• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권10호
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• pp.510-514
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• 2004

In this paper, we analytically examine the voltage transfer function dependent on input conditions for an N-Input NAND Gate. The logic threshold voltage, defined as a voltage at which the input and the output voltage become equal, changes as the input condition changes for a static NAND Gate. The logic threshold voltage has the highest value when all the N-inputs undergo transitions and it has the lowest value when only the last input connected to the last NMOS to ground, makes a transition. This logic threshold voltage difference increases as the number of inputs increases. Therefore, in order to provide a near symmetric voltage transfer function, a multistage N-Input Gate consisting of 2-Input Logic Gates is desirable over a conventional N-Input Gate.

• 전기전자학회논문지
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• 제25권4호
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• pp.774-777
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• 2021

본 논문은 Charge Trap Flash using Ferroelectric(CTF-F) 구조를 가진 3D NAND Flash Memory gate controllability에 대해 분석했다. Ferroelectric 물질인 HfO₂는 polarization 이외에도 high-k 라는 특징을 가진다. 이러한 특징으로 인해 CTF-F 구조에서 gate controllability가 증가하고 Bit Line(BL)에서 on/off 전류특성이 향상된다. Simulation 결과 CTF-F 구조에서 String Select Line(SSL)과 Ground Select Line(GSL)의 채널길이는 100 nm로 기존 CTF 구조에 비해 33% 감소했지만 거의 동일한 off current 특성을 확인했다. 또한 program operation에서 channel에 inversion layer가 더 강하게 형성되어 BL을 통한 전류가 약 2배 증가한 것을 확인했다.

• 한국신뢰성학회지:신뢰성응용연구
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• 제10권1호
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• pp.65-71
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• 2010

NAND-type SONOS with a separated double-gate FinFET structure (SDF-Fin SONOS) flash memory devices are proposed to reduce the unit cell size of the memory device and increase the memory density in comparison with conventional non volatile memory devices. The proposed memory device consists of a pair of control gates separated along the direction of the Fin width. There are two unique alternative technologies in this study. One is a channel doping method and the other is an oxide thickness variation method, which are used to operate the SDF-Fin SONOS memory device as two-bit. The fabrication processes and the device characteristics are simulated by using technology comuter-adided(TCAD). The simulation results indicate that the charge trap probability depends on the different channel doping concentration and the tunneling oxide thickness. The proposed SDG-Fin SONOS memory devices hold promise for potential application.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권5호
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• pp.650-656
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• 2016

Voltage controlled oscillator (VCO) is widely used circuit component in high-performance microprocessors and modern communication systems as a frequency source. In present work, VCO designs using the different combination of NAND gates with three transistors and CMOS inverter are reported. Three, five and seven stages ring VCO circuits are designed. Coarse and fine tuning have been done using two different supply sources. The frequency with coarse tuning varies from 3.31 GHz to 5.60 GHz in three stages, 1.77 GHz to 3.26 GHz in five stages and 1.27 GHz to 2.32 GHz in seven stages VCO respectively. Moreover, for fine tuning frequency varies from 3.70 GHz to 3.94 GHz in three stages, 2.04 GHz to 2.18 GHz in five stages and 1.43 GHz to 1.58 GHz in seven stages VCO respectively. Results of power consumption and phase noise for the VCO circuits are also been reported. Results of proposed VCO circuits have been compared with previously reported circuits and present circuit approach show significant improvement.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권2호
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• pp.260-264
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• 2017

Process variation effect on arch-structured gate stacked array (GSTAR) 3-D NAND flash is investigated. In case of arch-structured GSTAR, a shape of the arch channel is depending on an alignment of photo-lithography. Channel width fluctuates according to the channel hole alignment. When a shape of channel exceeds semicircle, channel width becomes longer, increasing drain current. However, electric field concentration on tunnel oxide decreases because less electric flux converges into a larger surface of tunnel oxide. Therefore, program efficiency is dependent on the process variation. Meanwhile, a radius of channel holes near the bottom side become smaller due to an etch slope. It also affects program efficiency as well as channel width. Larger hole radius has an advantage of higher drain current, but causes degradation of program speed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.145-150
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• 1998

