Science and Biotechnology
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• 제16권6호
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• pp.889-893
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• 2007

The demand of quality green banana chips is increasing in the world snacks market, therefore, the preparation of quality chips and their subsequent shelf life in packaging were evaluated in this study. Banana slices were fried in hot oil to the desired moisture content (2-3%) and oil content (40%) in chips at 3 different temperatures, and the impact of different pretreatments were compared by sensory assessment. A linear relationship between time and temperature was used to achieve the optimal processing conditions. Banana slices fried at the lower temperature of $145^{\circ}C$ took longer to reach the desired chip qualities, but gave the best results in terms of color and texture. Blanching was the most effective pre-treatment for retaining the light yellow color in finished chips. For extending the shelf life of chips, moisture proof packaging in double layer high density polyethylene was more effective than single layer low density polyethylene.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• 산업식품공학
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• 제14권4호
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• pp.283-291
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• 2010

Currently, nanotechnology is widely applied in various industrial fields and is rapidly emerging as a promising future technology. In food industries, nanotechnology is used to enhance food quality and safety. Numerous cutting-edge studies on the advantages of nanotechnology have been conducted in the fields of food processing, food ingredients and additives, food packaging, and food engineering for optimal health. The market for these areas of research has grown steadily, and is expected to continue to do so. Because of this, R&D for nanotechnology that can be used effectively in food industries is being performed by several companies, as well as in academic research institutions around the world. This review describes the recent global R&D trends that have been in progress for two key areas: food processing and food packaging.

• 마이크로전자및패키징학회지
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• 제23권1호
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• pp.1-10
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• 2016

Nowadays, the importance of role of the international standardization keeps increasing substantially. We have already known that international standards have a huge impact on many companies, industries and nations. So far, it has been thought that standardizations are needed after the new products come into the market and are mass-produced in order to encourage the use of the products, systems and services. Standardization will make the products more safe, efficient, and environmentally friendly for the users. However, in these days, a paradigm of the standardization has been changed. International standard becomes a tool for dominating global market and is the most important ingredients of the competitiveness and economic progress of the nation and enterprises. Many countries like Japan, Germany and U.S. use the standardization as an effective method to dominate the market and monopolized the new technologies. Therefore, worldwide competition for the standardization of the new technology become fierce. Korea is leading the technology in semiconductor field. However, activities of international standardization are not sufficient. In order to boost the standardization activities in Korea from industry, academia, and research institute, this paper briefly introduce the international standard organization and some critical issues for next-generation semiconductor memory such as flexible semiconductor, automobile semiconductor and wearable devices.

• 유통과학연구
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• 제10권9호
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• pp.13-21
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• 2012

Purpose - Korean traditional markets are falling behind the times, because they have not met the demands of social changes including: an overall improvement in standards of living, shift in purchasing form and propagation of cars. It is one of the most indigenous and conventional foods of Korea, taking a seat far in the corner of Korean traditional culture. Research design / data / methodology - Korean traditional rice cakes however have their limits. They are produced and sold by independent shop owners who cannot compete with the brand power of franchise organizations. The leadership of adminstration is needed for these shop owners particularly in visual merchandising related to interior design and display. Results - Additionally, the advent of major company-run rice cake cafe adds fresh fuel to the problem in addition to small but luxurious packaging. Small business owners need packaging technology for overall quality improvement of sales of rice cakes. Additional help is needed with the mode of packing to promote sales and win consumer confidence. Conclusions - Further assistance with marketing for seasonal displays is needed as well as teaching business owners how to read graphic data. Regular specialized education for visual merchandising of rice cakes could help independent market owners win the competition against franchise-based organizations.

• 마이크로전자및패키징학회지
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• 제27권2호
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• pp.1-10
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• 2020

The technology and market size of image sensors continue to develop thanks to the release of image sensors that exceed 100 million pixels in 2019 and expansion of black box camera markets for vehicles in addition to existing mobile applications. We review the technology flow of image sensors that have been constantly evolving for 40 years since Hitachi launched a 200,000-pixel image sensor in 1979. Although CCD has made inroads into image sensor market for a while based on good picture quality, CMOS image sensor (CIS) with active pixels has made inroads into the market as semiconductor technology continues to develop, since the electrons generated by the incident light are converted to the electric signals in the pixel, and the power consumption is low. CIS image sensors with superior characteristics such as high resolution, high sensitivity, low power consumption, low noise and vivid color continue to be released as the new technologies are incorporated. At present, new types of structures such as Backside Illumination and Isolation Cell have been adopted, with better sensitivity and high S/N ratio. In the future, new photoconductive materials are expected to be adopted as a light absorption part in place of the pn junction.

• 한국펄프종이공학회:학술대회논문집
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• 한국펄프종이공학회 2004년도 춘계학술발표논문집
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• pp.40-48
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• 2004

Paper tube industry for synthetic fiber packaging has approximately 200 billion won of market size in Korea, while any significant research has not done yet about physical characteristics of paper tubes. This study was conducted to find out a adequate structure of paper tubes by changing compositions of paperboards, size of tubes, and makers. Parallel compression strength was not only rely on compositions of paperboards, but also largely impacted by structural design of paper tubes.

• 월간포장계
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• 통권217호
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• pp.57-67
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• 2011

바이오 플라스틱 원료 및 이를 이용한 에코 패키징이라는 분야에 대한 그 동안 기초적인 연구에 치중해 온 것이 사실이나 이를 바탕으로 최근에는 산업 생산에 적용, 즉 실용화 단계에 접어들었다. 이러한 사실은 앞으로 기술 개발 속도가 매우 빨라지고 이를 직접적으로 제품에 적용하여 매출로 연결될 수 있다는 점에서 매우 중요한 기술적 진보를 이루고 있다고 볼 수 있으며, 기술 개발의 큰 추세는 감량, 재활용, 재사용, 생분해성 소재 및 바이오매스 사용이다.

• 월간포장계
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• 통권217호
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• pp.68-79
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• 2011

국내 및 해외의 환경인식 변화, 환경 규제 등으로 인하여 바이오 폴리머 경쟁력 강화 요인이 증가되는 가운데, 석유계 플라스틱의 대체가 가능하게 되어 틈새시장을 중심으로 제품 적용이 확대되고 있는 추세이다. '저탄소 문제'가 21세기 들어 전세계적으로 환경문제의 핵심과제로 등장함에 따라 바이오매스(Biomass)를 원료로 하여 제조되는 바이오 플라스틱의 적용분야가 급속하게 확대되고 있다. 바이오매스를 이용해 만든 바이오 플라스틱은 최근 들어 대표적인 친환경 소재로 꼽히고 있다. 사용 후 폐기시 이산화탄소 및 인해 유해물질 발생가능성이 있는, PVC, 비닐, 스티로폼 등 화학플라스틱을 대체하여 제품화되고 있다.