• 제목/요약/키워드: memory retention

검색결과 258건 처리시간 0.032초

Maxillary expansion with the memory screw: a preliminary investigation

  • Halicioglu, Koray;Kiki, Ali;Yavuz, Ibrahim
    • 대한치과교정학회지
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    • 제42권2호
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    • pp.73-79
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    • 2012
  • Objective: The purpose of this study was to investigate the effects of a newly developed rapid maxillary expansion screw-the memory screw-over 6 months. Methods: Five subjects, aged between 11.7 and 13.75 years, were enrolled in this study. All subjects underwent placement of a maxillary expansion appliance containing superelastic nickel-titanium open-coil springs in its screw bed. The parents of the patients and/or the patients themselves were instructed to activate the expansion screw by 2 quarter-turns 3 times a day (morning, midday, and evening; 6 quarter-turns a day). The mean expansion period was $7.52{\pm}1.04$ days. Dentoskeletal effects of the procedure, including dentoalveolar inclination, were evaluated. Measurements of all the parameters were repeated after 6 months of retention in order to check for relapse. Results: Sella-Nasion-A point (SNA) and Sella-Nasion/Gonion-Menton angles increased, and Sella-Nasion-B point (SNB) angle decreased in all the subjects during the expansion phase. However, they approximated to the initial values at the end of 6 months. On the other hand, the increments in maxillary apical base (Mxr-Mxl) and intermolar widths was quite stable. As expected, some amount of dentoalveolar tipping was observed. Conclusions: The newly developed memory expansion screw offers advantages of both rapid and slow expansion procedures. It widens the midpalatal suture and expands the maxilla with relatively lighter forces and within a short time. In addition, the resultant increments in the maxillary apical base and intermolar width remained quite stable even aft er 6 months of retention.

MFSFET 소자의 전기적 및 리텐션 특성 (Electrical and Retention Properties of MFSFET Device)

  • 정윤근;강성준;정양희
    • 한국정보통신학회논문지
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    • 제11권3호
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    • pp.570-576
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    • 2007
  • 본 연구에서는 field-dependent polarization 모델과 square-law FET 모델을 이용하여 Metal- ferroelectic-semiconductor FET (MFSFET) 소자의 특성을 연구하였다. 게이트 전압에 따른 드레인 전류특성에서 강유전체 박막의 항전압이 0.5 와 1 V 일 때, 각각 1와 2 V의 메모리 창 (memory window) 을 나타내었다. 드레인 전류-드레인 전압곡선에서 두 부분의 문턱전압에 의해 나타난 포화 드레인 전류차이는 게이트 전압이 0, 0.1, 0.2, 0.3 V 일 때, 각각 1.5, 2.7, 4.0, 5.7 mA로 명확한 차이를 나타내었다. PLZT(10/30/70), PLT(10), PZT(30/70) 박막의 이력곡선 시뮬레이션과 리텐션 특성의 fitting 결과를 바탕으로 시간경과 후의 드레인 전류를 분석한 결과, PLZT(10/30/70) 박막이 10년 후에도 약 18%의 포화 전류가 감소하는 가장 우수한 신뢰성을 나타내었다.

태봉음이 콜린성 신경세포손상 백서의 학습 및 기억에 미치는 영향 (Effects of Taebong-eum on Learning and Memory Function in the Cholinergic Cell Damaged Rat)

  • 박종수;지규용;엄현섭
    • 동의생리병리학회지
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    • 제17권1호
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    • pp.50-56
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    • 2003
  • This research was done to make the effective prescription and cope with various senile dementia. So Sprague-Dawley rats were injected with ibotenate to make a damage on learning and memory functions. At first acquisition test and retention rest were done in the Morris water maze. And to evaluate the effects of the sample drug(TBM) on choline acetyltranferase and acetylcholine esterase, immunoreactive measurement and enzymatic activity measuring were carried out. The ibotenic acid were injected to hippocampus CA1 and CA3 area. The results were as following. TBM improved the learning ability in the acquisition test and memory function in the retention test significantly. And TBM increased the level of ChAT which is synthesizing acetylcholine in CA3 area, and at the same time it increased the level of AChE which is resolving acetylcholine. These results show that T8M improved the cholinergic catabolism and anabolism, and the increment of metabolic activity of cholinergic system. In other words, it contributes to the recovery of damaged learning and memory function by ibotenic acid. So it can be concluded that TBM will be helpful to cholinergic brain damage induced by primary or senile reduction of acetylcholine secretive activity.

