• Proceedings of the KWS Conference
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• 2006.05a
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• pp.206-208
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• 2006

The reliability of BGA (ball grid array) package with OSP (organic surface preservative) surface finish under thermal cycle was investigated by using SEM (scanning electron microscopy), EDS(energy dispersive spectroscopy), image tool and ball shear test. The IMCs (intermetallic compounds) were increased with increasing number of thermal cycles. However, the shear strengths of solder ball were decreased with increasing number of thermal cycles. The order of solders which had the highest shear strength as follow: Sn-3.5wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, Sn-37wt%Pb.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.7
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• pp.351-363
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• 2001

This paper presents an experimental investigation on the heat trensfer characteristic of micro pipe (MHP) array with 38 triangular microgrooves. A heat pipe is an effective heat exchanger operating without external power. The heat pipe transfers heat by means of the latent heat of vaporization and two-phase fluid flow driven by the capillary force. The overall size of the MHP array can be put undermeath a microelectonic die and integrated into the electrronic package of a microelectronin device to dissipate the heat from the die. The MHP array is fabricated by micromachining with a silicon wafer and a glass substrate. The MHP was filled with water and sealed. The experimental results show the temperature decrease of 12.1$^{\circ}C$ at the evaporator section for the input power of 5.9 W and the improvement of 28% in the heat transfer rate.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.193-195
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• 2003

Micro-structure and shear properties with reflow conditions, reflow temperature and time, for In-48Sn solder on BGA package were examined at the temperature between 140 and 170$^{\circ}C$ for 10 to 3600sec. With increasing reflow temperature and time, the thickness of intermetallic compound formed between solder and pad increased. Shear test indicated shear force increased in the range to a critical value of reflow time, and decreased over a critical reflow time. With increasing reflow temperature and time, the crater occurred on fracture surface because of a increase of crater by voids and IMC particles precipitated in solder.

• Transactions of the Korean Society of Automotive Engineers
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• v.8 no.3
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• pp.139-150
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• 2000

Although a number of neck injuries are generated, the data which quantify the kinematic response of the human head and cervical spine in low-speed rear-end automobile collisions is very limited. On this problem, just few in vitro experimental research or some experimental research using dummy on neck injury by rear-end collision was conducted, thus systematic research is requested on full scale injury mechanism. An occupant model for the response of the occupant subject to rear-end collision using commercial dynamics package DADS was developed. Developed model shows more close agreement with the experimental data compared with the MADYMO simulation results for the cases of ${\delta}V=16$ kph in sled test. For the case of ${\delta}V=8$ kph and 33.5 kph with production seat, model also shows its reliable response compared with experimental results using Hybrid III and Hybird III with RID.

• Proceedings of the KIEE Conference
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• 1995.07b
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• pp.840-842
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• 1995

It is very important to understand the 3-dimensional movement of a robot manipulator in developing a robot manipulator system. The robot design software package is required to test the specification. Usually these robot simulators are turn-key based and not possible to be used on the other robot system. The aim of this paper is to develop a general purpose robot simulator. AutoCad is selected for the developing environment to avoid the difficulties of building a cad system from the scratch. Because Autocad provides a semi-open structure to a Lisp programmer, it is quite successful to achieve the goal of building the simulator. At the moment the kinematic analysis is possible on the package. Further study will be advanced to the application and analysis of dynamic area, which would not be that difficult to be implemented, considering the many third party tools available for Autocad.

