• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.158-158
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• 2012

A new kind of organic-inorganic hybrid polymer, poly(tetraphenyl)silole siloxane (PSS), was invented and synthesized for realization of its unique charge trap properties. The organic portions consisting of (tetraphenyl)silole rings are responsible for electron trapping owing to their low-lying LUMO, while the Si-O-Si inorganic linkages of high HOMO-LUMO gap provide the intrachain energy barrier for controlling electron transport. Such an alternation of the organic and inorganic moieties in a polymer may give an interesting quantum well electronic structure in a molecule. The PSS thin film was fabricated by spin-coating of the PSS solution in THF organic solvent onto Si-wafer substrates and curing. The electron trapping of the PSS thin films was confirmed by the capacitance-voltage (C-V) measurements performed within the metal-insulator-semiconductor (MIS) device structure. And the quantum well electronic structure of the PSS thin film, which was thought to be the origin of the electron trapping, was investigated by a combination of theoretical and experimental methods: density functional theory (DFT) calculations in Gaussian03 package and spectroscopic techniques such as near edge X-ray absorption fine structure spectroscopy (NEXAFS) and photoemission spectroscopy (PES). The electron trapping properties of the PSS thin film of quantum well structure are closely related to intra- and inter-polymer chain electron transports. Among them, the intra-chain electron transport was theoretically studied using the Atomistix Toolkit (ATK) software based on the non-equilibrium Green's function (NEGF) method in conjunction with the DFT.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.609-613
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• 2005

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. In this paper we will outline our progress towards developing such a low power consumption active-matrix flexible OLED ($FOLED^{TM}$) display. Our work in this area is focused on three critical enabling technologies. The first is the development of a high efficiency long-lived phosphorescent OLED ($PHOLED{TM}$) device technology, which has now proven itself to be capable of meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active matrix backplanes, and for this our team are employing poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing. We also present progress in operational lifetime of encapsulated T-PHOLED pixels on planarized metal foil and discuss PHOLED encapsulation strategy.

• Korean Journal of Metals and Materials
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• v.46 no.2
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• pp.80-87
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• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• Korean Journal of Community Nutrition
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• v.16 no.1
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• pp.86-97
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• 2011

The purpose of this study was to examine the usefulness, attitude for using on food labeling such as nutrition labeling, organic food labeling and food additives labeling, and purchase intention in Korean housewives and university students. A total of 320 subjects participated in study from October to November in 2008. They answered to developed questionnaire and 300 subjects (149 housewives, 151 students) completed all questions. The statistical analyses were performed using by SPSS 17.0 package program. The rates of checking the nutrition labeling, organic food labeling and food additives labeling were 57.3%, 57.2% and 63.3%, respectively. Comparing housewives with university students, housewives showed significantly more positive usefulness, attitude for using, purchase intention in some questions about nutrition labeling, organic food labeling and food additives labeling (p < 0.05). Subjects who checked each food labeling on purchasing had more positive usefulness, attitude for using and purchase intention in all questions (p < 0.01). For nutrition labeling and organic food labeling, usefulness (each value of ${\beta}$ was 0.362, 0.354) and attitude for using (each value of ${\beta}$ was 0.336, 0.301) were independent factors for purchase intention (p < 0.001). For food additives labeling, only usefulness had an effect on purchase intention. In conclusion, usefulness, attitude for using food labeling and purchase intention were different between housewives and university students. Moreover, usefulness and attitude for using food labeling affected positively on purchase intention.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Korean Journal of Agricultural Science
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• v.46 no.1
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• pp.151-161
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• 2019

Ashwagandha (Withania sominifera Duanal) is an important medicinal herb with increased demand after discovering its anti-stress and sex stimulating properties that are attributed to the presence of biologically active alkaloid compounds. The aim of this study was to elucidate a proper agro technological package that ensures the optimum growth of Ashwagandha to obtain the finest quality without degrading the pharmacologically active constituents. Mixtures of organic and inorganic fertilizers were combined with direct seeding and transplanted as four different treatments in this study. The fresh and dry weights of the tubers were recorded up to 12 months starting from two months after sowing (MAS) while the shoot height, root length, number of leaves, fresh and dry weights of the shoot and the root with a shoot ratio of up to 6 MAS were determined. The results revealed that the growth of Ashwagandha was not affected significantly by the method of planting, type of fertilizer or their combinations during most of the harvests. However, tubers harvested at 6 MAS had the highest recorded dry tuber weight per plant in all four treatments compared to the early harvests where two direct seeded treatments had the best results. Comparison of the phytochemical compounds showed that direct seeding with organic fertilizer had the highest recorded values for alkaloid and withaferine A contents with a lower percentage of fiber compared to the treatments with inorganic fertilizer. In conclusion, direct seeding with organic fertilizer and tubers harvested at 6 MAS are recommended as the best cultivation conditions and harvesting stage to obtain high quality tubers of Ashwagandha, respectively.

• Journal of Environmental Science International
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• v.32 no.12
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• pp.973-978
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• 2023

This study determined the mechanisms of selection of companion plants that will increase natural enemies and compared and analyzed the effect of suppression of pest density and changes in pest and natural enemy density and spatial distribution, aiming to select suitable companion plants to control major pests that are problematic in organic tomato facility cultivation. As a result of the companion plant selection, 13.5 days were identified in the area with daily flowers among five species of flowering plants. In the experiment to determine the timing of natural enemies, the best results were found in the treatment group introduced two weeks before the pest occurred. As a result of the actual package test, farmers could see that the density of greenhouse pollen decreased significantly (100-500% for adults and 11-67% for larvae compared to no treatment) in the treatment with companion plants. Based on the results of this study, we expect that ecological pest management using companion plants that attract natural enemies will help to increase biodiversity through vegetation management, secure the safe production of organic products and improve the sustainability of agriculture.