Basic characteristics of metal-ferroelectric-insulator-semiconductor structure using a high-k PrOx insulator layer

  • Noda, Minoru;Kodama, Kazushi;Kitai, Satoshi;Takahashi, Mitsue;Kanashima, Takeshi;Okuyama, Masanori
    • E2M - 전기 전자와 첨단 소재
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    • 제16권9호
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    • pp.64.1-64
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    • 2003
  • A metal-ferroelectric [SrBi$_2$Ta$_2$O$\_$9/ (SBT)-high-k-insulator(PrOx)-semiconductor(Si) structure has been fabricated and evaluated as a key part of metal-ferroelectric-insulator-semiconductor-field-effect-transistor MFIS-FET memory, aiming to improve the memory retention characteristics by increasing the dielectric constant in the insulator layer and suppressing the depolarization field in the SBT layer. A 20-nm PrOx film grown on Si(100) showed both a high of about 12 and a low leakage current density of less than 1${\times}$ 10e-8 A/$\textrm{cm}^2$ at 105 MV/cm. A 400-nm SBT film prepared on PrOx/Si shows a preferentially oriented (105) crystalline structure, grain size of about 130 nm and subface roughness of 3.2 nm. A capacitance-voltage hysteresis is confirmed on the Pt/SBT/PrOx/Si diode with a memory window of 0.3V at a sweep voltage width of 12 V. The memory retention time was about 1 104s, comparable to the conventional Pt/SBT/SiO$\_$x/N$\_$y/(SiO$\_$N/)/Si. The gradual change of the capacitance indicates that some memory degradation mechanism is different from that in the Pt/SBT/SiON/Si structure.

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터널 산화막 두께에 따른 Al2O3/Y2O3/SiO2 다층막의 메모리 특성 연구 (A Study of the Memory Characteristics of Al2O3/Y2O3/SiO2 Multi-Stacked Films with Different Tunnel Oxide Thicknesses)

  • 정혜영;최유열;김형근;최두진
    • 한국세라믹학회지
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    • 제49권6호
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    • pp.631-636
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    • 2012
  • Conventional SONOS (poly-silicon/oxide/nitride/oxide/silicon) type memory is associated with a retention issue due to the continuous demand for scaled-down devices. In this study, $Al_2O_3/Y_2O_3/SiO_2$ (AYO) multilayer structures using a high-k $Y_2O_3$ film as a charge-trapping layer were fabricated for nonvolatile memory applications. This work focused on improving the retention properties using a $Y_2O_3$ layer with different tunnel oxide thickness ranging from 3 nm to 5 nm created by metal organic chemical vapor deposition (MOCVD). The electrical properties and reliabilities of each specimen were evaluated. The results showed that the $Y_2O_3$ with 4 nm $SiO_2$ tunnel oxide layer had the largest memory window of 1.29 V. In addition, all specimens exhibited stable endurance characteristics (program/erasecycles up to $10^4$) due to the superior charge-trapping characteristics of $Y_2O_3$. We expect that these high-k $Y_2O_3$ films can be candidates to replace $Si_3N_4$ films as the charge-trapping layer in SONOS-type flash memory devices.

