• 제목/요약/키워드: number of gate fingers

검색결과 9건 처리시간 0.021초

Highly-Sensitive Gate/Body-Tied MOSFET-Type Photodetector Using Multi-Finger Structure

  • Jang, Juneyoung;Choi, Pyung;Kim, Hyeon-June;Shin, Jang-Kyoo
    • 센서학회지
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    • 제31권3호
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    • pp.151-155
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    • 2022
  • In this paper, we present a highly-sensitive gate/body-tied (GBT) metal-oxide semiconductor field-effect transistor (MOSFET)-type photodetector using multi-finger structure whose photocurrent increases in proportion to the number of fingers. The drain current that flows through a MOSFET using multi-finger structure is proportional to the number of fingers. This study intends to confirm that the photocurrent of a GBT MOSFET-type photodetector that uses the proposed multi-finger structure is larger than the photocurrent per unit area of the existing GBT MOSFET-type photodetectors. Analysis and measurement of a GBT MOSFET-type photodetector that utilizes a multi-finger structure confirmed that photocurrent increases in ratio to the number of fingers. In addition, the characteristics of the photocurrent in relation to the optical power were measured. In order to determine the influence of the incident the wavelength of light, the photocurrent was recorded as the incident the wavelength of light varied over a range of 405 to 980 nm. A highly-sensitive GBT MOSFET-type photodetector with multi-finger structure was designed and fabricated by using the Taiwan semiconductor manufacturing company (TSMC) complementary metal-oxide-semiconductor (CMOS) 0.18 um 1-poly 6-metal process and its characteristics have been measured.

mm-wave용 전력 PHEMT제작 및 특성 연구 (Studies on the Fabrication and Characteristics of PHEMT for mm-wave)

  • 이성대;채연식;윤관기;이응호;이진구
    • 대한전자공학회논문지SD
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    • 제38권6호
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    • pp.383-389
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    • 2001
  • 본 논문에서는 밀리미터파 대역에서 응용 가능한 AIGaAs/InGaAs PHEMT를 제작하고 특성을 분석하였다. 제작에 사용된 PHEMT 웨이퍼는 ATLAS 시뮬레이터를 이용하여 DC 및 RF 특성을 최적화 하였다. 게이트 길이가 0.35 ㎛이고 서로 다른 게이트 폭과 게이트 핑거 수를 갖는 PHEMT를 전자빔 노광장치를 이용하여 제작하였다. 제작된 소자의 게이트 길이와 핑거수에 따른 RF 특성변화를 측정 분석하였다. 게이트 핑거 수가 2개인 PHEMT의 DC 특성으로 1.2 V의 무릎 전압, -1.5 V의 핀치-오프 전압, 275 ㎃/㎜의 드레인 전류 밀도 및 260.17 ㎳/㎜의 최대 전달컨덕턴스를 얻었다. 또한 RF 특성으로 35 ㎓에서 3.6 ㏈의 S/sub 21/ 이득, 11.15 ㏈의 MAG와 약 45 ㎓의 전류 이득 차단 주파수 그리고 약 100 ㎓의 최대 공진주파수를 얻었다.

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Scaling Rules for Multi-Finger Structures of 0.1-μm Metamorphic High-Electron-Mobility Transistors

  • Ko, Pil-Seok;Park, Hyung-Moo
    • Journal of electromagnetic engineering and science
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    • 제13권2호
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    • pp.127-133
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    • 2013
  • We examined the scaling effects of a number of gate_fingers (N) and gate_widths (w) on the high-frequency characteristics of $0.1-{\mu}m$ metamorphic high-electron-mobility transistors. Functional relationships of the extracted small-signal parameters with total gate widths ($w_t$) of different N were proposed. The cut-off frequency ($f_T$) showed an almost independent relationship with $w_t$; however, the maximum frequency of oscillation ($f_{max}$) exhibited a strong functional relationship of gate-resistance ($R_g$) influenced by both N and $w_t$. A greater $w_t$ produced a higher $f_{max}$; but, to maximize $f_{max}$ at a given $w_t$, to increase N was more efficient than to increase the single gate_width.

고이득-광대역 MMIC Distributed Amplifier의 설계 (Design of a High Gain-Broadband MMIC Distributed Amplifier)

  • 김성찬;안단;조승기;윤진섭;이진구
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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    • pp.84-87
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    • 2000
  • In this paper, a high gain-broad bandwidth MMIC distributed amplifier was designed using cascaded single section distributed amplifier configuration. The PHEMT for this studies was fabricated at our lab The PHEMT has a 0.2 $\mu\textrm{m}$ gate length. a 80 $\mu\textrm{m}$ unit gate width and 4 gate fingers. A designed MMIC amplifier have higher S$\sub$21/ gain than the common distributed amplifier using the same number of active devices. From the simulated result, we obtained that the S$\sub$21/ gain of DC ∼ 20 GHz bandwidth was 15.6 dB and flatness was ${\pm}$0.9 dB, and input and output reflection coefficient were lower than -8 dB. The simulated gain shows an improvement 7.3 dB compared with those of conventional distributed amplifier. And the chip size is 2.0 ${\times}$ 1.2 $\textrm{mm}^2$.

