• Title/Summary/Keyword: interface treatment

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Solid-Fluid Interface Treatment in Conjugate Heat Transfer Analysis using Unstructured Grid System (비정렬격자계를 사용하는 복합열전달 해석에서의 고-액 계면 처리방법)

  • Myong Hyon-Kook
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.18 no.5
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    • pp.451-457
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    • 2006
  • Conjugate heat transfer (CHT) is the simultaneous, coupled heat transfer within a fluid and an adjoining solid, and the interface treatment plays an important role in its analysis, particularly when using unstructured grid system. In the present paper a new solid-fluid interface treatment in CHT analysis is presented and applied to two typical CHT problems, i.e. natural convections in both concentric thick-walled cylinders and cavity with a centered solid body. The present interface treatment for unstructured mesh clearly demonstrates the same accuracy and robustness as that for typical structured mesh.

Effect of Heat Treatment on Microstructure and Mechanical Properties of Electromagnetic Duo-Cast Al Hybrid Material

  • Suh, Jun Young;Park, Sung Jin;Kwon, Do-Kyun;Chang, Si Young
    • Korean Journal of Materials Research
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    • v.28 no.9
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    • pp.499-505
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    • 2018
  • This investigates the microstructure and mechanical properties of Al hybrid material prepared by electromagnetic duo-casting to determine the effect of heat treatment. The hybrid material is composed of an Al-Mg-Si alloy, pure Al and the interface between the Al-Mg-Si alloy and pure Al. It is heat-treated at 373, 573 and 773K for 1h and T6 treated (solution treatment at 773K for 1h and aging at 433K for 5h). As the temperature increases, the grain size of the Al-Mg-Si alloy in the hybrid material increases. The grain size of the T6 treated Al-Mg-Si alloy is similar to that of one heat-treated at 773K for 1h. The interface region where the micro-hardness becomes large from the pure Al to the Al-Mg-Si alloy widens with an increasing heat temperature. The hybrid material with a macro-interface parallel to the tensile direction experiences increased tensile strength, 0.2 % proof stress and the decreased elongation after T6 heat treatment. On the other hand, in the vertical direction to the tensile direction, there is no great difference with heat treatment. The bending strength of the hybrid material with a long macro-interface to the bending direction is higher than that with a short macro-interface, which is improved by heat treatment. The hybrid material with a long macro-interface to the bending direction is fractured by cracking through the eutectic structure in the Al-Mg-Si alloy. However, in the hybrid material with a short macro-interface, the bending deformation is observed only in the limited pure Al.

Characterizations of Interface-state Density between Top Silicon and Buried Oxide on Nano-SOI Substrate by using Pseudo-MOSFETs

  • Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.5 no.2
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    • pp.83-88
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    • 2005
  • The interface-states between the top silicon layer and buried oxide layer of nano-SOI substrate were developed. Also, the effects of thermal treatment processes on the interface-state distributions were investigated for the first time by using pseudo-MOSFETs. We found that the interface-state distributions were strongly influenced by the thermal treatment processes. The interface-states were generated by the rapid thermal annealing (RTA) process. Increasing the RTA temperature over $800^{\circ}C$, the interface-state density considerably increased. Especially, a peak of interface-states distribution that contributes a hump phenomenon of subthreshold curve in the inversion mode operation of pseudo-MOSFETs was observed at the conduction band side of the energy gap, hut it was not observed in the accumulation mode operation. On the other hand, the increased interface-state density by the RTA process was effectively reduced by the relatively low temperature annealing process in a conventional thermal annealing (CTA) process.

The Effect of the Heat Treatment Conditions on the Strength and Microstructure in the Bonded Interface in Dissimilar Metal and Aluminum Alloy (AL합금과 이종금속의 접합계면에서의 미세조직과 접합강도에 미치는 열처리조건의 영향)

  • Kim, Ick-Soo;Choi, Byung-Young;Kang, Chang-Yong
    • Journal of the Korean Society for Heat Treatment
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    • v.16 no.1
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    • pp.2-9
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    • 2003
  • The aluminum alloy which is light and has excellent thermal conductivity and iron base alloy that is remarkable heat-resistece and wear resistence properties were bonded together. The bond was created between a stationary and a rotating member by using the frictional heat generated between them while subjected to high normal forces on the interface of Al alloy and iron base alloy. The microstructure of the bonded interface of friction welding and the strength in the bonded interface formed under various bonding conditions were examined through TEM, SEM with EDX and triple bending test. In interface of bonding materials formed after various heat treatment, bonding strength was substantially different, resulting from formation of intermetallic compound or softening during annealing.

An Assessment of Bonding Shear Performance of Ultra-high-performance Concrete Regarding Interface Treatment (표면처리방법에 따른 초고성능 콘크리트의 전단부착성능 평가 연구)

  • Jang, Hyun-O;Park, Jin-Ho;Lee, Han-Seung
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2016.10a
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    • pp.81-82
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    • 2016
  • The present study aims to derive optimal interface treatment conditions for emulating a monolithic construction. The joints in this construction are formed through the bonding shear evaluation method during the placement of ultra-high-performance concrete (UHPC) and normal strength concrete (NSC). The evaluation items include push-off tests for homogeneous UHPC + UHPC and heterogeneous NSC + UHPC. The experimental samples comprised a monolithic placement as the baseline, two levels for the separated placement according to the compression strength of concrete, and five levels for the interface treatment. The increase in the number of grooves and their cross-sectional areas only slightly influenced the bonding shear performance. The optimal interface treatment method for the homogeneous UHPC + UHPC construction grooves was at least 30mm. The heterogeneous NSC + UHPC construction should utilize waterjet roughening to expose the aggregate for the increased roughness.

