• 제목/요약/키워드: junction processes

검색결과 96건 처리시간 0.036초

Depth-dependent EBIC microscopy of radial-junction Si micropillar arrays

  • Kaden M. Powell;Heayoung P. Yoon
    • Applied Microscopy
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    • 제50권
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    • pp.17.1-17.9
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    • 2020
  • Recent advances in fabrication have enabled radial-junction architectures for cost-effective and high-performance optoelectronic devices. Unlike a planar PN junction, a radial-junction geometry maximizes the optical interaction in the three-dimensional (3D) structures, while effectively extracting the generated carriers via the conformal PN junction. In this paper, we report characterizations of radial PN junctions that consist of p-type Si micropillars created by deep reactive-ion etching (DRIE) and an n-type layer formed by phosphorus gas diffusion. We use electron-beam induced current (EBIC) microscopy to access the 3D junction profile from the sidewall of the pillars. Our EBIC images reveal uniform PN junctions conformally constructed on the 3D pillar array. Based on Monte-Carlo simulations and EBIC modeling, we estimate local carrier separation/collection efficiency that reflects the quality of the PN junction. We find the EBIC efficiency of the pillar array increases with the incident electron beam energy, consistent with the EBIC behaviors observed in a high-quality planar PN junction. The magnitude of the EBIC efficiency of our pillar array is about 70% at 10 kV, slightly lower than that of the planar device (≈ 81%). We suggest that this reduction could be attributed to the unpassivated pillar surface and the unintended recombination centers in the pillar cores introduced during the DRIE processes. Our results support that the depth-dependent EBIC approach is ideally suitable for evaluating PN junctions formed on micro/nanostructured semiconductors with various geometry.

Improved Rs Monitoring for Robust Process Control of High Energy Well Implants

  • Kim, J.H.;Kim, S.;Ra, G.J.;Reece, R.N.;Bae, S.Y.
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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    • pp.109-112
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    • 2007
  • In this paper we describe a robust method of improving precision in monitoring high energy ion implantation processes. Ion implant energy accuracy was measured in the device manufacturing process using an unpatterned implanted layer on an intrinsic p-type silicon wafer. To increase Rs sensitivity to energy at the well implant process, a PN junction structure was formed by P-well and deep N-well implants into the p-type Si wafer. It was observed that the depletion layer formed by the PN junction was very sensitive to energy variation of the well implant. Conclusively, it can be recommended to monitor well implant processes using the Rs measurement method described herein, i.e., a PN junction diode structure since it shows excellent Rs sensitivity to variation caused by energy difference at the well implant step.

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경계항복 억제를 위한 평판형 InP/InGaAs 애벌랜치 포토다이오드의 곡률 효과 분석 (Investigation of Curvature Effect on Planar InP/InGaAs Avalanche Photodiodes for Edge Breakdown Suppression)

  • 이봉용;정지훈;윤일구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.206-209
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    • 2002
  • With the progress of semiconductor processing technology, avalanohe photodiodes (APDs) based on InP/InGaAs are used for high-speed optical receiver modules. Planar-type APDs give higher reliability than mesa-type APDs. However, Planar-type APDs are struggled with a problem of intensed electric field at the junction curvature, which causes edge breakdown phenomena at the junction periphery. In this paper, we focused on studying the effects of junction curvature for APDs performances by different etching processes followed by single diffusion to from p-n junction. The performance of each process is characterized by observing electric field profiles and carrier generation rates. From the results, it can be understood to predict the optimum structure, which can minimize edge breakdown and improve the manufacturability.

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Hippo-YAP/TAZ signaling in angiogenesis

  • Park, Jeong Ae;Kwon, Young-Guen
    • BMB Reports
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    • 제51권3호
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    • pp.157-162
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    • 2018
  • Angiogenesis is a complex, multistep process involving dynamic changes in endothelial cell (EC) shapes and behaviors, especially in specialized cell types such as tip cells (with active filopodial extensions), stalk cells (with less motility) and phalanx cells (with stable junction connections). The Hippo-Yes-associated protein (YAP)/ transcription activator with PDZ binding motif (TAZ) signaling plays a critical role in development, regeneration and organ size by regulating cell-cell contact and actin cytoskeleton dynamics. Recently, with the finding that YAP is expressed in the front edge of the developing retinal vessels, Hippo-YAP/TAZ signaling has emerged as a new pathway for blood vessel development. Intriguingly, the LATS1/2-mediated angiomotin (AMOT) family and YAP/TAZ activities contribute to EC shapes and behaviors by spatiotemporally modulating actin cytoskeleton dynamics and EC junction stability. Herein, we summarize the recent understanding of the role of Hippo-YAP/TAZ signaling in the processes of EC sprouting and junction maturation in angiogenesis.

저온 공정에 의한 a-Si:H/c-Si 이종접합 태양전지 제조 및 동작특성 분석 (Process and Performance Analysis of a-Si:H/c-Si Hetero-junction Solar Sells Prepared by Low Temperature Processes)

  • 임충현;이정철;전상원;김상균;김석기;김동섭;양수미;강희복;이보영;송진수;윤경훈
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2005년도 춘계학술대회
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    • pp.196-200
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    • 2005
  • In this work, we investigated simple Aㅣ/TCO/a-Si:H(n)/c-Si(p)/Al hetero-junction solar cells prepared by low temperature processes, unlike conventional thermal diffused c-Si solar cells. a-Si:H/c-Si hetero-junction solar cells are processed by low temperature deposition of n-type hydrogenated amorphous silicon (a-Si:H) films by plasma-enhanced chemical vapor deposition on textured and flat p-type silicon substrate. A detailed investigation was carried out to acquire optimization and compatibility of amorphous layer, TCO (ZnO:Al) layer depositions by changing the plasma process parameters. As front TCO and back contact, ZnO:Al and AI were deposited by rf magnetron sputtering and e-beam evaporation, respectively. The photovoltaic conversion efficiency under AMI.5 and the quantum efficiency on $1cm^2$ sample have been reported. An efficiency of $12.5\%$ is achieved on hetero-structure solar cells based on p-type crystalline silicon.

