• Title/Summary/Keyword: information barrier

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Implementing Accessible Themed Roads through the Analysis of Electric Wheelchair User Experiences

  • Je-Seung Woo;Ji-Hui Nam;Sun-Gi Hong
    • Journal of the Korea Society of Computer and Information
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    • v.28 no.11
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    • pp.147-154
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    • 2023
  • In this paper, we propose a barrier-free course route navigation service named "Theme Road" aimed at improving the mobility and convenience for elderly electric wheelchair users with walking disabilities. To achieve this goal, we conducted a user survey through shadowing and in-depth interviews to gather insights on the challenges experienced by elderly electric wheelchair users. We identified potential solutions for each inconvenience through co-creation workshops, resulting in a set of design considerations and app functionalities. Using persona development and service scenarios, we designed and implemented the "Theme Road" service as a dedicated navigation application for barrier-free course navigation. Unlike conventional route navigation and mapping services, our study stands out by offering a unique approach that combines recommended destinations and safe routes based on experiential analysis from elderly electric wheelchair users.

An Improved Binomial Method using Cell Averages for Option Pricing

  • Moon, Kyoung-Sook;Kim, Hong-Joong
    • Industrial Engineering and Management Systems
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    • v.10 no.2
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    • pp.170-177
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    • 2011
  • We present an improved binomial method for pricing financial deriva-tives by using cell averages. After non-overlapping cells are introduced around each node in the binomial tree, the proposed method calculates cell averages of payoffs at expiry and then performs the backward valuation process. The price of the derivative and its hedging parameters such as Greeks on the valuation date are then computed using the compact scheme and Richardson extrapolation. The simulation results for European and American barrier options show that the pro-posed method gives much more accurate price and Greeks than other recent lattice methods with less computational effort.

Characteristics of the aluminum thisn films for the prevention of copper oxidation (구리 금속선의 산화 방지를 위한 알루미늄 박막의 산화 방지 특성)

  • 이경일;민경익;주승기;라관구;김우식
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.10
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    • pp.108-113
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    • 1994
  • The characteristics of the oxidation prevention layers for the copper metallization were investigated. The thin films such as Cr, TiN and Al were used as the oxidation prevention layers for copper. Ultra thin aluminum films were found to prevent the oxidation of copper up to the highest oxidation annealing temperature among the barrier layers examined in this study. It was found that oxygen did not diffuse into copper through aluminum films because of the aluminum oxide layer formed on the aluminum surface and the ultra thin aluminum film could be a good oxidation barrier layer for the copper metallization.

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Non-Destructive Evaluation for Material of Thermal Barrier Coatings (단열 코팅재료의 비파괴 평가기법)

  • Lee Chul-Ku;Kim Tae-Hyung
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.14 no.1
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    • pp.44-51
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    • 2005
  • Material degradation is a multibillion-dollar problem which affects all the industries amongst others. The last decades have seen the development of newer and more effective techniques such as Focused-ion beam(FIB), Transmission electron microscopy(TEM), Secondary-ion mass spectroscopy(SIMS), auger electron spectroscopy(AES), X-ray Photoelectron spectroscopy(XPS) , Electrochemical impedance spectroscopy(EIS), Photo- stimulated luminescence spectroscopy(PSLS), etc. to study various forms of material degradation. These techniques are now used routinely to obtain information on the chemical state, depth profiling, composition, stress state, etc. to understand the degradation behavior. This paper describes the use of these techniques specifically applied to materials degradation and failure analysis.

Electrical Characteristics of n-GaN Schottky Diode fabricated by using Electrochemical Metallization (Electrochemical Metallization방법을 이용한 GaN Schottky Diode의 제작과 전기적 특성 향상 및 분석)

  • ;Daejun Fu
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.205-208
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    • 2001
  • Schottky barrier diodes are fabricated on a intrinsic GaN(4${\mu}{\textrm}{m}$) epitaxial structure grown by rf plasma molecular beam epitaxy (MBE) on sapphire substrates. First, We make Ohmic electrodes (Ti/Al/Ti/Au) by evaporator. Next, we contact RuO$_2$ by dipping in the solution (RuCl$_3$.HClO$_4$), and then we deposit Ni/Au on the surface of RuO$_2$ by evaporator. We study the electrical characteristics of GaN Schottky barrier diodes made by these methods. Measurements are C-V, I-V, SEM, EDX, and XRD for the characteristics of devices. Thickness of RuO$_2$ layer depends on supplied voltage and dipping time. Device of thinner RuO$_2$ layer have a good Schottky characteristics compare with device of thicker RuO$_2$ layer

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Analysis of Electronic Materials Using Transmission Electron Microscopy (TEM) (전자현미경을 이용한 전자재료분석)

