• 제목/요약/키워드: low band gap

검색결과 305건 처리시간 0.029초

산화아연 나노핵의 조작을 통한 산화아연 나노로드의 제어 (Artificial Control of ZnO Nanorods via Manipulation of ZnO Nanoparticle Seeds)

  • 신경식;이삼동;김상우
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.399-399
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    • 2008
  • Synthesis and characterization of ZnO structure such as nanowires, nanorods, nanotube, nanowall, etc. have been studied to multifunctional application such as optical, nanoscale electronic and chemical devices because it has a room-temperature wide band gap of 3.37eV, large exiton binding energy(60meV) and various properties. Various synthesis methods including chemical vapor deposition (CVD), physical vapor deposition, electrochemical deposition, micro-emulsion, and hydrothermal approach have been reported to fabricate various kinds of ZnO nanostructures. But some of these synthesis methods are expensive and difficult of mass production. Wet chemical method has several advantage such as simple process, mass production, low temperature process, and low cost. In the present work, ZnO nanorods are deposited on ITO/glass substrate by simple wet chemical method. The process is perfomed by two steps. One-step is deposition of ZnO seeds and two-step is growth of ZnO nanorods on substrates. In order to form ZnO seeds on substrates, mixture solution of Zn acetate and Methanol was prepared.(one-step) Seed layers were deposited for control of morpholgy of ZnO seed layers by spin coating process because ZnO seeds is deposited uniformly by centrifugal force of spin coating. The seed-deposited samples were pre-annealed for 30min at $180^{\circ}C$ to enhance adhesion and crystallinnity of ZnO seed layer on substrate. Vertically well-aligned ZnO nanorods were grown by the "dipping-and-holding" process of the substrates into the mixture solution consisting of the mixture solution of DI water, Zinc nitrate and hexamethylenetetramine for 4 hours at $90^{\circ}C$.(two-step) It was found that density and morphology of ZnO nanorods were controlled by manipulation of ZnO seeds through rpm of spin coating. The morphology, crystallinity, optical properties of the grown ZnO nanostructures were carried out by field-emission scanning electron microscopy, high-resolution electron microscopy, photoluminescence, respectively. We are convinced that this method is complementing problems of main techniques of existing reports.

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Solution-Processed Nontoxic and Abundant $Cu_2ZnSnS_4$ for Thin-Film Solar Cells

  • 문주호
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.65-65
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    • 2012
  • Copper zinc tin sulfide ($Cu_2ZnSnS_4$, CZTS) is a very promising material as a low cost absorber alternative to other chalcopyrite-type semiconductors based on Ga or In because of the abundant and economical elements. In addition, CZTS has a band-gap energy of 1.4~1.5eV and large absorption coefficient over ${\sim}10^4cm^{-1}$, which is similar to those of $Cu(In,Ga)Se_2$(CIGS) regarded as one of the most successful absorber materials for high efficient solar cell. Most previous works on the fabrication of CZTS thin films were based on the vacuum deposition such as thermal evaporation and RF magnetron sputtering. Although the vacuum deposition has been widely adopted, it is quite expensive and complicated. In this regard, the solution processes such as sol-gel method, nanocrystal dispersion and hybrid slurry method have been developed for easy and cost-effective fabrication of CZTS film. Among these methods, the hybrid slurry method is favorable to make high crystalline and dense absorber layer. However, this method has the demerit using the toxic and explosive hydrazine solvent, which has severe limitation for common use. With these considerations, it is highly desirable to develop a robust, easily scalable and relatively safe solution-based process for the fabrication of a high quality CZTS absorber layer. Here, we demonstrate the fabrication of a high quality CZTS absorber layer with a thickness of 1.5~2.0 ${\mu}m$ and micrometer-scaled grains using two different non-vacuum approaches. The first solution-processing approach includes air-stable non-toxic solvent-based inks in which the commercially available precursor nanoparticles are dispersed in ethanol. Our readily achievable air-stable precursor ink, without the involvement of complex particle synthesis, high toxic solvents, or organic additives, facilitates a convenient method to fabricate a high quality CZTS absorber layer with uniform surface composition and across the film depth when annealed at $530^{\circ}C$. The conversion efficiency and fill factor for the non-toxic ink based solar cells are 5.14% and 52.8%, respectively. The other method is based on the nanocrystal dispersions that are a key ingredient in the deposition of thermally annealed absorber layers. We report a facile synthetic method to produce phase-pure CZTS nanocrystals capped with less toxic and more easily removable ligands. The resulting CZTS nanoparticle dispersion enables us to fabricate uniform, crack-free absorber layer onto Mo-coated soda-lime glass at $500^{\circ}C$, which exhibits a robust and reproducible photovoltaic response. Our simple and less-toxic approach for the fabrication of CZTS layer, reported here, will be the first step in realizing the low-cost solution-processed CZTS solar cell with high efficiency.

