• Journal of Powder Materials
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• v.27 no.4
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• pp.333-338
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• 2020

In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu₃P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/㎠. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.

• Polymer(Korea)
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• v.26 no.5
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• pp.634-643
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• 2002

Ultrathin film of polyamic acid having benzene and sulfonyloxyimide moieties was prepared using the Langmuir-Blodgett (LB) technique, and then photosensitive polyimide LB film was obtained by the thermal treatment of precursor polyamic acid multilayers at 200$\^{C}$ for 1 hr. The polyamic acid was synthesized by condensation polymerization under THF and pyridine cosolvent. All monomers and polymers were identified through elemental analysis, FT-IR and $^1$H-NMR spectroscopic measurements. The microarray patterning of photosensitive polyimide LB film on a gold substrate was generated with a deep UV lithography technique. The well-characterized monolayer of cytochrome c was immobilized on the microarray patterns using two different self-assembly processes. Physical and electrochemical properties of the self-assembled cytochrome c monolayer were investigated based on cyclic voltammetry and atomic force microscopy (AFM). Also, its application in bioelectronic device was examined.

• Fire Science and Engineering
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• v.19 no.2 s.58
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• pp.75-80
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• 2005

This dissertation is about the development of PTC(Positive Temperature Coefficient) thermistor by composition method. A multilayer-type PTC samples were fabricated under optimal conditions after setting the experimental composition equation as $(0.90Ba+0.05Sr+0.05Ca)TiO_3+0.01TiO_3+0.01SiO_2+0.0008MnO_2+0.0018Nb_2O_5$ and their testing results were analyzed. The fabrication method of SMD(Surface Mounted Device) multilayer -type sample based on the composition ratio has the advantages in lowering its resistivity at room temperature, considerably, and increasing maximum current level, as needed. Although there is a disadvantage of peak resistivity drop by the multilayer, causing the increasement of thermal capacity. and thereby, increasing the switching delay time, a high applying voltage can increase the peak resistivity and shorten the switching delay time. The voltage-current characteristic showed that the more multilayers increased the initial maximum current and the transition voltage that increased the resistivity abruptly according to the curie point. The element it could be applied with the sensor for the fire detector.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.323-330
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• 2005

We fabricate PIN PD (Positive Intrinsic Negative Photo-Diode) for CWDM optical repeater and optical transmission system, and analyze theoretically the characteristics to verify the capability of device fabricated. Furthermore, we integrate CWDM filter into PD package to enhance the cost and the performance when compared to the conventional system, in which CWDM filter and PD package are linked by optical fusion splicing. The integrated CWDM PD is fabricated by three steps as follows: CWDM filter design, PD packaging, and product assembly and test. The results of measurement for PD fabricated reveal 0.5 dB bandwidth of 17 nm, isolation over 60 dB at transmission port and over 20 dB at reflection port. Also, the IMD3 for wireless communication is over 63 dBc, and the responsivity of PD presents over 0.9 A/W for 20 samples of the total 23 PD. The total insertion loss reduces about 0.4${\~}$0.7 dB due to the integrated assembly of CWDM and PD.

• Journal of the Korean Magnetics Society
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• v.21 no.4
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• pp.132-135
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• 2011

The exchange bias field ($H_{EX}$) and the coercivity ($H_C$) variation and change depending on the thickness of intermediately super-soft magnetic NiFeCuMo layer with different thickness of the bottom NiFe layer were investigated. The $H_{EX}$ of triple pinned NiFe(4 nm)/NiFeCuMo($t_{NiFeCuMo}$= 1 nm)/NiFe(4 nm)/FeMn multilayer has the maximum value more less than one of single pinned NiFe(8 nm)/FeMn layer. If NiFeCuMo layer is inserted each into between the pinned and free NiFe layers, we can be used as GMR-SV device for a bio-sensor that has improved magnetic sensitivity.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.69-72
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• 2021

Various studies for QLEDs using inkjet printing has been actively conducted. Multilayers in QLEDs need an orthogonal process inevitably using different solvents and it makes the inkjet printing process more difficult and expensive. Therefore, coating two layers in a single process can reduce the fabrication step, resulting in the process time. In this study, we fabricated QLEDs of standard structure using a mixture of emission layer and hole transport layer. The mixed layer was fabricated by dissolving TFB and QDs in chlorobenzene, and the maximum luminance of the device was 45,850 cd/m². It shows the bright future of the electroluminescence devices applied with inkjet printing process.

• Journal of the Korean Magnetics Society
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• v.11 no.4
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• pp.141-145
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• 2001

The Mn$\_$80/Ir$\_$18.1/Pt$\_$1.9/ exchange bias layers (EBLs), which have a small amounts of Pt, exhibit a high value of H$\_$ex/. The Si/Ni-Fe/Mn$\_$80/Ir$\_$18.1/Pt$\_$1.9/ EBL shows the largest H$\_$ex/ of 187 Oe, which is equivalent to a exchange energy (J$\_$ex/) of 0.146 erg/cm$^2$. Mn$\_$80/Ir$\_$18.1/Pt$\_$1.9/ EBLS are estimated to have blocking temperature of about 250 $\^{C}$, which is higher than those of Mn-Ir EBLs and Mn-Ir-Pt EBLs with higher Pt contents. This result implies that a little addition of Pt element promotes thermal stability in the Mn-Ir-Pt EBLs. The chemical stability of Mn-Ir-Pt EBLs was characterized by potentiodynamic test, which was performed in 0.001 M NaCl solution. The current density of Mn-Ir-Pt films was gradually reduced with increasing Pt content. The present results indicate that the Mn-Ir-Pt with a small amount of Pt is suitable for an antiferromagnetic material for a reliable spin valve giant magnetoresistance device.

• Journal of the Korean Magnetics Society
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• v.10 no.5
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• pp.210-219
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• 2000

The magnetoresistance characteristics of FeN/Co/Cu/Co and FeN/Co/Cu/Co/Cu/Co/FeN multilayers using ferromagnetic iron-nitrides (FeN) has been studied. The microstructure of FeN film is the mixed ${\alpha}$-Fe and $\varepsilon$-Fe$_3$N phase on the condition that the flow rate of N$_2$ gas is over 0.4 sccm. The magnetoresistance effect is observed because of shape magnetic anisotropy induced by needle-shaped $\varepsilon$-Fe$_3$N phase. This magnetoresistance effect changes, because the degree that the shape magnetic anisotropy adheres to the adjacent Co pinned layer is varied according to the flow rate of N$_2$ gas and the thickness of FeN film. The best magnetoresistance effect is obtained on the condition that the thickness of Co free layer is 70 ${\AA}$ and the maximum MR ratio(%) value of 3.2% shows in the FeN(250 ${\AA}$)/Co(70 ${\AA}$)/Cu(25 ${\AA}$)/Co(70 ${\AA}$)/Cu(25 ${\AA}$)/Co(70 ${\AA}$)/FeN(250 ${\AA}$) mutilayer film which is fabricated at the N, gas flow rate of 0.5 sccm and the FeN film thickness of 250 ${\AA}$. Four steps are observed in the magnetoresistance curve owing to this difference of coercive force, because respective magnetic layers in the multilayer possess different coercive forces. These effects observed in these mutilayer films can be expected to application to the memory device the same MRAM as can carry out simultaneously four signals.