  • Kim, Ki-Bum
    • Applied Microscopy
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    • v.24 no.4
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    • pp.132-144
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    • 1994
  • The application of TEM in investigating the evolution of microstructure during solid phase crystallization of the amorphous Si, $Si_{1-x}Ge_x,\;and\;Si_{1-x}Ge_x/Si$ films deposited on $SiO_2$ substrate, in identifying the failure mechanism of the TiN barrier layer in the Cu-metallization scheme, and in comparing the microstructure of the as-deposited Cu-Cr and Cu-Ti alloy films are discussed. First, it is identified that the evolution of microstructure in Si and $Si_{1-x}Ge_x$ alloy films strongly depends on the concentration of Ge in the film. Second, the failure mechanism of the TiN diffusion barrier in the Cu-metallization is the migration of the Cu into the Si substrate, which results in the formation of a dislocation along the Si {111} plane and precipitates (presumably $Cu_{3}Si$) around the dislocation. Finally, the microstructure of the as-deposited Cu-Cr and Cu-Ti alloy films is also quite different in these two cases. From these several cases, we demonstrate that the information which we obtained using TEM is critical in understanding the behavior of materials.

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Schottky Barrier Field-Effect Transistor의 소자의 특성 및 성능 비교분석

  • Kim, Gyeong-Tae;Park, Hyeok-Jun;U, Ji-Yun;Park, Yeong-Min
    • Proceeding of EDISON Challenge
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    • 2017.03a
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    • pp.372-375
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    • 2017
  • Metal-oxide-semiconductor Field-Effect transistor (MOSFET)을 대체할 기술로서 제안된 Schottky Barrier MOSFET (SB-MOSFET)가 제시되고 있다. 본 연구에서는 SB-MOSFET와 MOSFET을 다양한 소자 파라미터를 변화시킴으로서 양자역학적 전하수송 계산을 바탕으로 특성을 분석한다. MOSFET과 SB-MOSFET은 채널 두께 ($T_{Si}$)가 감소함에 따라 전류량은 증가하고 SS와 DIBL은 증가하였고 Overlap에서는 SS와 DIBL이 커지고 Underlap에서는 작아짐을 보였고 SB-MOSFET는 특히 그 폭이 컸다. 또한 SB 높이가 낮을수록 SB-MOSFET의 전류량이 증가하고 SS는 감소하였고 마찬가지로 Source와 Drain doping concentration이 낮을수록 MOSFET의 전류량은 증가하고 SS는 감소하였다. MOSFET과 SB-MOSFET의 경향은 대체로 비슷하나 변화량의 차이 등이 있었다.

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Characteristics of polysilicon capacitor as insulator formation method (절연막 형성 방법에 따른 다결정실리콘 캐패시터의 특성)

  • 노태문;이대우;김광수;강진영;이덕문
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.7
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    • pp.58-68
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    • 1995
  • Polysilicon capacitors with pyrogenic oxide and TEOX oxide as insulators were fabricated to develop capacitors which can be applied to analog CMOS IC, and the characteristics of the capacitors were compared with each other. The morphology of bottom polysilicon in pyrogenic oxide capacitor is degraded due to the generaged protuberances of the polysilicon grain during oxidataion. The polysilican capacitor with pyrogenic oxide of 57 nm thickness showed that the effective potential barrier height of 0.45 eV is much less than that of MOS capacitor (3.2 eV)when the top electrode is biased with a positive volgate. The morphology of the polysilicon capacitor with TEOS oxide, however, was not degraded during oxide deposition by LPCVD. The polysilicon capacitor with TEOS oxide of 54 nm thickness showed the effective potential barrier height of 1.28 eV when the top electrode is biased with a negative voltage. Therefore, it is concluded that the polysilicon capacitor with TEOS oxide is more applicable to analog CMOS IC than the pyrogenic oxide polysilicon capacitor.

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Fabrication of Schottky diodes for RFID tag integration using Standard $0.18{\mu}m$ CMOS process (RFID tag 집적화를 위한 $0.18{\mu}m$ 표준 CMOS 공정을 이용한 쇼트키 다이오드의 제작)

  • Shim, Dong-Sik;Min, Young-hun
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.591-592
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    • 2006
  • Schottky diodes for Radio-frequency identification (RFID) tag integration on chip were designed and fabricated using Samsung electronics System LSI standard $0.18{\mu}m$ CMOS process. Schottky diodes were designed as interdigitated fingers array by CMOS layout design rule. 64 types of Schottky diode were designed and fabricated with the variation of finger width, length and numbers with a $0.6{\mu}m$ guard ring enclosing n-well. Titanium was used as Schottky contact metal to lower the Schottky barrier height. Barrier height of the fabricated Schottky diode was 0.57eV. DC current - voltage measurements showed that the fabricated Schottky diode had a good rectifying properties with a breakdown voltage of -9.15 V and a threshold voltage of 0.25 V.

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Study on Noise Behavior of GaAs SBGFET (GaAs SBGFET의 잡음동작에 관한 연구)

  • 박한규
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.14 no.3
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    • pp.6-11
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    • 1977
  • The noise behavior of the Schottky Barrier Gate FET has been investigated by the use of noise equivalent circuit. It has been found that an additional noise source has to be taken into account in the GaAs SBGFET's biased in the pinch-off region; the intervalley scattering noise and the hot electron noise. In this paper, a noise equivalent circuit has been used to determine the noise parameter which was taken into account influence of the saturation velocity of carrier and parasitic resistance.

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