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반응소결법으로 제조한 n형 β-SiC의 열전특성 (Thermoelectric Properties of the Reaction Sintered n-type β-SiC)

  • 배철훈
    • 한국산학기술학회논문지
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    • 제20권3호
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    • pp.29-34
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    • 2019
  • SiC는 큰 에너지 밴드 갭을 갖고, 불순물 도핑에 의해 p형 및 n형 전도의 제어가 용이해서 고온용 전자부품 소재로 활용이 가능한 재료이다. 특히 $N_2$ 분위기, $2000^{\circ}C$에서 ${\beta}-SiC$ 분말로부터 제조한 다공질 n형 SiC 반도체의 경우, $800{\sim}1000^{\circ}C$에서의 도전율 값이 단결정 SiC와 비교해서 비슷하거나 오히려 높은 값을 나타내었으며, 반면에 열전도율은 치밀한 SiC 세라믹스와 비교시 1/10~1/30 정도로 낮은 값을 나타내었다. 본 연구에서는 소결온도를 낮추기 위해 n형 ${\beta}-SiC$에 함침 시킨 polycarbosilane (PCS)의 열분해에 의한 반응소결 공정 ($1400{\sim}1600^{\circ}C$)으로 다공질 소결체를 제작하였다. 함침 및 소결공정($N_2$ 분위기, $1600^{\circ}C$, 3시간)을 반복함에 따라 상대밀도는 크게 증가하지 않았지만 Seebeck 계수 및 도전율은 크게 증가하였다. 본 연구에서의 열전변환 효율을 반영하는 power factor는 고온에서 상압소결 공정으로 제작한 다공질 SiC 반도체에 비해 1/100~1/10 정도 작게 나타났지만, 미세구조 및 캐리어 밀도를 정밀하게 제어하면, 본 연구에서의 반응소결 공정으로 제작한 SiC 반도체의 열전물성은 크게 향상될 것으로 판단된다.

휘발성 유기화합물 저감을 위한 금속산화물 기반 광촉매-활성탄 복합체 개발 (Development of Metal Oxide-based Photocatalyst Coated on Activated Carbon for Removing Volatile Organic Compounds)

  • 고재락;장예원;전호영;배환진;이주현;최창호
    • 청정기술
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    • 제28권4호
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    • pp.285-292
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    • 2022
  • 대기 오염의 주요 원인인 휘발성유기화합물(VOCs)의 배출을 저감 하기 위한 방법으로 주로 활성탄 흡착탑이 활용되고 있다. 하지만 활성탄의 짧은 수명과 잦은 교체 주기의 단점이 있어 이를 극복하기 위한 다양한 기술이 개발되고 있으며, 광촉매-활성탄 복합체는 이러한 활성탄의 단점을 극복할 수 있는 방법임을 입증하였다. 광촉매-활성탄 복합체는 활성탄 표면에 금속산화물 광촉매를 코팅하여 광촉매 효과와 활성탄의 흡착능력 효과를 동시에 확보할 수 있는 휘발성유기화합물 저감 물질이다. 미세유체공정을 이용하여 ZnO, 은(Ag) 나노입자를 동시에 합성한 후 실시간으로 ZnO와 은(Ag) 나노입자 용액을 활성탄이 채워진 충진층 반응기에 주입하여 Ag-ZnO 활성탄 복합체를 합성하였다. 합성 반응시간에 따른 광촉매 복합체의 증착양을 분석했으며, 다양한 분석 방법을 통해 광촉매가 활성탄의 기공을 막지 않고 활성탄 표면에 선택적으로 증착 되었음을 확인하였다. 톨루엔 가스백 시험과 흡착 파괴시간 시험을 통해 광촉매-활성탄 복합체가 순수한 활성탄보다 우수한 저감 효과와 지속성을 가지는 것을 확인하였다. 본 연구를 통해 개발된 공정은 광촉매-활성탄 복합체를 효율적으로 생산할 수 있는 방법으로 대량 생산을 위한 스케일 업 공정을 통해 국내의 VOCs 저감 물질 가격 경쟁력을 높일 수 있을 것으로 사료된다.