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Transparent Conductor-embedding Si for High-performing Hetrojunction Photoelectric Devices

  • Kim, Joondong
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.444.2-444.2
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    • 2014
  • Transparent conductors (TCs) are typically applied as an ohmic contact layer for photoelectric devices. Recent researches have illuminated a unique rectifying-junction design between a transparent conductor and a semiconductor layer. This approach may lead a significant reduction of device-fabrication steps and cost. A high-performing heterojunction device is presented, which provided significant photoelectric responses. This covers the fabrication processes, rectifying-junction formations and device analyses.

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이온 주입 공정시 발생한 실리콘 내 결함의 제어를 통한 $p^+-n$ 초 저접합 형성 방법 (Formation of ultra-shallow $p^+-n$ junction through the control of ion implantation-induced defects in silicon substrate)

  • 이길호;김종철
    • 한국진공학회지
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    • 제6권4호
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    • pp.326-336
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    • 1997
  • 트랜지스터의 소오스/드레인 접합 특성에 가장 큰 영향을 미치는 인자는 이온 주입 시 발생한 실리콘 내에 발생한 결합이라는 사실에 착안하여, 기존 소오스/드레인 접합 형성 공정과 다른 새로운 방식을 도입하여 이온 주입에 의해 생긴 결함의 제어를 통해 고품질 초 저접합 $p^+$-n접합을 형성하였다. 기존의 $p^+$소오스/드레인 접합 형성 공정은 $^{49}BF_2^+$ 이온 주입 후 층간 절연막들인 TEOS(Tetra-Ethyl-Ortho-Silicate)막과 BPSG(Boro-Phospho-Silicate-Glass)막을 증착 후 BPSG막 평탄화를 위한 furnace annealing 공정으로 진행된다. 본 연구에서는 이러한 기존 공정과는 달리 층간 절연막 증착 전 저온 RTA첨가 방법, $^{49}BF_2^+$$^{11}B^+$ 을 혼합하여 이온 주입하는 방법, 그리고 이온 주입 후 잔류 산화막을 제거하고 MTO(Medium temperature CVD oxide)를 증착하는 방법을 제시하 였으며, 각각의 방법은 모두 이온 주입에 의한 실리콘 내 결합 농도를 줄여 기존의 방법보 다 더 우수한 양질의 초 저접합을 형성할 수 있었다.

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Numerical Simulation of Thermal Fluctuation of Hot and Cold Fluids Mixing in a Tee Junction

  • Gao, Kai;Lu, Tao
    • International Journal of Advanced Culture Technology
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    • 제3권2호
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    • pp.171-178
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    • 2015
  • In this work, mixing processes of hot and cold fluids of three different jet types are predicted by large-eddy simulation (LES) on FLUENT platform. Temperature at different positions of internal wall and mixing conditions of T-junctions at different times are obtained, then the simulated normalized mean and root-mean square (RMS) temperature, temperature contour and velocity vector of every case are compared. The results indicate that, the mixing regions in the tee junction is related to the jet type, and temperature fluctuations on the pipe wall in the type of the deflecting jet is the least.

치아 계면 층 DEJ(Dental Enamel Junction)의 파괴 거동에 관한 수치해석적 연구 (A Study on the Fracture Behavior of Tooth Interfacial Layer, DEJ (Dental Enamel Junction))

  • 다네사와 미시라;유승현;정웅락
    • 한국생산제조학회지
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    • 제20권3호
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    • pp.284-291
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    • 2011
  • Numerical experiments on biological interfacial layer, DEJ by finite element software ABAQUS have been conducted to study its fracture behavior including crack bridging / arresting characteristics in the model. Crack growth simulation has been carried out by numerical tool, XFEM, devoted to study cracks and discontinuities. The fracture toughness of DEJ has been estimated before and after crack bridging. The implications of bridging in numerical study of fracture behavior of DEJ-like biological interface have been discussed. It has been observed that the results provided by the numerical studies without proper accommodation of bridging phenomenon can mislead. This study can be helpful for understanding the DEJ-like biological interface in terms of its fracture toughness, an important material characteristics. This property of the material is an important measure that has to be taken care during design and manufacturing processes.

박막 P+-n 접합 형성과 보론 확산 시뮬레이터 설계 (Shallow P+-n Junction Formation and the Design of Boron Diffusion Simulator)

  • 김재영;이충근;김보라;홍신남
    • 한국전기전자재료학회논문지
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    • 제17권7호
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    • pp.708-712
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    • 2004
  • Shallow $p^+-n$ junctions were formed by ion implantation and dual-step annealing processes. The dopant implantation was performed into the crystalline substrates using BF$_2$ ions. The annealing was performed with a rapid thermal processor and a furnace. FA+RTA annealing sequence exhibited better junction characteristics than RTA+FA thermal cycle from the viewpoint of junction depth and sheet resistance. A new simulator is designed to model boron diffusion in silicon. The model which is used in this simulator takes into account nonequilibrium diffusion, reactions of point defects, and defect-dopant pairs considering their charge states, and the dopant inactivation by introducing a boron clustering reaction. Using initial conditions and boundary conditions, coupled diffusion equations are solved successfully. The simulator reproduced experimental data successfully.