• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.10 no.7
• /
• pp.1266-1274
• /
• 2006

A non-overlap boosted-clock charge pump(NBCCP) with internal pumping capacitor, an advantageous circuit from a minimizing point of TFT-LCD driver IC module, is proposed in this paper. By using the non-overlap boosted-clock swinging in 2VDC voltage, the number of pumping stages is reduced to half and a back current of pumping charge from charge pumping node to input stage is also prevented compared with conventional cross-coupled charge pump with internal pumping capacitor. As a result, pumping current of the proposed NBCCP circuit is increased more than conventional cross-coupled charge pump, and a layout area is decreased. A proposed DC-DC converter for TFT-LCD driver IC is designed with $0.18{\mu}m$ triple-well CMOS process and a test chip is in the marking.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.13 no.11
• /
• pp.5465-5470
• /
• 2012

FPGA(Field Programmable Gate Array) devices are widely used due to their merits in circuit development time, and development cost. Among various FPGA technologies, SRAM-based FPGAs have large cell capacity so that they are attractive for complex circuit design and their reconfigurability. However, they are weak in space environment where radiation energy particles cause Single Event Upset(SEU). In this paper, we designed a controller supervising SRAM-based FPGA to protect configuration memory inside. The controller is implemented on an Anti-Fusing FPGA. Radiation test was performed on the implemented computer board and the result show that our controller provides better SEU-resilience than TMR-only system.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.42 no.5 s.335
• /
• pp.15-22
• /
• 2005

This paper proposes an efficient structure which is able to perform self-detection and self-repair for faults in a digital system by imitating the structure of living beings. The self-repair system is composed of artificial cells, which have homogeneous structures in the two-dimension, and spare cells. An artificial cell is composed of a logic block based on multiplexers, and a genome block, which controls the logic block. The cell is designed using DCVSL (differential cascode voltage switch logic) structure to self-detect faults. If a fault occurs in an artificial cell, it is self-detected by the DCVSL. Then the artificial cells which belong to the column are disabled and reconfigured using both neighbour cells and spare cells to be repaired. A self-repairable 2-bit up/down counter has been fabricated using Hynix $0.35{\mu}m$ technology with $1.14{\times}0.99mm^2$ core area and verified through the circuit simulation and chip test.

• Journal of the Institute of Electronics Engineers of Korea TC
• /
• v.38 no.3
• /
• pp.44-51
• /
• 2001

In general, the realization of spaceborne system is constrained by its space environment. In this paper, we suggest chirp stitching technique which generates and processes wideband radar signal with minimum hardware, design and implement transmit/receive equipments and operating programs to satisfy the requirement of this spaceborne high resolution SAR(Synthetic Aperture Radar). We apply the top down design approach to this system, and divide hardware into equipment, module and circuit levels, and software into SR(Software Requirement), AD(Architecture Design), DD(Detailed Design) and coding levels, and then extract each requirement to satisfy the wideband requirement of this spaceborne high resolution SAR. We, at first, test the hardware functions, confirm the wideband handling capability of this system with 85MHz wideband signals generated from two 42.5MHz narrow band signals, and show that this system can be used in spaceborne high resolution SARs.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.18 no.4 s.119
• /
• pp.364-371
• /
• 2007

In this paper, the design and implementation of high-power PIN diode switch modules and high-speed switch driver circuits are presented for Wibro base stations. To prevent isolation degradation due to parasitic inductances of conventional packaged PIN diodes and to improve power handling capabilities of the switch modules, bare diode chips are used and carefully placed in a PCB layout, which makes bonding wire inductances to be absorbed in the impedance of a transmission line. The switch module is designed and implemented to have a maximum performance while using a minimum number of the diodes. It shows an insertion loss of ${\sim}0.84\;dB$ and isolation of 80 dB or more at 2.35 GHz. The switch driver circuit is also fabricated and measured to have a switching speed of ${\sim}200\;nsec$. The power handling capability test demonstrates that the module operates normally even under a digitally modulated 70 W RF signal stress.

• Korean Journal of Materials Research
• /
• v.26 no.12
• /
• pp.714-720
• /
• 2016

We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of as-deposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37 %, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.

• Journal of the Korean Institute of Gas
• /
• v.5 no.4 s.16
• /
• pp.33-39
• /
• 2001

This paper was studied on corrosion behavior of absorption refrigeration systems using $LiBr-H_2O$ working fluids. In the various concentration of lithium bromide solution, polarization test of SS 400, Cu(C1220T-OL) and Al-Ni bronze is carried out. And the corrosion behavior of materials forming absorption refrigeration systems is investigated. The main results are as following: 1) As concentration of lithium bromide solution increases, polarization resistance of materials of each kinds is low. And open circuit potential becomes less noble, the corrosion current density is high drained 2) Open circuit potential of SS 400 is less noble than that of Cu and Al-Ni bronze, corrosion current density of SS5 400 is high drained than that of Cu and Al-Ni bronze. 3) Anodic polarization of Cu and Al-Ni bronze in $62\%$ LiBr solution continues the active state. that of Cu and Al-Ni bronze in the natural sea water maintains the active state and the critical current for passivation appears.

• Journal of the Korean Electrochemical Society
• /
• v.2 no.3
• /
• pp.138-143
• /
• 1999

Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.

• The Journal of the Institute of Internet, Broadcasting and Communication
• /
• v.12 no.4
• /
• pp.37-42
• /
• 2012

LED is just a semiconductor which can produce light. Currently, there are active research works on LED lighting technologies according to the growth of energy-saving environmental industry. Especially, LED communication is one of the active research works in these fields. In this paper, we design a LED communication-based multi-hop transmission wireless network system. The designed system consists of a transmission circuit system(transmitter) using LED and a receiving circuit system(receiver) using PD(photo detector) and OP-Amp, and relay system which can support multi-hop wireless network service with PD, OP-Amp, and LED, respectively. The experiments for the designed system are performed as follows. One computer is connected at the end of transmitter and receiver, respectively. There are two relays between transmitter and receiver, and text files are transmitted continuously by using text transmission programming. In this experiment, we test the performance with various baud rates, transmission ranges.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.1
• /
• pp.7-11
• /
• 2009

In this study, solder joints were made with Sn-3.5Ag (wt%) solder ball. Electroless nickel / immersion gold (ENIG) printed circuit board (PCB) substrates were employed in this work. The mechanical and electrical properties were measured as a function of the number of reflow. Die shear strength was measured with increasing reflow number. Until the forth or fifth reflow, shear force increased and after the fifth reflow the shear force of die decreased. The electrical resistivity of solder joint linearly increased with increasing reflow number.