• 한국컴퓨터산업교육학회:학술대회논문집
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• 2003.11a
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• pp.79-82
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• 2003

The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2$ and $Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.9
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• pp.523-526
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• 2000

A dual gate trench emitter IGBT structure is proposed and studied numerically using the device simulator MEDICI. The on-state forward voltage drop latch-up current density turn-off time and breakdown voltage of the proposed structure are compared with those of the conventional DMOS-IGBT and trench gate IGBT structures. The proposed structure forms an additional channel and increases collector current level resulting in reduction of on -state forward voltage drop. In addition the trench emitter increases latch-up current density by 148% in comparison with that for the conventional DMOS-IGBT and by 83% compared with that for the trench gate IGBT without degradation in breakdown voltage when the half trench gate width(Tgw) and trench emitter depth(Ted) are fixed at $1.5\mum\; and\; 2\mum$, respectively

• Journal of Power Electronics
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• v.12 no.6
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• pp.947-953
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• 2012

The latch-up immunity of the high voltage power clamps used in high voltage ESD protection devices is very becoming important in high-voltage applications. In this paper, a stacking structure with a high holding voltage and a high failure current is proposed and successfully verified in 0.18um CMOS and 0.35um BCD technology to achieve the desired holding voltage and the acceptable failure current. The experimental results show that the holding voltage of the stacking structure can be larger than the operation voltage of high-voltage applications. Changes in the characteristics of the stacking structure under high temperature conditions (300K-500K) are also investigated.

• Journal of IKEEE
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• v.18 no.1
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• pp.25-30
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• 2014

In this paper, SCR(Silicon Controlled Rectifier)-based ESD(Electrostatic Discharge) protection circuit for power clamp is proposed. In order to improve latch-up immunity caused by low holding voltage of the conventional SCR, it is modified by inserting n+ floating region and n-well, and extending p+ cathode region in the p-well. The resulting ESD capability of our proposed ESD protection circuit reveals a high latch-up immunity due to the high holding voltage. It is verified that electrical characteristics of proposed ESD protection circuit by Synopsys TCAD simulation tool. According to the simulation results, the holding voltage is increased from 4.61 V to 8.75 V while trigger voltage is increased form 27.3 V to 32.71 V, respectively. Compared with the conventional SCR, the proposed ESD protection circuit has the high holding voltage with the same triggering voltage characteristic.

• Journal of IKEEE
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• v.19 no.2
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• pp.265-270
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• 2015

In this paper, we proposed a dual-directional SCR (silicon-controlled rectifier) based ESD (electrostatic discharge) protection circuit. In comparison with conventional SCR, this ESD protection circuit can provide an effective protection against ESD pulses in the two opposite directions, so the ESD protection circuit can be discharged in two opposite direction. The proposed circuit has a higher holding voltage characteristic than conventional SCR. These characteristic enable to have latch-up immunity under normal operating conditions as well as superior full chip ESD protection. it was analyzed to figure out electrical characteristics in term of individual design parameters. They are investigated by using the Synopsys TCAD simulator. In the simulation results, it has trigger voltage of 6.5V and holding voltage increased with different design parameters. The holding voltage of the proposed circuit changes from 2.1V to 6.3V and the proposed circuit has symmetrical I-V characteristic for positive and negative ESD pulse.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.11
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• pp.483-490
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• 2016

Automobile door latch is a fine design and assembly techniques are required in order to produce them in a small component assembly shape such as a spring, injection products, a small-sized motor. The door latch is fixed to not open the door of the car plays an important role it has a direct impact on the driver's safety. In this study, during trimming of the terminals of the connector main components of the car door latch, reduce rollover and conducted a research to find a suitable effective shear surface. Using the Taguchi method with orthogonal array of Finite Element Analysis and optimal Design of Experiments were set up parameters for the shear surface quality of the car door latch connector terminals. The design parameters used in the analysis is the clearance, the radius, and the blank holding force, the material of the connector terminal is a C2600. Trimming process optimum conditions suggested by the analysis has been verified by experiments, the shear surface shape and dimensions of a final product in good agreement with forming analysis results.Taguchi method from the above results in the optimization for the final rollover and effective shear surface improved for a vehicle door latch to the connector terminal can be seen that the applicable and useful for a variety of metal forming processes other than the trimming process is determined to be applicable.