8$\times$8 bit scaled SONOSFET NAND type flash EEPROM that shows better characteristics on cell density and endurance than NOR type have been designed and its electrical characteristics are verified with computer aided simulation. For the simulation, the spice model parameter was extracted from the sealed down SONOSFET that was fabricated by $1.5mutextrm{m}$ topological design rule. To improve the endurance of the device, the EEPROM design to have modified Fowler-Nordheim tunneling through the whole channel area in Write/Erase operation. As a result, it operates Write/Erase operation at low current, and has been proven Its good endurance. The NAND type flash EEPROM, which has upper limit of V$_{th}$, has the upper limit of V$_{th}$ as 4.5V. It is better than that of floating gate as 4V. And a EEPROM using the SONOSFET without scaling (65$\AA$-l65$\AA$-35$\AA$), was also designed and its characteristics have been compared. It has more possibliity of error from the V$_{th}$ upper limit as 4V, and takes more time for Read operation due to low current. As a consequence, it is proven that scaled down SONOSFET is more pertinent than existing floating gate or SONOSFET without scaling for the NAND type flash EEPROM.EPROM.

• 대한전자공학회논문지SD
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• 제48권3호
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• pp.1-6
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• 2011

N-channel 산화물 박막 트랜지스터(Thin Film Transistor, 이하 TFT)만을 이용한 저소비전력 inverter, NAND, NOR의 논리 게이트 회로를 제안한다. 제안된 회로는 asymmetric feed-through와 bootstrapping을 이용해서 pull-up, pull-down 스위치가 동시에 켜지지 않도록 설계하였다. 그 결과로 출력신호 전압 범위가 입력신호 전압과 동일하고 정전류가 흐르지 않는다. 인버터는 5 개의 TFT와 2 개의 capacitor로, NAND 및 NOR 게이트는 각각 10 개의 TFT와 4 개의 capacitor로 구성된다. 산화물 TFT 모델을 사용하여 SPICE 시뮬레이션을 수행하여 제안된 회로의 동작을 성공적으로 검증하였다.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.300-304
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• 2008

A novel characterization method was investigated to estimate the trap generation during the program /erase cycles in nand flash memory cell. Utilizing Fowler-Nordheim tunneling current, floating gate potential and oxide electric field, we established a quantitative model which allows the knowledge of threshold voltage (Vth) as a function of either program or erase operation time. Based on our model, the derived results proved that interface trap density (Nit) term is only included in the program operation equation, while both Nit and oxide trap density (Not) term are included in the erase operation equation. The effectiveness of our model was tested using 50 nm nand flash memory cell with floating gate type. Nit and Not were extracted through the analysis of Program/Erase speed with respect to the endurance cycle. Trap generation and cycle numbers showed the power dependency. Finally, with the measurement of the experiment concerning the variation of cell Vth with respect to program/erase cycles, we obtained the novel quantitative model which shows similar results of relationship between experimental values and extracted ones.

• 한국정보통신학회논문지
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• 제7권2호
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• pp.263-268
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• 2003

본 논문에서는 main gate(MG)와 side gate(SG)를 갖는 double gate(DG) MOSFET 구조를 조사하였다. MG가 50nm일 때 최적의 SG 전압은 약 3V임을 알 수 있었고, 각각의 MG에 대한 최적의 SG 길이는 약 70nm임을 알 수 있었다. DG MOSFET는 매우 작은 문턱 전압 roll-off 특성을 나타내고, 전류-전압 특성곡선에서 VMG=VDS=1.5V, VSG=3V인 곳에서 포화전류는 550$\mu\textrm{A}$/m임을 알 수 있었다. subthrehold slope는 82.6㎷/decade, 전달 컨덕턴스는 l14$\mu\textrm{A}$/$\mu\textrm{m}$ 그리고 DIBL은 43.37㎷이다 다중 입력 NAND 게이트 로직 응용에 대한 이 구조의 장점을 조사하였다. 이때, DG MOSFET에서 41.4GHz의 매우 높은 컷오프 주파수를 얻을 수 있었다.

• 전기학회논문지
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• 제59권9호
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• pp.1611-1614
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• 2010

The explosion of a nuclear weapon radiates a gamma-ray in the form of a transient pulse. If the gamma-ray introduces to semiconductor devices, much Electron-Hole Pairs(EHPs) are generated in depletion region of the devices[7]. as a consequence of that, high photocurrent is created and causes upset, latchup and burnout of semiconductor devices[8]. This phenomenon is known for Transient Radiation Effects on Electronics(TREE), also called dose-rate effects. In this paper 3D structure of inverter and NAND gate device was designed and transient pulse gamma-ray was modeled. So simulation for transient radiation effect on inverter and NAND gate was accomplished and mechanism for upset and latchup was analyzed.