• 한국포장학회지
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• 제11권2호
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• pp.115-121
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• 2005

In this research, what megatrends will be derived for the future society and what new packaging technology will be required in the future were researched. Megatrends were researched in the five major categories, demographical, social, consumer, packaging related science and technology, governmental regulations and law trend. The six new packaging technologies were predicted, Active/Passive packaging technology, Intelligent Communication packaging technology, Nanotechnology packaging technology, Universal Convenience packaging technology, Environmental Friendly packaging technology, and Package Design technology.

• 한국펄프종이공학회:학술대회논문집
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• 한국펄프종이공학회 2007년도 추계학술발표논문집
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• pp.13-19
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• 2007

본 연구에서는 새로운 패키징 기술 개발 방향을 정하기 위해서 먼저 미래사회로 가는 메가트렌들가 무엇이며 이들이 어떤 새로운 패키징기술을 요구할 것인가를 분석 예측하였다. 미래사회로 가는 주요 메가트렌드는 인구통계학적 트랜드, 사회학적 트렌드, 소비자들 트렌드, 패키징 주변과학기술의 발전 트렌드 및 정부의 정책 및 법규의 트렌드를 분석하였고 이들 트렌드가 요구하는 미래의 새로운 포장기술로는 Active/Passive 패키징기술, Intelligent Communication 패키징기술, Nanotechnology 패키징 기술, Universal Convenience 패키징 기술, Environmental Friendly 패키징기술과 Package Design기술로 예측되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.65-89
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• 2003

Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 The IMAPS-Korea Workshop 2000 Emerging Technology on Packaging
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• pp.55-85
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• 2000

MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.53-58
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• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.51-52
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• 2003

• 한국포장학회지
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• 제11권1호
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• pp.41-46
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• 2005

For both economic and ecological reasons corrugated box manufacturers are seeking to produce acceptably strong boxes while using more recycled paper. This study was to develop hydrophilic coating agents in order to improve overall physical properties of recycled corrugated fiberboard liners. Two coating agents were developed and applied to 'S' corrugating medium. The results showed that compression strength of new liners, named 'S-A' and 'S-B', were increased significantly both standard humidity and high humidity environment and it was as much as 'SK' liner. New developed liners were also economically advantageous since new liners were estimated about one hundred fifty dollars per ton cheaper than SK liner. The study indicated that further work is needed on the coating technology and machine development.

• 한국포장학회지
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• 제13권1호
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• pp.9-18
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• 2007

Nanocomposite has been considered as an emerging technology in developing a novel food packaging materials. Polymer nanocomposites exhibit markedly improved packaging properties due to their nanometer size dispersion. These improvements include increased barrier properties pertaining to gases such as oxygen, carbon dioxide, and water vapor, as well as to UV rays, and increased mechanical properties such as strength, stiffness, dimensional stability, and heat resistance. Additionally, biologically active ingredients can be added to impart the desired functional properties to the resulting packaging materials. New packaging materials created with this technology demonstrate an increased shelf life with maintaining high quality of the product. Nanotechnology offers big benefits for packaging. Nanocomposite technology paves the way for packaging innovation in the flexible and rigid packaging applications, offering enhanced properties such as greater barrier protection, increased shelf life and lighter-weight materials.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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• pp.129-146
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• 2007

[ ${\square}$ ] A mathematical model has been developed and used to analyze the limits of He fine leak test. ${\square}$ Uncertainties inherent in using the MIL-STD-883 guidelines for hermeticity evaluation of small packages have been demonstrated. ${\square}$ A new methodology to quantitatively characterize hermeticity has been developed.

• 한국포장학회지
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• 제24권3호
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• pp.167-180
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• 2018

Interest in the use of smart packaging systems for food products has increased in recent years. Therefore, food researchers are focusing on the development of new indicator based smart packaging technologies by using anthocyanin-based natural dye. Anthocyanins are one of the plant constituents known as flavonoids and responsible for the bright and attractive orange, red, purple, and blue colors of most fruits, vegetables, flowers, and some cereal grains. Indicators of natural dyes such as anthocyanins could express the quality and shelf life of perishable food products. However, the sensitivity and stability for their use in smart food packaging should be established to reach the market proposals. This review article focuses on recent studies related to use of natural dyes based on anthocyanin for smart food packaging applications. This study offers valuable insight that may be useful for identifying trends in the commercialization of natural dyes or for identifying new research areas. This review also provides food and packaging scientists with a thorough understanding of the benefits of anthocyanin-based natural dyes for shelf life indicator when applied to package material specific foods and hence can assist in accelerating commercial adoption.