• Journal of Sensor Science and Technology
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• v.1 no.1
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• pp.5-12
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• 1992

We have fabricated a-Si:H multilayer for contact-type linear image sensor by means of RF glow discharge decomposition method. The ITO/i-a-Si:H/Al structure has relatively high dark current due to indium diffusion and carrier injection from both electrodes, resulting in low photocurrent to dark current. To suppress the dark current and to enhance interface electric field between ITO and i-a-Si:H film we have fabricated ITO/insulator/i-a-S:H/p-a-S:H/Al multilayer film with blocking structure. The photocurrent of ITO/$SiO_{2}(300{\AA})$/i-a-Si:H/p-a-Si:H($1500{\AA}$)/Al multilayer sensor with 5V bias voltage became saturated at about 20nA under $20{\mu}W/cm^{2}$ light intensity, while the dark current was less than 0.1nA. To increase the light generation efficiency we have adopted ITO/$SiO_{x}N_{y}(300{\AA})$/i-a-Si:H/p-a-Si:H($1500{\AA}$)/Al structure, showing photocurrent of 30nA and dark current of 0.08nA with 5V bias voltage. Also the spectral photosensitivity of the multilayer was enhanced for short wavelength visible region of 560nm, compared with that of the a-Si:H monolayer of 630nm. And its photoresponse time was about 0.3msec with the film homogeneity of 5% deviation.

• Journal of Powder Materials
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• v.4 no.1
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• pp.26-41
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• 1997

The powder metallurgy (P/M) processed 2009 and 2124 Al composites reinforced with SiC particulates were studied by focusing on the effect of consolidation temperature on the microstructural and mechanical Properties. The mechanical properties such as tensile properties and microhardness of the second phases were analysed in relation to the microstructures observed by a SEM and an optical microscope. The in situ fracture process study using SEM showed that the grain refinement and the removal of manganese-containing particles often observed in the 2124 Al-${SiC}_{p}$ composites were important for the improvement of the mechanical properties. This study offers an optimum consolidation temperature for the control of the manganese-containing particles in the 2124 Al-${SiC}_{p}$ composites that yields mechanical properties higher than those of the 2009 Al-${SiC}_{p}$ composites.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.26-35
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• 2024

Aluminum-induced crystallization (AIC) as a route to reduce the fabrication cost and to obtain polycrystalline Si (p-Si) thin-film of large grain size is a promising alternative of single-crystalline (s-Si) substrate or p-Si thin-film obtained by conventional methods such as solid phase crystallization (SPC) and laser-induced crystallization (LIC). As the AIC process occurs at the interface between a-Si and Al thin-films, there are various process and interface parameters. Also, it directly means that there is a certain parametric window to obtain p-Si of large grain size having uniform crystal orientation. In this article, we investigate the effect of the various process and interface parameters to obtain p-Si of large grain size and uniform crystal orientation from the literature review. We also suggest the potential use of the p-Si as a virtual substrate for the growth of various compound semiconductors in a form of low-dimension as well as thin-film as a way for their monolithic integration on Si.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.259-262
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.32-32
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• 2009

실리콘 박막 태양전지에서 전면 투명전도막(TCO)은 태양전지의 전기, 광학적 특성을 결정하는 중요한 기능을 한다. ZnO:Al TCO는 기존에 사용되던 $SnO_2:F$와는 비정질 실리콘(a-Si:H) 박막 태양전지의 윈도우 층으로 사용되는 p a-SiC:H와의 일함수(work function) 차이로 인해 접촉전위(contact barrier)를 형성하게 되며 이로 인해 태양전지의 충진율(fill factor)이 $SnO_2:F$에 비해 감소하는 단점을 보인다. 본 연구에서는 ZnO:Al/p a-SiC:H 계면의 접촉전위 발생원인 및 태양전지 충진율 감소현상에 관한 정확한 원인규명을 위해 다양한 특성을 갖는 버퍼층을 삽입하여 계면특성 및 태양전지의 동작특성을 분석하고자 한다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.6
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• pp.1581-1584
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• 2008

In dual-polycide-gate structure with butting contact, net doping concentration of polysilicon was decreased due to overlap between $n^+$ and $p^+$ and lateral dopant diffusion in silicide/polysilicon layers. The generation of parasitic Schottky diode in butting contact region is attributed both to the $CoSi_2$-loss due to $CoSi_2$ agglomeration and to the decrease in net doping concentration of polysilicon layer. Parasitic Schottky diode reduces noise margin of sense amplifier in DDI DRAM, which causes column fail. The column fail could be reduced by physical isolation of $n^+/p^+$ polysilicon junction or suppressing $CoSi_2$ agglomeration by using nitrogen implantation into $p^+$ polysilicon before $CoSi_2$ formation.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.128.2-128.2
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• 2011

