• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.51-58
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• 1999

The effects of glass composition on the wettability and reactivity with $ZrO_2$substrate was evaluated and fabrication variables and glass compositions was investigated. Various glass compositions was investigated. Alkaline earth silicate glass show good wettability and lower viscosity and crystallization of glass could be prevented by $B_2O_3$.The sealant glass begin to wet on $ZrO_2$substrate below $900^{\circ}C$ and porosity occurred in various glass compositions, the crystallization and porosity in the glass could be prevented by the addition of flux into glass composition. But flowability and reactivity of glass with $ZrO_2$substrate was enhanced. Processing variables should be optimized to reduce the porosity by enhancing the sintering of glass powder. Many silicate glasses were investigated for the applications of high temperature sealants. Wetting and bonding of glass was good enough to seal together between $ZrO_2$and other ceramic components of SOFC. But porosity and reaction layer were occurred in the sealant glass. It will be possible to produce glass sealant without porosity and reaction layer at the interface by optimization of processing variable and modify the glass compositions. In present study, wettability of glass-filler composite was investigated. The porosity, shape of filler and interfacial reactions of sealant glass with fillers were examined.

• Composites Research
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• v.31 no.3
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• pp.88-93
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• 2018

In this study, damaged composite laminates were repaired by a stepped patch repair method using halloysite nanotube(HNT) and milled carbon(MC) reinforced composite materials with different amount of the particles. And the mechanical and structural effects of the particles on the interface between the damaged and repair surfaces were analyzed. At this time, after exposing them to a harsh environment of high temperature and humidity for a long time, the recovery rate of the material properties relative to the material forming the damaged plate was compared. As a result, at $70^{\circ}C$ high temperature distilled water, the hygroscopicity of the HNT/GFRP composites was significantly different from that of the MC/GFRP composites. Especially, 0.5, 1 wt. % HNT was added, the moisture absorption rate was the lowest and this was the factor that contributed to the mechanical strength increase. On the other hand, MC showed a high hygroscopic resistance only with a small amount, and the strength was different according to the action direction of the load, and the addition amount was also different.

• Composites Research
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• v.27 no.4
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• pp.168-173
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• 2014

The optimum condition of glass fiber/epoxy composites was investigated according to mixing ratio of two epoxy matrices. Novolac type epoxy and isocyanate modified epoxy were used as composites matrix. Based on chemical composition of mixing matrix, optimum mixing ratio of epoxy resins was obtained through various experiments. In order to investigate thermal stability and interface of epoxy resin, glass transition temperature was observed by DSC instrument, and static contact angle was measured by reflecting microscope. Change of IR peak and $T_g$ was conformed according to different epoxy mixing ratio. After fabrication of glass fiber/epoxy composites, tensile, compression, and flexural properties were tested by UTM by room and high temperature. The composites exhibited best mechanical properties when epoxy mixing ratio was 1:1.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.9 no.3
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• pp.111-118
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• 2004

An ocean buoy was deployed 10 km off Donghae city, Korea at a depth of 130 m to measure meteorological (air pressure, air temperature, wind speed, wind gust, wind direction, relative humidity) and oceanographic data (water properties and currents in the whole column) in real-time. The buoy recorded a maximum wind gust of 25 m/s (10 minutes' average speed of 20 m/s) and a minimum air pressure of 980 hPa when the eye of typhoon Maemi passed by near the Uljin city, Korea at 03:00 on 13 September 2003. The wave height reached maximum of 9 m with the significant wave height of 4 m at 04:00 (1 hour after the passage of Maemi). The currents measured near the surface reached up to about 100 cm/s at 13:00 (10 hours after the passage of Maemi). The mixed layer (high temperature and low salinity) thickness, which was accompanied by strong southward current, gradually increased from 20 m to 40 m during the 10 hours. A simple two layer model for the response to an impulsive alongshore wind over an uniformly sloping bottom developed by Csanady (1984) showed reasonable estimates of alongshore and offshore currents and interface displacement for the condition of typhoon Maemi at the buoy position (x=8.15 km) during the 10 hours.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.671-678
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• 2001

All solid-state thin film micro supercapacitor, which consists of $RuO_2$/LiPON/$RuO_2$ multi layer structure, was fabricated on Pt/Ti/Si substrate using a $RuO_2$ electrode. Bottom $RuO_2$ electrode was grown by dc reactive sputtering system with increasing $O_2/[Ar+O_2]$ ratio at room temperature, and a LiPON electrolyte film was subsequently deposited on the bottom $RuO_2$ electrode at pure nitrogen ambient by rf reactive sputtering system. Room temperature charge-discharge measurements based on a symmetric $RuO_2$/LiPON/$RuO_2$ structure clearly demonstrates the cyclibility dependence on the microstructure of the $RuO_2$ electrode. Using both glancing angle x-ray diffraction (GXRD) and transmission electron microscopy (TEM) analysis, it was found that the microstructure of the $RuO_2$ electrode was dependent on the oxygen flow ratio. In addition, x- ray photoelectron spectroscopy(XPS) examination shows that the Ru-O binding energy is affected by increasing oxygen flow ratio. Furthermore, TEM and AES depth profile analysis after cycling demonstrates that the interface layer formed by interfacial reaction between LiPON and $RuO_2$ act as a main factor in the degradation of the cyclibility of the thin film micro-supercapacitor.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.2
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• pp.247-253
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• 1996

