• Title/Summary/Keyword: hybrid reliability

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A dynamic human reliability assessment approach for manned submersibles using PMV-CREAM

  • Zhang, Shuai;He, Weiping;Chen, Dengkai;Chu, Jianjie;Fan, Hao
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.11 no.2
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    • pp.782-795
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    • 2019
  • Safety is always acritical focus of exploration of ocean resources, and it is well recognized that human factor is one of the major causes of accidents and breakdowns. Our research developed a dynamic human reliability assessment approach, Predicted Mean Vote-Cognitive Reliability and Error Analysis Method (PMV-CREAM), that is applicable to monitoring the cognitive reliability of oceanauts during deep-sea missions. Taking into account the difficult and variable operating environment of manned submersibles, this paper analyzed the cognitive actions of oceanauts during the various procedures required by deep-sea missions, and calculated the PMV index using human factors and dynamic environmental data. The Cognitive Failure Probabilities (CFP) were calculated using the extended CREAM approach. Finally, the CFP were corrected using the PMV index. This PMV-CREAM hybrid model can be utilized to avoid human error in deep-sea research, thereby preventing injury and loss of life during undersea work. This paper verified the method with "Jiaolong" manned submersible 7,000 m dive test. The"Jiaolong" oceanauts CR(Corrected CFP) is dynamic from 3.0615E-3 to 4.2948E-3, the CR caused by the environment is 1.2333E-3. The result shown the PMV-CREAM method could describe the dynamic human reliability of manned submersible caused by thermal environment.

A Study on Reliability of Solder Joint in Different Electronic Materials (이종 전자재료 JO1NT 부위의 신뢰성에 관한 연구)

  • 신영의;김경섭;김형호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1993.11a
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    • pp.49-54
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    • 1993
  • This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

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Development of Optical Protection Socket for enhanced Reliability in Optical Subscriber Networks (광가입자망 신뢰도 향상을 위한 광절체 접속장치 개발)

  • Eom, Jinseob
    • Journal of Industrial Technology
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    • v.13
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    • pp.89-96
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    • 1993
  • In this paper, an OPS(Optical Protection Socket) unit is designed and prototyped for the application in the optical CPN(Customer Premises Network). The OPS unit, which plays an important role in the CPN for the enhanced network reliability, is consisted of $1{\times}2$ optical fiber splitter, combiner, and $1{\times}1$ optical switch to be a hybrid-typed unit. Various considerations, about power burget and optical information loss have given the most practical design for OPS. From the measurement of the realized OPS unit, it has proved such as the pertinent switching delay time with minimum data loss, the perceptive ability on the ONU degradation, the switching ability on the ONU malfunction.

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HRSF: Single Disk Failure Recovery for Liberation Code Based Storage Systems

  • Li, Jun;Hou, Mengshu
    • Journal of Information Processing Systems
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    • v.15 no.1
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    • pp.55-66
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    • 2019
  • Storage system often applies erasure codes to protect against disk failure and ensure system reliability and availability. Liberation code that is a type of coding scheme has been widely used in many storage systems because its encoding and modifying operations are efficient. However, it cannot effectively achieve fast recovery from single disk failure in storage systems, and has great influence on recovery performance as well as response time of client requests. To solve this problem, in this paper, we present HRSF, a Hybrid Recovery method for solving Single disk Failure. We present the optimal algorithm to accelerate failure recovery process. Theoretical analysis proves that our scheme consumes approximately 25% less amount of data read than the conventional method. In the evaluation, we perform extensive experiments by setting different number of disks and chunk sizes. The results show that HRSF outperforms conventional method in terms of the amount of data read and failure recovery time.

Performance Analysis of Hybrid Automatic Repeat Request Systems Using Shortened Reed-Solomon Codes over Rayleigh Fading Channel (레일레이 페이딩 채널에서 단축된 리드-솔로몬 부호를 사용한 하이브리드 제전송요구방식의 성능분석)

  • 이정운;양경철
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.21 no.3
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    • pp.731-736
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    • 1996
  • In this paper, we propose a modified Type-II HARQ system having adaptive power to channel and analyze its performance in terms of throughput and reliability. Its performance is also compared with Typd-I and Type-II HARQ ystems and is verified using computer simulations over AWGN and frequenyc-nonselective, slowly Rayleigh fading channels.

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Reliability Prediction of Hybrid Rocket Ignition System (하이브리드 로켓 점화 장치의 신뢰도 예측)

  • Mun, Geun-Hwan;Choe, Ju-Ho;Kim, Jin-Gon
    • 한국항공운항학회:학술대회논문집
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    • 2015.11a
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    • pp.6-12
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    • 2015
  • 본 연구에서는 실제 발사를 위해 설계, 제작된 하이브리드 로켓의 구성품인 점화장치의 신뢰도 예측을 수행하였다. 신뢰도 예측 및 분석을 위해 목표 신뢰도를 할당하였으며, 고장률 Database를 이용하여 점화장치에 대한 신뢰도 예측을 수행하여 목표 신뢰도와 비교 분석을 실시하였다. 비교 분석 결과 현재 사용하고 있는 점화 장치는 요구한 목표 신뢰도를 만족하는 것을 확인할 수 있었다.