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Performance Optimization Study of FinFETs Considering Parasitic Capacitance and Resistance

  • An, TaeYoon;Choe, KyeongKeun;Kwon, Kee-Won;Kim, SoYoung
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권5호
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    • pp.525-536
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    • 2014
  • Recently, the first generation of mass production of FinFET-based microprocessors has begun, and scaling of FinFET transistors is ongoing. Traditional capacitance and resistance models cannot be applied to nonplanar-gate transistors like FinFETs. Although scaling of nanoscale FinFETs may alleviate electrostatic limitations, parasitic capacitances and resistances increase owing to the increasing proximity of the source/drain (S/D) region and metal contact. In this paper, we develop analytical models of parasitic components of FinFETs that employ the raised source/drain structure and metal contact. The accuracy of the proposed model is verified with the results of a 3-D field solver, Raphael. We also investigate the effects of layout changes on the parasitic components and the current-gain cutoff frequency ($f_T$). The optimal FinFET layout design for RF performance is predicted using the proposed analytical models. The proposed analytical model can be implemented as a compact model for accurate circuit simulations.

AlGaAs/InGaAs/GaAs Power PHEMT 설계.제작 (Design and fabrications of AlGaAs/InGaAs/GaAs Power PHEMT)

  • 이응호;조승기;윤용순;이일형;이진구
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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    • pp.12-15
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    • 2000
  • In this paper, we have fabricated the PHEMT's with AlGaAs/InGaAs/GaAs and measured characteristics of DC and frequencies. The PHEMT's has a 0.35$\mu\textrm{m}$ gate length, gate width of 60$\mu\textrm{m}$ and 80$\mu\textrm{m}$, and fingers of 2 and 4. From the measurements results for the 60$\mu\textrm{m}$ ${\times}$ 2 PHEMT's, we obtained 1.2V of Vk, -3.5V of Vp, 46mA of Idss, 221mS/mmof gm, and 3.6dB of S$\sub$21/ gain, 45GHz of f$\sub$T,/ 100GHz of fmax. And, in case of 80$\mu\textrm{m}$ ${\times}$ 4 PHEMT's, we obtained 1.2V of Vk, -4.5V of Vp, 125mA of Idss, 198mS/mm of gm, and 2.0dB of S$\sub$21/ gain. 44GHz of f$\sub$T/, 70GHz of fmax at 35GHz frequency. Also, MAG are decreased as a number of finger are Increased.

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AlGaAs/InGaAs/GaAs PHEMT를 이용한 MIMIC Power Amplifier 제작 연구 (Studies on the MIMIC Power Amplifier using the AlGaAs/InGaAs/GaAs PHEMT)

  • 이성대;채연식;윤용순;윤진섭;이응호;이진구
    • 대한전자공학회논문지SD
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    • 제38권1호
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    • pp.30-36
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    • 2001
  • 본 논문에서는 전자선 묘화 방법을 이용하여 게이트 길이가 0.35 ㎛인 AlGaAs/InGaAs PHEMT를 제작하였다. 다른 게이트 폭과 게이트 핑거 수를 갖도록 제작된 PHEMT의 DC 및 AC 특성은 여러 가지의 바이어스 조건에서 측정하였다. 또한, 제작된 PHEMT와 수동 소자의 라이브러리를 이용하여 35 GHz에서 동작 가능한 MIMIC 전력증폭기를 설계 및 제작하였다. 제작된 MIMIC 전력증폭기는 27.6 GHz에서 7.9㏈의 이득과 -15 ㏈의 입력 반사 계수를 나타내었다.

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Modeling Electrical Characteristics for Multi-Finger MOSFETs Based on Drain Voltage Variation

  • Kang, Min-Gu;Yun, Il-Gu
    • Transactions on Electrical and Electronic Materials
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    • 제12권6호
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    • pp.245-248
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    • 2011
  • The scaling down of metal oxide semiconductor field-effect transistors (MOSFETs) for the last several years has contributed to the reduction of the scaling variables and device parameters as well as the operating voltage of the MOSFET. At the same time, the variation in the electrical characteristics of MOSFETs is one of the major issues that need to be solved. Especially because the issue with variation is magnified as the drive voltage is decreased. Therefore, this paper will focus on the variations between electrical characteristics and drain voltage. In order to do this, the test patterned multi-finger MOSFETs using 90-nm process is used to investigate the characteristic variations, such as the threshold voltage, DIBL, subthreshold swing, transconductance and mobility via parasitic resistance extraction method. These characteristics can be analyzed by varying the gate width and length, and the number of fingers. Through this modeling scheme, the characteristic variations of multi-finger MOSFETs can be analyzed.

Design of SCR-Based ESD Protection Circuit for 3.3 V I/O and 20 V Power Clamp

  • Jung, Jin Woo;Koo, Yong Seo
    • ETRI Journal
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    • 제37권1호
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    • pp.97-106
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    • 2015
  • In this paper, MOS-triggered silicon-controlled rectifier (SCR)-based electrostatic discharge (ESD) protection circuits for mobile application in 3.3 V I/O and SCR-based ESD protection circuits with floating N+/P+ diffusion regions for inverter and light-emitting diode driver applications in 20 V power clamps were designed. The breakdown voltage is induced by a grounded-gate NMOS (ggNMOS) in the MOS-triggered SCR-based ESD protection circuit for 3.3 V I/O. This lowers the breakdown voltage of the SCR by providing a trigger current to the P-well of the SCR. However, the operation resistance is increased compared to SCR, because additional diffusion regions increase the overall resistance of the protection circuit. To overcome this problem, the number of ggNMOS fingers was increased. The ESD protection circuit for the power clamp application at 20 V had a breakdown voltage of 23 V; the product of a high holding voltage by the N+/P+ floating diffusion region. The trigger voltage was improved by the partial insertion of a P-body to narrow the gap between the trigger and holding voltages. The ESD protection circuits for low- and high-voltage applications were designed using $0.18{\mu}m$ Bipolar-CMOS-DMOS technology, with $100{\mu}m$ width. Electrical characteristics and robustness are analyzed by a transmission line pulse measurement and an ESD pulse generator (ESS-6008).