• Title/Summary/Keyword: network-on-chip

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A Novel Parallel Viterbi Decoding Scheme for NoC-Based Software-Defined Radio System

  • Wang, Jian;Li, Yubai;Li, Huan
    • ETRI Journal
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    • v.35 no.5
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    • pp.767-774
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    • 2013
  • In this paper, a novel parallel Viterbi decoding scheme is proposed to decrease the decoding latency and power consumption for the software-defined radio (SDR) system. It implements a divide-and-conquer approach by first dividing a block into a series of subblocks, then performing independent Viterbi decoding for each subsequence, and finally merging the surviving subpaths into the final path. Moreover, a network-on-chip-based SDR platform is used to evaluate the performance of the proposed parallel Viterbi decoding scheme. The experiment results show that our scheme can speed up the Viterbi decoding process without increasing the BER, and it performs better than the current state-of-the-art methods.

2.4-GHz Power Amplifier with Power Detector Using Metamaterial-Based Transformer-Type On-Chip Directional Coupler

  • Dang, Trung-Sinh;Tran, Anh-Dung;Lee, Bomson;Yoon, Sang-Woong
    • ETRI Journal
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    • v.35 no.3
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    • pp.554-557
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    • 2013
  • This letter presents a power amplifier (PA) with an on-chip power detector for 2.4-GHz wireless local area network application. The power detector consists of a clamp circuit, a diode detector, and a coupled line directional coupler. A series inductor for an output matching network in the PA is combined with a through line of the coupler, which reduces the coupling level. Therefore, the coupler employs a metamaterial-based transformer configuration to increase coupling. The amount of coupling is increased by 2.5 dB in the 1:1 symmetric transformer structure and by 4.5 dB from two metamaterial units along the coupled line.

The Novel Built-In Self-Test Architecture for Network-on-Chip Systems (Network-on-Chip 시스템을 위한 새로운 내장 자체 테스트 (Built-In Self-Test) 구조)

  • Lee, Keon-Ho;Kim, In-Soo;Min, Hyoung-Bok
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1931_1933
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    • 2009
  • NoC 기반 시스템이 적용되는 설계는 시스템 크기가 커짐에 따라 칩 테스트 문제도 동시에 제기 되고 있다. 이에 따라 NoC 기반의 시스템의 테스트 시간을 줄일 수 있는 internal test 방식의 새로운 BIST(Built-in Self-Test) 구조에 관한 연구를 하였다. 기존의 NoC 기반 시스템의 BIST 테스트 구조는 각각의 router와 core에 BIST logic과 random pattern generator로 LFSR(Linear Feedback Shift Register)을 사용하여 연결하는 individual 방식과 하나의 BIST logic과 LFSR을 사용하여 각각의 router와 core에 병렬로 연결하는 distributed 방식을 사용한다. 이때, LFSR에서 생성된 테스트 벡터가 router에 사용되는 FIFO 메모리를 통과하면서 생기는 테스트 타임 증가를 줄이기 위하여 shift register 형태의 FIFO 메모리를 변경하였다 제안된 방법에서 테스트 커버리지 98%이상을 달성하였고, area overhead면에서 효과를 볼 수 있다.

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Reliable Anisotropic Conductive Adhesives Flip Chip on Organic Substrates For High Frequency Applications

  • Paik, Kyung-Wook;Yim, Myung-Jin;Kwon, Woon-Seong
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.04a
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    • pp.35-43
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    • 2001
  • Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

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Microfluidic Biosensor System for HDL Cholesterol

  • Kim, Joo-Eun;Paek, Se-Hwan
    • 한국생물공학회:학술대회논문집
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    • 2003.10a
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    • pp.717-720
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    • 2003
  • A chromogenic biosensor employing microfluidics on a chip has been developed for the determination of high-density lipoprotein (HDL) cholesterol (HDL-C) in human serum. We have investigated a plain and effective method to immobilize enzymes within the microchip without chemically modifying micro-channel or technically micro-fabricating column reactor and fluid channel network. In assessing risk factors of coronary heart disease, a micro-chip system would minimize requirements of instrument and reagent handling.