• Computers and Concrete
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• v.9 no.4
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• pp.293-310
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• 2012

This paper discusses a new constitutive model called the high-rate brittle microplane (HRBM) model and also presents the details of a new software package called the Virtual Materials Laboratory (VML). The VML software package was developed to address the challenges of fitting complex material models such as the HRBM model to material property test data and to study the behavior of those models under a wide variety of stress- and strain-paths. VML employs Continuous Evolutionary Algorithms (CEA) in conjunction with gradient search methods to create automatic fitting algorithms to determine constitutive model parameters. The VML code is used to fit the new HRBM model to a well-characterized conventional strength concrete called WES5000. Finally, the ability of the new HRBM model to provide high-fidelity simulations of material property experiments is demonstrated by comparing HRBM simulations to laboratory material property data.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.203-207
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• 2002

CSP(Chip Size Packaging) SAW Filter Package에 대해서, 유한요소해석(Finite Element Analysis) 컴퓨터 Simulation 프로그램인 ANSYS를 이용하여 Package의 온도 분포를 해석하였다. 신뢰성(reliability) Test 조건에서 Transient Thermal Simulation을 한 후, 조건을 변화시켜 가면서 Chip 내부 온도가 어떻게 변화하는지 알아보았다. Chip에 1.8 hour 동안 4W의 열원을 주고, 주위는 2$0^{\circ}C$ 자연대류로 놓고 Transient Thermal Simulation한 결과는 약 99$^{\circ}C$로, 허용 가능한 온도인 11$0^{\circ}C$보다 약 11$^{\circ}C$ 낮음을 알 수 있었다. 또한 이는 실험값인 약 95$^{\circ}C$와 유사한 값을 나타내었다.

• Journal of the Korean Society for Precision Engineering
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• v.9 no.4
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• pp.13-21
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• 1992

Standards concerning the determination of positioning accuracy and repeatability of numerically controlled(NC) machine tools have been published relentlessly over the last 20 years. Since the publication in 1988 of the International Standard 230-2 there has been a pronounced move, both at national and international standards level, to embrace further test procedures for a complete machine tool performance assessment. For example, measurements of angular (pitch, roll, and yaw) and straightness errors along linear axes are now commonplace and complement the existing positioning accuracy and repeatablity tests. More recently the subject of circularity evalutaion has also gained considerable interest. Here dynamic tests, using a kinematic ballbar or circular masterpiece, give an instant overview of the contouring ability of the machine in two axes at specific feedrates. This information is extremely important in optimising machining accuracy. This paper describes moves to complete the machine calibration package in national and international standardis- ation for the assessment of machine tool performance.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1714-1719
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• 2003

Antilock Brake System (ABS) is indispensable safety equipment for vehicles today. In order to develop new ABS ECU suitable for pneumatic brake system of a bus, a Hardware In-the-Loop Simulation (HILS) System was developed. In this HILS, the pneumatic brake system of a bus and antilock brake component were used as hardware. For the computer simulation, the 14-Degree of Freedom (DOF) bus dynamic model was constructed using the Matlab/Simulink software package. This model was compiled and downloaded in the simulation board, where the Power PC processor was used for real-time simulation. Additional commercial package, the ControlDesk was used to monitor the dynamic simulation results and physical signal values. This paper will focus on the procedure and results of evaluating the ECU in the HILS simulation. Two representative cases, wet basalt road and $split-{\mu}$ road, were used to simulate real road conditions. At each simulated road, the vehicle was driven and stopped under the help of the developed ECU. In each simulation, the dynamical behavior of the vehicle was monitored. After enough tests in the laboratory using HILS, the parameter-tuned ECU was equipped in a real bus, which was driven and stopped in the real test field in Korea. And finally, the experiment results of ABS equipped vehicle's dynamic behavior both in HILS test and in test fields were compared.

• KIISE Transactions on Computing Practices
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• v.21 no.10
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• pp.645-650
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• 2015

Tester Interface Software (TIS) provides all software functions that are necessary for a testing device to perform the test process on a memory semiconductor package from the time the device is put into the test equipment until the device is discharged from the equipment. TIS should perform the same work over all types of equipment regardless of their tester models. However, TIS has been developed and managed independently of the tester models because there are various equipment and computer models that are used in the test process. Therefore, more maintenance, time and cost are required for development, which adversely affects the quality of the software, and the problem becomes more serious when the new tester model is introduced. In this paper, we propose the Cross-platform Tester Interface Software (CTIS) framework, which can be integrated and operated on heterogeneous equipment and OSs.