An Reliable Non-Volatile Memory using Alloy Nano-Dots Layer with Extremely High Density

  • Lee, Gae-Hun;Kil, Gyu-Hyun;An, Ho-Joong;Song, Yun-Heup
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.241-241
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    • 2010
  • New non-volatile memory with high density and high work-function metal nano-dots, MND (Metal Nano-Dot) memory, was proposed and fundamental characteristics of MND capacitor were evaluated. In this work, nano-dot layer of FePt with high density and high work-function (~5.2eV) was fabricated as a charge storage site in non-volatile memory, and its electrical characteristics were evaluated for the possibility of non-volatile memory in view of cell operation by Fowler-Nordheim (FN)-tunneling. Here, nano-dot FePt layer was controlled as a uniform single layer with dot size of under ~ 2nm and dot density of ${\sim}\;1.2{\times}10^{13}/cm^2$. Electrical measurements of MOS structure with FePt nano-dot layer shows threshold voltage window of ~ 6V using FN programming and erasing, which is satisfied with operation of the non-volatile memory. Furthermore, this structure provides better data retention characteristics compared to other metal dot materials with the similar dot density in our experiments. From these results, it is expected that this non-volatile memory using FePt nano-dot layer with high dot density and high work-function can be one of candidate structures for the future non-volatile memory.

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Resistive Switching Characteristics of Amorphous GeSe ReRAM without Metalic Filaments Conduction

  • 남기현
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.368.1-368.1
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    • 2014
  • We proposed amorphous GeSe-based ReRAM device of metal-insulator-metal (M-I-M) structure. The operation characteristics of memory device occured unipolar switching characteristics. By introducing the concepts of valance-alternation-pairs (VAPs) and chalcogen vacancies, the unipolar resistive switching operation had been explained. In addition, the current transport behavior were analyzed with space charge effect of VAPs, Schottky emission in metal/GeSe interface and P-F emission by GeSe bulk trap in mind. The GeSe ReRAM device of M-I-M structure indicated the stable memory switching characteristics. Furthermore, excellent stability, endurance and retention characteristics were also verified.

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단결정립 PZT 박막의 피로 및 정보 유지 특성에 관한 연구 (A Study on the Fatigue and Data Retention Characteristics of Single Grained PZT Thin Films)

  • 이장식;주승기
    • 대한전자공학회논문지SD
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    • 제37권5호
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    • pp.1-8
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    • 2000
  • PZT seed에 의해 형성된 단결정립 PZT 박막을 이용하여 Pt/PZT/Pt 구조에서의 피로(fatigue) 및 정보 유지(data retention) 특성에 관하여 연구하였다. 피로 특성의 경우 1㎒의 주파수에서 ±10V의 square wave를 인가하여 측정한 결과 2×10/sup 11/ cycle 동안 전혀 특성의 변화가 관찰되지 않았으며, 정보 유지 능력의 경우 상온에서 30000초 동안 기억 상태의 변화가 없었으며, 고온에서의 retention 측정으로 계산된 활성화 에너지로부터 구한 상온에서의 20% 잔류분극간 감소를 보이는 시간은 6.6×10/sup 7/ 년이었다.

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SONOS 플래시 메모리의 구조에 관한 특성연구

  • 양승동;오재섭;박정규;정광석;김유미;윤호진;이가원
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.13-13
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    • 2010
  • In this paper, the electrical characteristics of Fin-type SONOS (Silicon-Oxide-Nitride-Oxide-Silicon) flash memory and Planar-type SONOS flash memory are analyzed. Compared to the Planar-type SONOS device, Fin-type SONOS device shows a good short channel effect immunity. Moreover, memory characteristics such as PIE speed, Endurance and Retention of FinFET SONOS flash are batter than that of conventional Planar-type SONOS flash memory.

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5V-Programmable E$^2$PROM을 위한 비휘발성 MONOS 기억소자의 Scale-down (scale-down of the Nonvolatile MONOS Memory Devices for the 5V-Programmable E$^2$PROM)

  • 이상배;이상은;김선주;서광열
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1994년도 추계학술대회 논문집
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    • pp.33-36
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    • 1994
  • The characteristics of the nonvolatile MONOS memory devices as the nitride thickness is scaled down while maintaining constant tunneling oxide thickness and blocking oxide thickness have been investigated in order to obtain the 5V-programmable E$^2$PROM. We have found that 1V memory window for a 5V programming voltage and 10 year data retention can be achieved in the scaled MONOS memory devices with a 50 blocking oxide, a 57 nitride and a 19 tunneling oxide.