• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.10-14
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• 2019

In this study, we synthesized two $Y_3Al_5O_{12}:Ce^{3+}$ phosphors ($7{\mu}m$-sized and $2{\mu}m$-sized YAG) with different sizes by controlling particles sizes of starting materials of the phosphors for white LED. In the smaller one ($2{\mu}m$-sized YAG), its photoluminescence intensity in the reflective mode was 63 % that of the bigger one ($7{\mu}m$-sized YAG); the quantum efficiencies were 93 % and 70 % for the smaller and the bigger ones. Two kinds of white LED packages with the same color coordinates were fabricated with a blue package (chip size $53{\times}30$) and two phosphors. The luminous flux of the white LED package with the smaller YAG phosphor was 92 % of that with the bigger one, indicating that the quantum efficiency of phosphor dispersed inside LED package was higher than that of the pure powder. It was consistently confirmed by the optical simulation (LightTools 6.3). It is notable according to the optical simulation that the white LED with the smaller phosphor showed 24 % higher luminous efficiency. If the smaller one had the same quantum efficiency as the bigger one (~93 %). Therefore, it can be suggested that the higher luminous efficiency of white LED can be possible by reducing the particle size of the phosphor along with maintaining its similar quantum efficiency.

• Design Convergence Study
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• v.15 no.4
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• pp.17-29
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• 2016

Over-the-counter pharmaceuticals sold in convenience stores are accurate and easy to understand on its containers, packaging, or attached materials for the prevention of drug misuse. The limited space of the packaging, however, makes the information difficult to read and consequently, consumers have had difficulty in purchasing the products. This research conducted an analysis of 8 packages of pill-type drugs and conducted a survey and interviews targeting 10 foreigners and 20 Korean consumers to analyze the user consciousness. The findings of this study showed that fever remedies are the most frequently bought drug. And consumers first looked for the information of the drugs in the following order: the effects, dosage, and warnings. While domestic consumers had little difficulty in comprehending the information, more than 40% of the foreigners who were studies failed to comprehend it, which was because the package was entirely written in Korean. This study presented some ideas for improving the design by using English and foreign expressions and pictograms, consumers can easily and quickly understand, and by placing the information on the symptoms, dosage and age information so that the type of drugs will be easily discernible.

• Journal of Bio-Environment Control
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• v.18 no.4
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• pp.475-480
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• 2009

These studies were carried out to find the effect of packing materials and storage temperature to enhance the storability of Salicornia europaea. The fresh weight loss was less than 2% at below $10^{\circ}C$ and non-perforated package, but $25^{\circ}C$ and perforated package treatment showed more than 4% of fresh weight loss that result to deteriorate quality. The carbon dioxide and oxygen contents remained 1~2% and above 15% in non-perforated package, and these contents were in proportion to gas permeability of packing materials. All the temperature treatments except 25c showed rapidly increasing ethylene concent from 7days after storage, and the highest ethylene content was $2^{\circ}C$ treatment that should appear chilling injury. The off-odor and deterioration ratio were lowest in $5^{\circ}C$ among the temperature treatments and $50{\mu}m$ thickness ceramic film treatment at $5^{\circ}C$ storage, while packing materials did not show any trends among the temperature treatments. The shelf life based on visual quality showed highest in $50{\ss}|$ thickness ceramic film packing and $5^{\circ}C$ treatment, and that was 28days.

• Journal of the Korean Ceramic Society
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• v.53 no.3
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• pp.263-272
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• 2016

Electronic structure calculations have become a powerful foundation for computational materials engineering. Four major factors have enabled this unprecedented evolution, namely (i) the development of density functional theory (DFT), (ii) the creation of highly efficient computer programs to solve the Kohn-Sham equations, (iii) the integration of these programs into productivity-oriented computational environments, and (iv) the phenomenal increase of computing power. In this context, we describe recent applications of the Vienna Ab-initio Simulation Package (VASP) within the MedeA$^{(R)}$ computational environment, which provides interoperability with a comprehensive range of modeling and simulation tools. The focus is on technological applications including microelectronic materials, Li-ion batteries, high-performance ceramics, silicon carbide, and Zr alloys for nuclear power generation. A discussion of current trends including high-throughput calculations concludes this article.

• Journal of the Korean Society for Advanced Composite Structures
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• v.6 no.1
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• pp.45-50
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• 2015

This study performed a finite element crash analysis of support structures made of various composite materials for road facilities. The effects of different material properties of composites for various parameters are studied using the finite element commercial package for this study. In this study, the existing finite element analysis of composite post structures using the LS-DYNA program is further extended to compare dynamic behaviors against car crash of the structures made of various composite materials. The several numerical examples show the comparison of the nonlinear dynamic effects for different materials.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1529-1530
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• 2007

The manganese co-doped $Ca_8Mg_1(SiO_4)_4Cl_2:Eu^{2+}$,$Mn^{2+}$ phosphor was synthesized by solid-state reaction and its photoluminescence characteristics were investigated. The synthesized phosphor show two emission spetrums: green band of 512nm and yellow band of 550nm. White light-emitting diodes (LEDs) were fabricated through combination of a 405nm-emitting InGaN chip and a synthesis phosphor in a single package. Under 20mA current, its CIE chromaticity coordinates are x=0.40 and y=0.45 and a color temperature of 4053K.

• Transactions on Electrical and Electronic Materials
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• v.9 no.1
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• pp.33-37
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• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

• Nuclear Engineering and Technology
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• v.53 no.6
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• pp.1878-1886
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• 2021

For industrial package (IP)-type transport containers for radioactive materials, a free drop test should be conducted under regulatory conditions. Owing to various uncertainties observed during the drop test, errors in drop angles inevitably occur. In IP-type metal transport containers in which the container directly impacts onto a rigid target without any shock absorbing materials, the error in the drop angle due to a slight misalignment makes a significant difference from the ideal drop. In particular, in a vertical drop, the error in the drop angle causes a strong secondary impact. In this paper, a numerical method is proposed to estimate the error in the drop angle occurring during the test. To determine this error, an optimization method accompanying a computational drop analysis is proposed, and a surrogate model is introduced to ensure calculation efficiency. Effectiveness of the proposed method is validated by performing the verification and comparison between the test and the analysis applied with the drop angle error.