High quality topological insulator Bi2Se3 grown on h-BN using molecular beam epitaxy

  • Park, Joon Young;Lee, Gil-Ho;Jo, Janghyun;Cheng, Austin K.;Yoon, Hosang;Watanabe, Kenji;Taniguchi, Takashi;Kim, Miyoung;Kim, Philip;Yi, Gyu-Chul
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.284-284
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    • 2016
  • Topological insulator (TI) is a bulk-insulating material with topologically protected Dirac surface states in the band gap. In particular, $Bi_2Se_3$ attracted great attention as a model three-dimensional TI due to its simple electronic structure of the surface states in a relatively large band gap (~0.3 eV). However, experimental efforts using $Bi_2Se_3$ have been difficult due to the abundance of structural defects, which frequently results in the bulk conduction being dominant over the surface conduction in transport due to the bulk doping effects of the defect sites. One promising approach in avoiding this problem is to reduce the structural defects by heteroepitaxially grow $Bi_2Se_3$ on a substrate with a compatible lattice structure, while also preventing surface degradation by encapsulating the pristine interface between $Bi_2Se_3$ and the substrate in a clean growth environment. A particularly promising choice of substrate for the heteroepitaxial growth is hexagonal boron nitride (h-BN), which has the same two-dimensional (2D) van der Waals (vdW) layered structure and hexagonal lattice symmetry as $Bi_2Se_3$. Moreover, since h-BN is a dielectric insulator with a large bandgap energy of 5.97 eV and chemically inert surfaces, it is well suited as a substrate for high mobility electronic transport studies of vdW material systems. Here we report the heteroepitaxial growth and characterization of high quality topological insulator $Bi_2Se_3$ thin films prepared on h-BN layers. Especially, we used molecular beam epitaxy to achieve high quality TI thin films with extremely low defect concentrations and an ideal interface between the films and substrates. To optimize the morphology and microstructural quality of the films, a two-step growth was performed on h-BN layers transferred on transmission electron microscopy (TEM) compatible substrates. The resulting $Bi_2Se_3$ thin films were highly crystalline with atomically smooth terraces over a large area, and the $Bi_2Se_3$ and h-BN exhibited a clear heteroepitaxial relationship with an atomically abrupt and clean interface, as examined by high-resolution TEM. Magnetotransport characterizations revealed that this interface supports a high quality topological surface state devoid of bulk contribution, as evidenced by Hall, Shubnikov-de Haas, and weak anti-localization measurements. We believe that the experimental scheme demonstrated in this talk can serve as a promising method for the preparation of high quality TI thin films as well as many other heterostructures based on 2D vdW layered materials.

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High Performance Flexible Inorganic Electronic Systems

  • 박귀일;이건재
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.115-116
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    • 2012
  • The demand for flexible electronic systems such as wearable computers, E-paper, and flexible displays has increased due to their advantages of excellent portability, conformal contact with curved surfaces, light weight, and human friendly interfaces over present rigid electronic systems. This seminar introduces three recent progresses that can extend the application of high performance flexible inorganic electronics. The first part of this seminar will introduce a RRAM with a one transistor-one memristor (1T-1M) arrays on flexible substrates. Flexible memory is an essential part of electronics for data processing, storage, and radio frequency (RF) communication and thus a key element to realize such flexible electronic systems. Although several emerging memory technologies, including resistive switching memory, have been proposed, the cell-to-cell interference issue has to be overcome for flexible and high performance nonvolatile memory applications. The cell-to-cell interference between neighbouring memory cells occurs due to leakage current paths through adjacent low resistance state cells and induces not only unnecessary power consumption but also a misreading problem, a fatal obstacle in memory operation. To fabricate a fully functional flexible memory and prevent these unwanted effects, we integrated high performance flexible single crystal silicon transistors with an amorphous titanium oxide (a-TiO2) based memristor to control the logic state of memory. The $8{\times}8$ NOR type 1T-1M RRAM demonstrated the first random access memory operation on flexible substrates by controlling each memory unit cell independently. The second part of the seminar will discuss the flexible GaN LED on LCP substrates for implantable biosensor. Inorganic III-V light emitting diodes (LEDs) have superior characteristics, such as long-term stability, high efficiency, and strong brightness compared to conventional incandescent lamps and OLED. However, due to the brittle property of bulk inorganic semiconductor materials, III-V LED limits its applications in the field of high performance flexible electronics. This seminar introduces the first flexible and implantable GaN LED on plastic substrates that is transferred from bulk GaN on Si substrates. The superb properties of the flexible GaN thin film in terms of its wide band gap and high efficiency enable the dramatic extension of not only consumer electronic applications but also the biosensing scale. The flexible white LEDs are demonstrated for the feasibility of using a white light source for future flexible BLU devices. Finally a water-resist and a biocompatible PTFE-coated flexible LED biosensor can detect PSA at a detection limit of 1 ng/mL. These results show that the nitride-based flexible LED can be used as the future flexible display technology and a type of implantable LED biosensor for a therapy tool. The final part of this seminar will introduce a highly efficient and printable BaTiO3 thin film nanogenerator on plastic substrates. Energy harvesting technologies converting external biomechanical energy sources (such as heart beat, blood flow, muscle stretching and animal movements) into electrical energy is recently a highly demanding issue in the materials science community. Herein, we describe procedure suitable for generating and printing a lead-free microstructured BaTiO3 thin film nanogenerator on plastic substrates to overcome limitations appeared in conventional flexible ferroelectric devices. Flexible BaTiO3 thin film nanogenerator was fabricated and the piezoelectric properties and mechanically stability of ferroelectric devices were characterized. From the results, we demonstrate the highly efficient and stable performance of BaTiO3 thin film nanogenerator.

