• 제목/요약/키워드: new packaging technology

검색결과 224건 처리시간 0.024초

21세기의 포장산업의 전망 (Prospects of Packaging Industry in Japan for the 21st Century)

  • 문옥탁
    • 한국포장학회지
    • /
    • 제1권1호
    • /
    • pp.51-61
    • /
    • 1995

  • This paper is discussed on the prospects of packaging industry and technologies of Japan for comming 21th century. It is clear that packaging industry depends on living style and social mechanizms. A trends of numerical consumption, amounts of money and composisition of packaging materials are one of a measure of development of packaging industry. Total consumption of packaging materials in Japan of 1965, 1980 and 1993 were $6,344.5{\times}10^3,\;15,898.7{\times}10^3\;and\;21,603.3{\times}10^3$ tons respectively and also, shipping money of packaging materials were $7,073{\times}10^{11},\;45,421{\times}10^{11}\;and\;63,902{\times}10^{11}$ yen, respectively. It is estimated from these data that the packaging industry is also increasing in future according of GNP of country. Compositions of packaging materials from 1965 to 1993, however, are somewhat changing according to development of new materials or social conditions such as platics packaging or wooden packaging materials. Technical forcasts of packaging industry are shown from view point of national living style, energy and resorces as well as environment of world based on forcasting committee of pulp & paper in Japan, report of research committee for the 21th packaging in JPI and materials of symposium in Kanagawa University in this paper. As a my conclusion, many functional packaging materials shall be developed in the future and accordingly Life Cycle Assesment plays a important role of packaging fields. Furthermore, I am estimating in future the new cellulosic materials such as nonwood fiber resources instead of paper, board, wooden containers and a part of plastic packaging materials shall be developed. This paper is constructed by three items as follow:

  • PDF

쏠더를 이용한 웨이퍼 레벨 실장 기술 (A novel wafer-level-packaging scheme using solder)

  • 이은성;김운배;송인상;문창렬;김현철;전국진
    • 반도체디스플레이기술학회지
    • /
    • 제3권3호
    • /
    • pp.5-9
    • /
    • 2004

  • A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

  • PDF