Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.09a
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- Pages.55-85
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- 2000
MEMS Packaging Technology and Micro Sensors
MEMS Packaging 기술 및 마이크로센서
Abstract
MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.
Keywords