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Design of Communication Software Based on DSP and Implementation of Testbed (DSP 기반 통신 소프트웨어의 설계 및 테스트베드)

  • 황택규
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.1137-1140
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    • 1999
  • In this thesis, we research about Communication System Construction and Test-Bed Realization Method and Software’s Design with written program into Embedded Micro Controller’s restricted memory region using a DSP Chip to deal with mainly high speed communication. Tools used for modern communication network control use TI or AMD general chip class, but nevertheless responsibility for the point at issue, Analog Device is architecture design model moderated for small communication system. In this thesis, we present extended model, and realize basic case.

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Bit-level Array Structure Representation of Weight and Optimization Method to Design Pre-Trained Neural Network (학습된 신경망 설계를 위한 가중치의 비트-레벨 어레이 구조 표현과 최적화 방법)

  • Lim, Guk-Chan;Kwak, Woo-Young;Lee, Hyun-Soo
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.9
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    • pp.37-44
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    • 2002
  • This paper proposes efficient digital hardware design method by using fixed weight of pre-trained neural network. For this, arithmetic operations of PEs(Processing Elements) are represented with matrix-vector multiplication. The relationship of fixed weight and input data present bit-level array structure architecture which is consisted operation node. To minimize the operation node, this paper proposes node elimination method and setting common node depend on bit pattern of weight. The result of FPGA simulation shows the efficiency on hardware cost and operation speed with full precision. And proposed design method makes possibility that many PEs are implemented to on-chip.

Implementation of artificial neural network with on-chip learning circuitry (학습 기능을 내장한 신경 회로망의 하드웨어 구현)

  • 최명렬
    • Journal of the Korean Institute of Telematics and Electronics B
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    • v.33B no.3
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    • pp.186-192
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    • 1996
  • A modified learning rule is introduced for the implementation of feedforward artificial neural networks with on-chip learning circuitry using standard analog CMOS technology. Learning rule, is modified form the EBP (error back propagation) rule which is one of the well-known learning rules for the feedforward rtificial neural nets(FANNs). The employed MEBP ( modified EBP) rule is well - suited for the hardware implementation of FANNs with on-chip learning rule. As a ynapse circuit, a four-quadrant vector-product linear multiplier is employed, whose input/output signals are given with voltage units. Two $2{\times}2{\times}1$ FANNs are implemented with the learning circuitry. The implemented FANN circuits have been simulatied with learning test patterns using the PSPICE circuit simulator and their results show correct learning functions.

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Development of A New Device for Controlling Infinitesimal Flows inside a Lab-On-A-Chip and Its Practical Application (랩온어칩 내부 미세유동 제어를 위한 새로운 장치의 개발 및 적용)

  • Kim, Bo-Ram;Kim, Guk-Bae;Lee, Sang-Joon
    • 유체기계공업학회:학술대회논문집
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    • 2006.08a
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    • pp.305-308
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    • 2006
  • For controlling micro-flows inside a LOC (lab-on-a-chip) a syringe pump or an electronic device for EOF(electro-osmotic flow) have been used in general. However, these devices are so large and heavy that they are burdensome in the development of a portable micro-TAS (total analysis system). In this study, a new flow control system employing pressure chambers, digital switches and speed controllers was developed. This system could effectively control the micro-scale flows inside a LOC without any mechanical actuators or electronic devices We also checked the feasibility of this new control system by applying it to a LOC of micro-mixer type. Performance tests show that the developed control system has very good performance. Because the flow rate in LOC is controlled easily by throttling the speed controller, the flows in complicate microchannels network can be also controlled precisely.

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A CDMA-Based Communication Network for a Multiprocessor SoC (다중 프로세서를 갖는 SoC 를 위한 CDMA 기술에 기반한 통신망 설계)

  • Chun, Ik-Jae;Kim, Bo-Gwan
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.707-710
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    • 2005
  • In this paper, we propose a new communication network for on-chip communication. The network is based on a direct sequence code division multiple access (DS-CDMA) technique. The new communication network is suitable for a parallel processing system and also drastically reduces the I/O pin count. Our network architecture is mainly divided into a CDMA-based network interface (CNI), a communication channel, a synchronizer. The network includes a reverse communication channel for reducing latency. The network decouples computation task from communication task by the CNI. An extreme truncation is considered to simplify the communication link. For the scalability of the network, we use a PN-code reuse method and a hierarchical structure. The network elements have a modular architecture. The communication network is done using fully synthesizable Verilog HDL to enhance the portability between process technologies.

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