Thermo-mechanical Behavior Characteristic Analysis of $B^2it$ (Buried Bump Interconnection Technology) in PCB(Printed Circuit Board)
(인쇄회로기판 $B^2it$ (Buried Bump Interconnection Technology) 구조의 열적-기계적 거동특성 해석)
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- Journal of the Microelectronics and Packaging Society
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- 제16권2호
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- pp.43-50
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- 2009