스테인레스 스틸 유연기판 위에 플라즈마 화학기상 증착법 (plasma enhanced chemical vapor deposition)을 이용하여 nip 구조의 미세결정질 실리콘 박막 태양전지 (microcrystalline silicon thin film solar cell)를 제조하고 i ${\mu}c$-Si:H광 흡수층과 p ${\mu}c$-Si:H 사이에 i a-Si:H 버퍼 층을 삽입하여 i/p 계면특성을 개선하고 이에 따른 태양전지 성능특성 변화를 조사하였다. ${\mu}c$-Si:H 박막으로 이루어진 i/p 계면에서의 구조적, 전기적 결함은 태양전지 내에서 생성된 캐리어의 재결합과 shunt resistance 감소를 초래하여 개방전압 (open circuit voltage) 및 곡선 인자 (fill factor)를 감소시키는 것으로 알려졌다. 제조된 미세결정질 실리콘 박막 태양전지는 SUS/Ag/ZnO:Al/n ${\mu}c$-Si:H/i ${\mu}c$-Si:H/p ${\mu}c$-Si:H 구조로 제작되었으며 i/p 계면 사이의 i a-Si;H 버퍼층 두께를 변화시키고 이에 따른 태양전지의 특성을 조사하였다. 태양전지의 구조적, 전기적 특성 변화는 Scanning Electron Microscope (SEM), UV-visible-nIR spectrometry, Photo IV와 Dark IV를 통하여 조사하였다.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.31-31
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• 2009

PECVD를 이용하여 제조된 미세결정질 p-i-n 실리콘 박막 태양전지에서, p 층은 태양전지의 윈도우 역할 및 그 위에 증착될 i ${\mu}c-Si:H$ 층의 'seed'층 역할을 수행하기 때문에, p층의 구조적 및 전기적, 광학적 특성은 태양전지의 전체 성능에 큰 영향을 미칠 수 있다. 본 연구에서는 $SiH_4$ 농도를 변화시켜 각기 다른 결정 특성을 갖는 p ${\mu}c-Si:H$층을 제조하고 그 위에 i ${\mu}c-Si:H$ 층을 증착하여 p층의 결정 특성변화와 그에 따른 i ${\mu}c-Si:H$ 층 및 'superstrate' p-i-n 미세결정질 실리콘 박막 태양전지의 특성 변화를 조사하였다. P층의 경우, $SiH_4$ 농도가 증가함에 따라 결정분율 (Xc)이 감소하여 비정질화되었으며 그에 따라 dark conductivity가 감소하는 경향을 나타내었다. 각기 다른 결정분율을 가지는 p 'seed' 층 위에 증착된 태양전지는, p 'seed' 층의 결정분율이 증가함에 따라 개방전압, 곡선인자, 변환효율이 경향적으로 감소하였다. 이는 p 층 결정분율 변화에 따른 p/i 계면특성 저하 및 그 위에 증착되는 i ${\mu}c-Si:H$ 층의 결함밀도 증가 등에 따른 태양전지 특성 감소 때문인 것으로 판단되며, 이를 분석하기 위하여 i ${\mu}c-Si:H$ 층의 전기적, 구조적 특성 분석 및 태양전지의 dark I-V 특성 등을 분석하고자 한다.

• Journal of Korea Foundry Society
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• v.17 no.4
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• pp.347-355
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• 1997

It is well known that the coarse primary Si in hypereutectic Al-Si alloys deteriorate castability, machinability, and mechanical properties. So, many treatment has been tried to refine the primary Si increasing cooling rate and adding refinement agent. Therefore. the purpose of our work was the observation of the effect on the refinement of primary Si and the analysis of the trend to apply to the casting process by changing the amount of P addition and the cooling rate while fixing the temperature at $750^{\circ}C$ of P addition and the type of AlCuP. In the condition of amount of P addition was fixed, primary Si was finer as cooling rate increased but in case of cooling rate was fixed, the effect of refinement was resisted as incersed the amount of P addition. At a relatively slow cooling rate of $22^{\circ}C/sec$, refinement was governed by the amount of P addition rather than cooling rate. At elevated cooling rate of $51^{\circ}C/sec$ and $99^{\circ}C/sec$, the undercooling due to faster cooling rate promoted nucleation of primary Si rather than P addition more significantly.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.773-776
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• 2003

In this paper, we have designed the p-type SiGe MOSFET and analyzed the electrical characteristics. When the gate voltage is biased to -1.5V, the threshold voltage values are -0.97V and -1.15V at room temperature and 77K, respectively. We know that the operating characteristics of SiGe MOSFET is superior to the basic Si MOSFET which the threshold voltage is -1.36V.