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Growth and characterization of MgZnO grown on R-plane sapphire substrate by plasma-assisted molecular beam epitaxy

  • Han, Seok-Kyu;Kim, Jung-Hyun;Hong, Soon-Ku;Lee, Jae-Wook;Lee, Jeong-Yong;Kim, Ho-Jong;Song, Jung-Hoon;Yao, Takafumi
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.114-114
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    • 2009
  • ZnO has received considerable attention due to its potential applicability to optoelectronic devices such as ultraviolet-light emitting diodes (UVLEDs) and laser diodes (LDs). As well known, however, polar ZnO with the growth direction along the c-axis has spontaneous and piezoelectric polarizations that will result in decreased quantum efficiency. Recently, nonpolar ZnO has been studied to avoid such a polarization effect. In order to realize applications of nonpoar ZnO-based films to LEDs, growth of high quality alloys for quantum well structures is one of the important tasks that should be solved. $Mg_xZn_{1-x}O$ and $Cd_xZn_{1-x}O$ is ones of most promising alloys for this application because the alloys of ZnO with MgO and CdO provide a wide range of band-gap engineering spanning from 2.4 to 7.8 eV. In this study, we investigated on $Mg_xZn_{1-x}O$ films grown with various Mg/Zn flux ratios The films were grown on R-plane sapphire substrates by plasma-assisted molecular beam epitaxy (PAMBE). we investigated on $Mg_xZn_{1-x}O$ films grown with various Mg/Zn flux ratios. The films were grown on R-plane sapphire substrates by plasma-assisted molecular beam epitaxy (PAMBE). With the relatively low Mg/Zn flux ratios, a typical striated anisotropic surface morphology which was generally observed from the nonpolar (11-20) ZnO film on r-plane sapphire substrates. By increasing the Mg/Zn flux ratio, however, additional islands were appeared on the surface and finally the surface morphology was entirely changed, which was generally observed for the (0001) polar ZnO films by losing the striated morphology. Investigations by X-ray $\Theta-2{\Theta}$ diffraction revealed that (0002) and (10-11) ZnO planes are appeared in $Mg_xZn_{1-x}O$ films by increasing the Mg/Zn flux ratio. Further detailed investigation by transmission electron microscopy (TEM) and photoluminescence (PL) will be discussed.

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CCD 이미지 센서용 Power Management IC 설계 (A Design of Power Management IC for CCD Image Sensor)