Microscopic analysis has been performed in order to investigate effects of the microstructure of the starting feed rods on the morphology of the S-L interface and the stability of the molten zone during single crystal growth of $SrTiO_{3}$ using a floating zone method. Undoped and $Fe_{2}O_{3}$ doped $SrTiO_{3}$ doped $SrTiO_{3}$ specimens, sintered at the different temperatures have been used. In the case of the feed rods sintered at the lower temperature($1400^{\circ}C$), the poor densification made the stability of the molten zone difficult to maintain. The feed rods sintered at the higher temperature ($1600^{\circ}C$) exhibited the higher density but their molten zone was difficult to maintain due to the presence of the abnormally grown grains. It is concluded that the uniform grain size distribution of the feed rod is the critical factor to maintain the stable molten zone and therefore to give optimum growth condition during FZ single crystal growth.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.22 no.3
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• pp.115-121
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• 2012

Sapphire single crystals have been highlighted for epitaxial gallium nitride films in high-power laser and light emitting diode (LED) industries. Among the many crystal growth methods, the Kyropoulos process is an excellent commercial method for growing larger, high-optical-quality sapphire crystals with fewer defects. Because the properties and growth behavior of sapphire crystals are influenced largely by the temperature distribution and convection of molten sapphire during the manufacturing process, accurate predictions of the thermal fields and melt flow behavior are essential to design and optimize the Kyropoulos crystal growth process. In this study, computational fluid dynamic simulations were performed to examine the effects of the crucible geometry aspect ratio on melt convection during Kyropoulos sapphire crystal growth. The results through the evolution of various growth parameters on the temperature and velocity fields and convexity of the crystallization interface based on finite volume element simulations show that lower aspect ratio of the crucible geometry can be helpful for the quality of sapphire single crystal.

• Korean Journal of Materials Research
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• v.9 no.7
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• pp.747-752
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• 1999

The interfacial reaction and joint properties of Sn-3.5Ag/Cu and Sn-3.5Ag-1Zn/Cu joint were studied. Modified double lap shear solder joints of Sn-3.5Ag and Sn-3.5Ag- lZn solder were aged for 60days at $100^{\circ}C$ and $150^{\circ}C$ and then loaded to failure in shear. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-lZn at the aging temperature of $150^{\circ}C$ Through the SEM/EDS analysis of solder joint, it was proved that intermatallic layer was $Cu_{6}Sn_5$ phase and aged specimens showed that intermatallic layer grew in proportion to $t_{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_{6}Sn_{5}$ phase formed at the side of substrate and $Cu_{5}Zn_{8}$ phase formed at the other side in double layer. The shear strength of the Sn-3.5Ag/Cu joint improved by addition of IZn. The strength of the joint increases with strain rate and decreases with aging temperature

• International Journal of Highway Engineering
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• v.5 no.2 s.16
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• pp.15-24
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• 2003

The performance of waterproofing system (WPS) is known to be a function of many complex interaction of material factors, design details, and the quality of construction, but it is mainly determined by the bond strength, which is measured by tensile adhesive strength (TAS) test. to the concrete bridge deck. In this research, eight waterproofing membranes were selected from commercial market and the tensile adhesive characteristics of the WPS on concrete bridge deck were investigated in view of various factor in asphalt pavement. The factors include type of asphalt mixture, pavement thickness, paving temperature and influence of wheel loading. TAS test of different asphalt pavement types showed that TAS of WPS under SMA (Stone Mastic Asphalt) pavement was greater than that under dense asphalt pavement. TAS of sheet membranes was improved as the compaction temperature of asphalt concrete increase, but TAS of liquid membranes were not. The influence of thickness of pavement val minimal with given laboratory test condition. TAS of sheet membranes after wheel tracking test were in the order of the sites under wheel path (UWP), before wheel tracking (BWT) and nearby wheel path (NWP). Since TAS of the same WPS of UWP was higher than TAS of BWT, wheel loading had function of pressing WPS resulting in higher adhesive strength. But liquid membranes were variable on types. The feature of detached interface after TAS test showed that sheet types were all detached in between deck concrete and WPS, and liquid types were detached in between asphalt pavement and WPS.