• Journal of IKEEE
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• v.21 no.3
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• pp.234-239
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• 2017

In this paper, we propose an ESD (Electrostatic Discharge) protection circuit based on a new structure of SCR (Silicon Controlled Rectifier) embedded with PMOS structure. The proposed ESD protection circuit has a built-in PMOS structure and has a latch-up immunity characteristic and an improved tolerance characteristic. To verify the characteristics of the proposed ESD protection circuit and to analyze its operating characteristics, we compared and analyzed the characteristics of the existing ESD protection circuit using TCAD simulation. Simulation results show that the proposed protection ESD protection circuit has superior latch-up immunity characteristics like the existing SCR-based ESD protection device HHVSCR (High Holding Voltage SCR). Also, according to the results of the HBM (Human Body Model) maximum temperature test, the proposed ESD protection circuit has a maximum temperature value of 355K, which is about 20K lower than the existing HHVSCR 373K. In addition, the proposed ESD protection circuit with improved electrical characteristics is designed by applying N-STACK technology. As a result of the simulation, the proposed ESD protection circuit has a holding voltage characteristic of 2.5V in a single structure, and the holding voltage increased to 2-STACK 4.2V, 3-STACK 6.3V, 4-STACK 9.1V.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.4
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• pp.273-279
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• 2000

Electrical repair method which has replaced laser repair method can replace defective cell by redundancy’s in the redundancy scheme of conventional high density memory. This electrical repair circuit consists of the antifuse program/read/latch circuits, a clock generator a negative voltage generator a power-up pulse circuit a special address mux and etc. The measured program voltage of made antifuses was 7.2~7.5V and the resistance of programmed antifuses was below 500 Ω. The period of clock generator was about 30 ns. The output voltage of a negative voltage generator was about 4.3 V and the current capacity was maximum 825 $mutextrm{A}$. An antifuse was programmed using by the electric potential difference between supply-voltage (3.3 V) and output voltage generator. The output pulse width of a power-up pulse circuit was 30 ns ~ 1$mutextrm{s}$ with the variation of power-up time. The programmed antifuse resistance required below 44 ㏀ from the simulation of antifuse program/read/latch circuit. Therefore the electrical repair circuit behaved safely and the yield of high densitymemory will be increased by using the circuit.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.33 no.11C
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• pp.963-969
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• 2008

This paper presents 6bit 100MHz Interpolation Flash Analog-to-Digital Converter, which can be applied to the Receiver of Wireless Tele-communication System. The 6bit 100MHz Flash Analog-to-Digital Converter simplifies and integrates S-R latch which multiplies as the resolution increases. Whereas the conventional NAND based S-R latch needed eight MOS transistors, this Converter was designed with only six, which makes the Dynamic Power Dissipation of the A/D Converter reduced up to 12.5%. The designed A/D Converter went through $0.18{\mu}m$ CMOS n-well 1-poly 6-metal process to be a final product, and the final product has shown 282mW of power dissipation with 1.8V of Supply Voltage, 100MHz of conversion rate. And 35.027dBc, 31.253dB SFDR and 4.8bits, 4.2bits ENOB with 12.5MHz, 50MHz of each input frequency.

• Journal of Multimedia Information System
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• v.5 no.2
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• pp.139-142
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• 2018

This work presents a novel architecture of phase locked loop (PLL) with the current compensating scheme to improve phase noise characteristic. The proposed PLL has two charge pumps (CP), main-CP (MCP) and sub-CP (SCP). The smaller SCP current with same time duration but opposite direction of UP/DN MCP current is injected to the loop filter (LF). It suppresses the voltage fluctuation of LF. The PLL has a novel voltage controlled oscillator (VCO) consisting of a voltage controlled resistor (VCR) and the three-stage ring oscillator with latch type delay cells. The VCR linearly converts voltage into current, and the latch type delay cell has short active on-time of transistors. As a result, it improves phase noise characteristic. The proposed PLL has been fabricated with $0.35{\mu}m$ 3.3 V CMOS process. Measured phase noise at 1 MHz offset is -103 dBc/Hz resulting in 3 dBc/Hz phase noise improvement compared to the conventional PLL.