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Effect oh Heat Treatment on Breakdown Properties in the Joint Interface of Power Cables (전력케이블 절연접속계면의 절연파괴 특성에 미치는 열처리 효과)

  • 이창종;김진수;박강식;한상옥
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.7
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    • pp.502-507
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    • 1998
  • The purpose of this study is to investigate the breakdown properties in joint interface of power cables with heat treatment. The specimens have the structure of XLPE/EPDM interface like the joint of distribution power cable. The breakdown characteristics of the SLPE/EPDM joint were studied with crosslinking by=products. AC breakdown voltages were measured with heat treatment time and interfacial materials and crosslinking by-products as testing factors. This study has shown that crosslinking by-product gases play an important role at the insulation properties of cable joints by heating. The dielectric strength shows the lowest values at 4 hours heat treatment. The AC breakdown strength in the untreated sample was increased with heat treatment time.

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Improvement of dielectric and interface properties of Al/CeO$_2$/Si capacitor by using the metal seed layer and $N_2$ plasma treatment (금속씨앗층과 $N_2$ 플라즈마 처리를 통한 Al/CeO$_2$/Si 커패시터의 유전 및 계면특성 개선)

  • 임동건;곽동주;이준신
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.326-329
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    • 2002
  • In this paper, we investigated a feasibility of cerium oxide(CeO$_2$) films as a buffer layer of MFIS(metal ferroelectric insulator semiconductor) type capacitor. CeO$_2$ layer were Prepared by two step process of a low temperature film growth and subsequent RTA (rapid thermal annealing) treatment. By app1ying an ultra thin Ce metal seed layer and N$_2$ Plasma treatment, dielectric and interface properties were improved. It means that unwanted SiO$_2$ layer generation was successfully suppressed at the interface between He buffer layer and Si substrate. The lowest lattice mismatch of CeO$_2$ film was as low as 1.76% and average surface roughness was less than 0.7 m. The Al/CeO$_2$/Si structure shows breakdown electric field of 1.2 MV/cm, dielectric constant of more than 15.1 and interface state densities as low as 1.84${\times}$10$\^$11/ cm$\^$-1/eV$\^$-1/. After N$_2$ plasma treatment, the leakage current was reduced with about 2-order.

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Fabrication and Interface Properties of TiNi/6061Al Composite (TiNi 형상기억합금을 이용한 복합재료의 제조 및 계면 특성)

  • Kim, Sun-Guk;Lee, Jun-Hui
    • Korean Journal of Materials Research
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    • v.9 no.4
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    • pp.419-427
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    • 1999
  • TiNi shape memory alloy was shape memory heat-treated and investigated its mechanical properties with the variation of prestrain. Also 6061 Al matrix composites with TiNi shape memory alloy fiber as reinforcement have been fabricated by Permanent Mold Casting to investigate the microstructures and interface properties. Yield stress of TiNi wire was the most high in the case of before heat-treatment and then decreased as increasing heat-treatment time. In each heat-treatment condition, the yield stress of TiNi wire was not changed with increasing the amount of prestrain. The interface bonding of TiNi/6061Al composite was fine. There was a 2$\mu\textrm{m}$ thickness of diffusion reaction layer at the interface. We could find out that this diffusion reaction layer was made by the mutual diffusion. The diffusion rate from Al base to TiNi wire was faster than that of reverse diffusion and the amount of the diffusion was also a little more than that of reverse.

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On Numerical Treatment of Pressure Gradient at the Interface Between a Homogeneous Fluid and a Porous Medium (순수유체와 다공성물질의 경계면에서 압력구배의 수치적 처리에 관하여)

  • Kim I. S.;Nam J. H.;Kim C.-J.
    • Journal of computational fluids engineering
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    • v.4 no.3
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    • pp.28-34
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    • 1999
  • The objective of this study is to present a numerical treatment of the pressure gradient when control volumes are sharing the interface between a homogeneous fluid and a porous medium. Two possible approaches, e.g. linear interpolation and extrapolation, are considered, and they are applied to the case of a steady and two-dimensional curved channel flow which is partially filled with a porous medium. It was found that the linear extrapolation produces a continuous velocity-field at the interface and thus is recommended. On the contrary, the linear interpolation entails a discontinuous velocity field at the interface, thereby warning its use in connection with the Brinkman-Forchheimer-extended Darcy flow model.

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Analysis of Interface trap density with treatment of gate dielectric layer of OTFT's (OTFT의 게이트 절연층의 표면처리에 따른 계면트랩 분석)

  • Jeong, Seung-Hyeon;Kim, Se-Min;Song, Chung-Kun;Xu, Yong Xian
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.383-384
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    • 2008
  • In this paper, we extract interface trap density with treatment of gate dielectric of OTFT's. Interface trap densities in this paper were extracted from transfer curves. We obtained interface trap densities in pentacene / PVP interface Non-treated device has $1.4{\times}10^{12}cm^{-2}eV^{-1}$ Dit and treated device has $1.1{\times}10^{12}cm^{-2}eV^{-1}$ Dit.

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