• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05b
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• pp.30-33
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding $1{\mu}m$ size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particle agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectric(IMD)-CMP. The filter installation in CMP polisher could reduce defect after IMD-CMP. As a result of micro-scratches formation, it shows that slurry filter plays an important role in determining consumable pad lifetime.

• Proceedings of the Korean Magnestics Society Conference
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• 2015.05a
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• pp.161-163
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• 2015

The micro device, coil, and channel for the biosensor integrated with the GMR-SV device based on the antiferromagnetic IrMn layer was fabricated by the light lithography process. When RBCs coupled with several magnetic beads with a diameter of $1{\mu}m$ passed on the micro channel, the movement of RBC + ${\mu}Beads$ is controlled by the electrical AC input signal. The RBC + ${\mu}Beads$ having a micro-magnetic field captured above the GMR-SV device is changed as the output signals for detection status. From these results, the GMR-SV device having the width magnitude of a few micron size can be applied as the biosensor for the analysis of a new magnetic property as the membrane's deformation of RBC coupled to magnetic beads.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.707-710
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• 2004

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). In this paper, we have investigated slurry properties and CMP performance of silicon dioxide (oxide) as a function of different temperature of slurry. Thermal effects on the silica slurry properties such as pH, particle size, conductivity and zeta potential were studied. Moreover, the relationship between the removal rate (RR) with WIWNU and slurry properties caused by changes of temperature were investigated. Therefore, the understanding of these temperature effects provides a foundation to optimize an oxide CMP Process for ULSI multi-level interconnection technology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.557-561
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• 2001

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integraded circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding 1㎛ in size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particles agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectrics(IMD)-CMP process. The filter installation in CMP polisher could reduce defects after IMD-CMP process. As a result of micro-scratch formation, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have concluded that slurry filter lifetime is fixed by the degree of generating defects.

• ETRI Journal
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• v.22 no.1
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• pp.20-29
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• 2000

In this paper, we present a design of video and audio single chip encoder/decoder for portable multimedia application. The single-chip called as video audio signal processor (VASP) consists of a video signal processing block and an audio single processing block. This chip has mixed hardware/software architecture to combine performance and flexibility. We designed the chip by partitioning between video and audio block. The video signal processing block was designed to implement hardware solution of pixel input/output, full pixel motion estimation, half pixel motion estimation, discrete cosine transform, quantization, run length coding, host interface, and 16 bits RISC type internal controller. The audio signal processing block is implemented with software solution using a 16 bits fixed point DSP. This chip contains 142,300 gates, 22 Kbits FIFO, 107 kbits SRAM, and 556 kbits ROM, and the chip size is $9.02mm{\times}9.06mm$ which is fabricated using 0.5 micron 3-layer metal CMOS technology.

• 한국전산유체공학회:학술대회논문집
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• 2003.10a
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• pp.113-115
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• 2003

Droplet impinging into a cavity at micro-scale is one of important fluidic issues for microfabrications, e.g. bio-chip applications and inkjet deposition processes in the PLED panel manufacturing. The droplets generally dispensing from an inkjet head, which contains an array of nozzles, have a volume in several picoliters, while each nozzle jets the droplets into cavities with micron-meter size located on substrates. Due to measurement difficulties at micro-scale, the numerical simulation could serve as an efficient and preliminary way to evaluate the micro-sized droplet impinging behavior into a cavity. The micro-fluidic flow is computed by solving the three-dimensional Navier-Stokes equations through a finite volume discretization. The droplet front is predicted by a volume-of-fluid approach, in which the surface tension is modeled as a function of the fluid concentration. This paper discusses the influence of fluid properties, such as surface tension and fluid viscosity, on micro-fluidic characteristics at different jetting speeds in the deposition process via the proposed numerical approach.

• Proceedings of the Korean Magnestics Society Conference
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• 2010.06a
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• pp.118-119
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• 2010

• Journal of the Korean Ceramic Society
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• v.45 no.12
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• pp.815-820
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• 2008

The microstructure and mechanical properties of $TiB_2/Si$ nanocomposites based on the Ti-Si-B system, consolidated by spark plasma sintering of mechanically alloyed activated nanopowders, have been characterized. Mechanical Alloying was carried out in a planetary ball mill for 180 min with 350 rev $min^{-1}$. The powders were pressed in vacuum at a pressure of 60 MPa, generating a maximum temperature in the graphite mould of $1400^{\circ}C$. Analysis of the synthesized nanocomposites by SEM, XRD and TEM showed them to consist of $TiB_2$ second phase, sub-micron in size, with no third phase. Composites consolidated from powders mechanically alloyed from an initial elemental powder mix of 0.3 mol Si, 0.7 mol Ti, and 2.0 mol B achieved the best relative density (97%) and bending strength (774 MPa); the highest Vickers hardness of 14.7 GPa was achieved for the 0.1-0.9-2.0 mol starting composition.

• Journal of the Korean Ceramic Society
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• v.45 no.7
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• pp.380-386
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• 2008

Optimized volume production of nanoscale phosphor powders synthesized by radio frequency (RF) plasma process was developed for the application to plasma display panels. The nano powders were synthesized by feeding the both solid and liquid type precursors, and nanoparticle phosphors were characterized in terms of particle size, shape, and photoluminescence (PL) intensities. Computer simulation was performed in advance to determine the process parameters, and nano phosphors were evaluated by comparing with current commercial micron-sized phosphor powders. Practical feeding of both solid and liquid type precursor was proved to be effective for volume production.The developed process showed a potential as a production method for red, blue and green phosphor although the PL intensity still needs further improvement.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.960-967
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• 2013

Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as "iso-slope contours" in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.