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Experimental and Numerical Analysis of Microvia Reliability for SLP (Substrate Like PCB) (실험 및 수치해석을 이용한 SLP (Substrate Like PCB) 기술에서의 마이크로 비아 신뢰성 연구)

  • Cho, Youngmin;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.1
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    • pp.45-54
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    • 2020
  • Recently, market demands of miniaturization, high interconnection density, and fine pitch of PCBs continuously keep increasing. Therefore, SLP (substrate like PCB) technology using a modified semi additive process (MSAP) has attracted great attention. In particular, SLP technology is essential for the development of high-capacity batteries and 5G technology for smartphones. In this study, the reliability of the microvia of hybrid SLP, which is made of conventional HDI (high density interconnect) and MSAP technologies, was investigated by experimental and numerical analysis. Through thermal cycling reliability test using IST (interconnect stress test) and finite element numerical analysis, the effects of various parameters such as prepreg properties, thickness, number of layers, microvia size, and misalignment on microvia reliability were investigated for optimal design of SLP. As thermal expansion coefficient (CTE) of prepreg decreased, the reliability of microvia increased. The thinner the prepreg thickness, the higher the reliability. Increasing the size of the microvia hole and the pad will alleviate stress and improve reliability. On the other hand, as the number of prepreg layers increased, the reliability of microvia decreased. Also, the larger the misalignment, the lower the reliability. In particular, among these parameters, CTE of prepreg material has the greatest impact on the microvia reliability. The results of numerical stress analysis were in good agreement with the experimental results. As the stress of the microvia decreased, the reliability of the microvia increased. These experimental and numerical results will provide a useful guideline for design and fabrication of SLP substrate.

Coded Cooperation Communication over Two-Way Relay Network (양 방향 중계 네트워크에서의 부호화 협력 통신)

  • Park, Ji-Hwan;Kong, Hyung-Yun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.1
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    • pp.24-29
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    • 2011
  • Comparing conventional one-way relaying, two-way relaying scheme with network coding can achieve high throughput by reducing the transmission time. Coded cooperation protocol, which is a algorithm that uses coding on physical layer, can achieve high reliability. In this paper, we propose coded cooperation protocol over two-way relay network. Simulation results show proposed protocol has better performance in terms of reliability and throughput compare with conventional amplify and forward protocol. Also, with same throughput, proposed protocol has better performance in terms of reliability compare with the conventional hybrid decoded and forward protocol.

Comparative Analysis on Cloud and On-Premises Environments for High-Resolution Agricultural Climate Data Processing (고해상도 농업 기후 자료 처리를 위한 클라우드와 온프레미스 비교 분석)

  • Park, Joo Hyeon;Ahn, Mun Il;Kang, Wee Soo;Shim, Kyo-Moon;Park, Eun Woo
    • Korean Journal of Agricultural and Forest Meteorology
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    • v.21 no.4
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    • pp.347-357
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    • 2019
  • The usefulness of processing and analysis systems of GIS-based agricultural climate data is affected by the reliability and availability of computing infrastructures such as cloud, on-premises, and hybrid. Cloud technology has grown in popularity. However, various reference cases accumulated over the years of operational experiences point out important features that make on-premises technology compatible with cloud technology. Both cloud and on-premises technologies have their advantages and disadvantages in terms of operational time and cost, reliability, and security depending on cases of applications. In this study, we have described characteristics of four general computing platforms including cloud, on-premises with hardware-level virtualization, on-premises with operating system-level virtualization and hybrid environments, and compared them in terms of advantages and disadvantages when a huge amount of GIS-based agricultural climate data were stored and processed to provide public services of agro-meteorological and climate information at high spatial and temporal resolutions. It was found that migrating high-resolution agricultural climate data to public cloud would not be reasonable due to high cost for storing a large amount data that may be of no use in the future. Therefore, we recommended hybrid systems that the on-premises and the cloud environments are combined for data storage and backup systems that incur a major cost, and data analysis, processing and presentation that need operational flexibility, respectively.

RSM-based Probabilistic Reliability Analysis of Axial Single Pile Structure (축하중 단말뚝구조물의 RSM기반 확률론적 신뢰성해석)

  • Huh Jung-Won;Kwak Ki-Seok
    • Journal of the Korean Geotechnical Society
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    • v.22 no.6
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    • pp.51-61
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    • 2006
  • An efficient and accurate hybrid reliability analysis method is proposed in this paper to quantify the risk of an axially loaded single pile considering pile-soil interaction behavior and uncertainties in various design variables. The proposed method intelligently integrates the concepts of the response surface method, the finite difference method, the first-order reliability method, and the iterative linear interpolation scheme. The load transfer method is incorporated into the finite difference method for the deterministic analysis of a single pile-soil system. The uncertainties associated with load conditions, material and section properties of a pile and soil properties are explicitly considered. The risk corresponding to both serviceability limit state and strength limit state of the pile and soil is estimated. Applicability, accuracy and efficiency of the proposed method in the safety assessment of a realistic pile-soil system subjected to axial loads are verified by comparing it with the results of the Monte Carlo simulation technique.