• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.16 no.1
• /
• pp.9-18
• /
• 2010

For screening test of the non-volatile compounds which migrate from food packaging materials into foodstuffs, the traditional high performance liquid chromatography (HPLC) systems suffer from the lack of universal detector with high sensitivity and universality and high efficiency HPLC separation column which provides complete separation of complex mixtures into all individual substances. In this work, the use possibility of online two-dimensional liquid chromatography (2D-LC) system coupled with a charged aerosol detector (CAD), a universal detector, was reviewed. 2D-LC system permits to improve peak capacity and resolving power for complex mixtures. Charged aerosol detector (CAD) offers a new feasibility for detection of any non-volatile compounds with high sensitivity and constant response factor in a calibration range. The combination of size exclusion chromatography (SEC) and normal phase HPLC (NP-HPLC) is most frequently used for the separation of the natural and synthetic polymers which are mainly used as raw materials for the manufacture of food packaging materials. However, there is no commercial software available for data acquisition and handling and therefore the quantification in 2D-LC analysis is still rare.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.29-33
• /
• 2012

The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good die. Among several new process techniques Cu-to-Cu wafer bonding is the key process to be optimized for the high density and high performance IC manufacturing. In this study two main challenges for Cu-to-Cu wafer bonding were evaluated: misalignment and bond quality of bonded wafers. It is demonstrated that the misalignment in a bonded wafer was mainly due to a physical movement of spacer removal step and the bond quality was significantly dependent on Cu bump dishing and oxide erosion by Cu CMP.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2006.10a
• /
• pp.179-212
• /
• 2006

1. $Welco^{(R)}$ Ultra fine solder powders are suitable for wafer bumping applications; mass production of ultra fine powders with high quality and high yield. - UFP based pastes for wafer bumping by stencil printing ($60-80{\mu}m$ pitch) are now available - Residue free solder flux was developed; meets voids specification of 20%. - F645 type 5 paste is suitable for components 01005

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.3-7
• /
• 2000

In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.

• Proceedings of the KIPE Conference
• /
• 2001.10a
• /
• pp.384-389
• /
• 2001

New methods are studied that can suppress EMI noises, especially common mode currents produced in the motor drive system. One is a packaging technique that forms power converters using a four-layer printed power circuit board. The other is a method based on the generation mechanism of common mode currents which was developed from experimental analyses. It is proved by experiments that the former can effectively control common mode currents, including radiated emissions, and the latter can suppress them without any compensators between the inverter and the motor.

• Asia Marketing Journal
• /
• v.20 no.3
• /
• pp.1-15
• /
• 2018

Dongwon Systems established in 1977 to exclusively supply Dongwon tuna cans, the parent company. Instead of its stable management and profits by relying on the parent company, the company was not complacent and started innovating and challenging new markets. Dongwon Systems decided to expand the business area and pioneer new markets so that it becomes the first domestic company to successfully expand into independent businesses other than parent company products. Such success of Dongwon Systems was driven by its differentiated B2B strategies. Unlike the characteristics of usual B2B companies, Dongwon Systems has been thinking both of its client companies and end-consumers. In this case-study, we will explore how Dongwon Systems became the No.1 packaging solution company in Korea through technology innovation in the aspects of unique B2B marketing strategy. The key success factor can be summarized in three ways; product and technology development with customer centric mind-set, systematically extending new markets through business diversification, and marking Southeast Asia as a bridgehead for its global strategy. It is expected that the current case study of Dongwon Systems will be able to provide implications for B2C companies as well as B2B companies that try to expand their business portfolio and global business areas through B2B marketing case analysis.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.12 no.1
• /
• pp.1-5
• /
• 2006

Increasement of total cost during distribution chain requires packaging standardization to reduce extra handling and delays at transshipment point. In Korea, high valued agricultural products to export are most often shipped by air freight. Fresh flowers, in particular, the need to set package standard for air palletization are strongly recommended. This study tried to find an optimum standard dimensions for export packages. After extensive research on combinations of various flower dimensions, package dimensions and pallet sizes, we found that 96 inches pallet was most adequate for international air freight. Based on the results, new 40 standard package dimensions were introduced and stacking efficiencies were calculated.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.27 no.2
• /
• pp.71-84
• /
• 2021

The purpose of this study is to establish a new management strategy to meet customer needs of discount stores as customers demand higher and more diverse services in addition to low prices. An empirical analysis on consumers to explore the structural relationships between the quality, environmentally friendliness, consumer perception, service value, and emotional response of retail ready packaging (RRP) in discount stores in order to find out how they affect customer satisfaction and repurchase intention. First, it was confirmed that the RRP quality of discount stores that affects customer satisfaction is mediated by the emotional response. Second, it was found that RRP in discount stores should continue to devise strategies to improve service quality along with efforts to provide more benefits perceived by customers to increase customer satisfaction and repurchase intention. Third, it was confirmed that the RRP image of discount stores has a positive (+) effect on service value, emotional response, customer satisfaction, and repurchase intention.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.3
• /
• pp.1-6
• /
• 2016

The Internet of Things (IoT) is a new technology paradigm demanding one packaged system of various semiconductor and MEMS devices. Therefore, the development of electronic packaging technology with very high connectivity is essential for successful IoT applications. This paper discusses both fan-out wafer level packaging (FOWLP) and 3D stacking technologies to achieve the integrattion of heterogeneous devices for IoT. FOWLP has great advantages of high I/O density, high integration, and design flexibility, but ultra-fine pitch redistribution layer (RDL) and molding processes still remain as main challenges to resolve. 3D stacking is an emerging technology solving conventional packaging limits such as size, performance, cost, and scalability. Among various 3D stacking sequences wafer level via after bonding method will provide the highest connectivity with low cost. In addition substrates with ultra-thin thickness, ultra-fine pitch line/space, and low cost are required to improve system performance. The key substrate technologies are embedded trace, passive, and active substrates or ultra-thin coreless substrates.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.26 no.3
• /
• pp.139-145
• /
• 2020

The purpose of this study is to share the experience of online education with departments related to the servic industry, such as distribution and logistics, in the New Normal Age of COVID-19 pandemics. The graduation presentation project, which is the capstone design subject and the most urgent subject for face-to-face classes, was selected as the online education subject of this study. The results of this study are as follows : First, several online class tools, such as Zoom, Microsoft Teams, and Google Meet, have also been shown to be applicable to capstone design subjects such as graduation presentation projects. Second, it is essential to reorganize the curriculum to enhance students' ability to practice and utilize online contents. Third, continuous education and training are needed to make easy use of the aforementioned online teaching tools. Meanwhile, fourth, further research is needed to solve the learning effects caused by online learning, and difficulties in communication.