  • 구용서;이강윤;하재환;양일석
    • 전기전자학회논문지
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    • 제13권4호
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    • pp.63-68
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    • 2009
  • 본 논문에서는 CCD 이미지 센서용 PMIC를 제안한다. CCD 이미지 센서는 온도에 민감하다. 일반적으로 낮은 효율을 갖는 PMIC에 의해 열이 발생된다. 발생된 열은 CCD 이미지 센서의 성능에 영향을 미치므로 높은 효율을 갖는 PMIC를 사용함으로써 최소화 시켜야 한다. 고효율의 PMIC개발을 위해 입력단은 동기식 step down DC-DC컨버터로 설계하였다. 제안한 PMIC의 입력범위는 5V~15V이고 PWM 제어방식을 사용하였다. PWM 제어회로는 삼각파 발생기, 밴드갭 기준 전압회로, 오차 증폭기, 비교기로 구성된다. 삼각파 발생기는 1.2MHz의 발진 주파수를 가지며, 비교기는 2단 연산 증폭기로 설계되었다. 오차 증폭기는 40dB의 DC gain과 $77^{\circ}$ 위상 여유를 갖도록 설계하였다. step down DC-DC 컨버터의 출력은 Charge pump의 입력으로 연결된다. Charge pump의 출력은 PMIC의 출력단인 LDO의 입력으로 연결된다. PWM 제어회로와 Charge pump 그리고 LDO로 구성된 PMIC는 15V, -7.5V, 5V, 3.3V의 출력전압을 갖는다. 제안한 PMIC는 0.35um 공정으로 설계하였다.

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Ga2O3와 4H-SiC Vertical DMOSFET 성능 비교 (Performance Comparison of Vertical DMOSFETs in Ga2O3 and 4H-SiC)

  • 정의석;김영재;구상모
    • 전기전자학회논문지
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    • 제22권1호
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    • pp.180-184
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    • 2018
  • 산화갈륨 ($Ga_2O_3$)과 탄화규소 (SiC)는 넓은 밴드 갭 ($Ga_2O_3-4.8{\sim}4.9eV$, SiC-3.3 eV)과 높은 임계전압을 갖는 물질로서 높은 항복 전압을 허용한다. 수직 DMOSFET 수평구조에 비해 높은 항복전압 특성을 갖기 때문에 고전압 전력소자에 많이 적용되는 구조이다. 본 연구에서는 2차원 소자 시뮬레이션 (2D-Simulation)을 사용하여 $Ga_2O_3$와 4H-SiC 수직 DMOSFET의 구조를 설계하였으며, 항복전압과 저항이 갖는 trade-off에 관한 파라미터를 분석하여 최적화 설계하였다. 그 결과, 제안된 4H-SiC와 $Ga_2O_3$ 수직 DMOSFET구조는 각각 ~1380 V 및 ~1420 V의 항복 전압을 가지며, 낮은 게이트 전압에서의 $Ga_2O_3-DMOSFET$이 보다 낮은 온-저항을 갖고 있지만, 게이트 전압이 높으면 4H-SiC-DMOSFET가 보다 낮은 온-저항을 갖을 수 있음을 확인하였다. 따라서 적절한 구조와 gate 전압 rating에 따라 소자 구조 및 gate dielectric등에 대한 심화 연구가 요구될 것으로 판단된다.

다공질 SiC 반도체와 Ag계 합금의 접합 (Junction of Porous SiC Semiconductor and Ag Alloy)

  • 배철훈
    • 한국산학기술학회논문지
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    • 제19권3호
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    • pp.576-583
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    • 2018
  • 탄화규소는 실리콘과 비교시 큰 에너지 밴드 갭을 갖고, 불순물 도핑에 의해 p형 및 n형 전도의 제어가 용이해서 고온용 전자부품 소재로 활용이 가능한 재료이다. 특히 ${\beta}$-SiC 분말로부터 제조한 다공질 n형 SiC 세라믹스의 경우, $800{\sim}1000^{\circ}C$에서 높은 열전 변환 효율을 나타내었다. SiC 열전 변환 반도체를 응용하기 위해서는 변환 성능지수도 중요하지만 $800^{\circ}C$ 이상에서 사용할 수 있는 고온용 금속전극 또한 필수적이다. 일반적으로 세라믹스는 대부분의 보편적인 용접용 금속과는 우수한 젖음을 갖지 못 하지만, 활성 첨가물을 고용시킨 합금의 경우, 계면 화학종들의 변화가 가능해서 젖음과 결합의 정도를 증진시킬 수 있다. 액체가 고체 표면을 적시면 액체-고체간 접합면의 에너지는 고체의 표면에너지 보다 작아지고 그 결과 액체가 고체 표면에서 넓게 퍼지면서 모세 틈새로 침투할 수 있는 구동력을 갖게 된다. 따라서 본 연구에서는 비교적 낮은 융점을 갖는 Ag를 이용해서 다공질 SiC 반도체 / Ag 및 Ag 합금 / SiC 및 알루미나 기판간의 접합에 대해 연구하였고, Ag-20Ti-20Cu 필러 메탈의 경우 SiC 반도체의 고온용 전극으로 적용 가능할 것으로 나타났다.