• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.4
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• pp.127-134
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• 2015

Aluminum nitride (AlN) single crystals have attracted much attention for a next-generation semiconductor application because of wide bandgap (6.2 eV), high thermal conductivity ($285W/m{\cdot}K$), high electrical resistivity (${\geq}10^{14}{\Omega}{\cdot}cm$), and high mechanical strength. The bulk AlN single crystals or thin film templates have been mainly grown by PVT (sublimation) method, flux method, solution growth method, and hydride vapor phase epitaxy (HVPE) method. Since AlN suffers difficulty in commercialization due to the defects that occur during single crystal growth, crystalline quality improvement via defects analyses is necessary. Etch pit density (EPD) analysis showed that the growth misorientations and the defects in the AlN surface exist. Transmission electron microscopy (TEM) and electron back-scattered diffraction (EBSD) analyses were employed to investigate the overall crystalline quality and various kinds of defects. TEM studies show that the morphology of the AlN is clearly influenced by stacking fault, dislocation, second phase, etc. In addition EBSD analysis also showed that the zinc blende polymorph of AlN exists as a growth defects resulting in dislocation initiator.

• Korean Journal of Materials Research
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• v.8 no.10
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• pp.918-924
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• 1998

This study has been carried out to investigate the effect of reaction milling time on the synthesis of Ti- TiC p powder synthesised from the elemental titanium and activated carbon by reaction milling(RM), and the effect of vacu­u urn hot pressing temperature and TiC volume fraction on microstructural and mechanical properties of Ti- TiC com­p posite $\infty$ns이idated by vacuum hot pressing(VHP).T The elemental powders of titanium and activated carbon can be converted into Ti- TiC composite powders by reac­t tion milling for about 300hours, and were the average grain size of the as- milled powders has been measured to be a about $5\mu\textrm{m}$. The relative density of Ti- TiC VHPed above $1000^{\circ}C$ during Ihr is about 98% and the mechanical properties o of In- situ Ti- TiC composites are improved by TiC particle dispersed uniformly on titanium matrix. In order to investi­g gate thermal stability of Ti- TiC composite, after annealing at $600^{\circ}C$ for 80hrs micro- Vickers hardness have been per­f formed, and the values have been shown little changed as compared with those before annealing. The compact has b been tested on high temperature compressive test at $700^{\circ}C$ and has showed a high temperature compressive strength of 330MPa in a Ti- 20vol% TiC.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Journal of Korean Society of Environmental Engineers
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• v.39 no.2
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• pp.82-88
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• 2017

MET (Microbial Electrochemical Technology), such as MFC (Microbial Fuel Cell) and MEC (Microbial Electrolysis Cell), is a promising technology for producing sustainable biogas from an anaerobic digester (AD). At current stage, however, the most likely limiting factors, large internal resistances, should be overcome for successful scale up of this technology. Various researchers reported that application of electrode materials containing high current density, increase of ion strength and conductivity, configuration of electrode are good methods for minimizing internal resistances. Recently, stainless steel is receiving great attention because of not only high performance and durability but also low cost. Therefore, in this study, we evaluate electrochemical characteristics and biogas production rate using various electrode materials and configuration (graphite carbon coated with catalysts ($GC-C_M$) or not (GC), stainless steel mesh (SUS-M) and plate (SUS-P)). As the results, current densities of $GC-C_M$, GC, SUS-P, SUS-M were 2.03, 1.36, 1.04, $1.13A/m^2$, respectively. Methane yields of $GC-C_M$, GC, SUS-P, SUS-M were 0.27, 0.14, 0.19, 0.21 $L-CH_4/g-COD_{rem}$., respectively. Stainless steel shows high current density and methane yield, which are similar as graphite carbon coated with catalysts.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.111-118
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• 2023

MXene, a two-dimensional transition metal carbide or nitride, has recently attracted much attention as a lightweight and flexible electromagnetic shielding material due to its high electrical conductivity, good mechanical strength and thermal stability. In particular, the Ti-based MXene, Ti₃C₂T_x and Ti₂CT_x are reported to have the best electrical conductivity and electromagnetic shielding properties in the vast MXene family. Therefore, in this study, Ti₃C₂T_x and Ti₂CT_x films were prepared by vacuum filtration using Ti₃C₂T_x and Ti₂CT_x dispersions synthesized by interlayer metal etching and centrifugation of Ti₃AlC₂ and Ti₂AlC. The electrical conductivity and electromagnetic shielding efficiency of the films were measured after heat treatment at high temperature. Then, X-ray diffraction and photoelectron spectroscopy were performed to analyze the structural changes of Ti₃C₂T_x and Ti₂CT_x films after heat treatment and their effects on electromagnetic shielding. Based on the results of this study, we propose an optimal structure for an ultra-thin, lightweight, and high performance MXene-based electromagnetic shielding film for future applications in small and wearable electronics.

• Composites Research
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• v.30 no.2
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• pp.116-125
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• 2017

The purpose of this study is to develop silicon carbide fiber showing an excellent mechanical properties under highly oxidative conditions at high temperature. Polycarbosilane(PCS) as a preceramic precursor was used for making the SiC fiber. PCS fiber was taken by melt spinning method followed by melting the PCS at $300{\sim}350^{\circ}C$ in N2 gas. The Curing of PCS fiber was carried out in air oxygen chamber, prior to high temperature pyrolysis. Degree of cure was calculated by characteristic peak's ratio of Si-H to $Si-CH_3$ in FT-IR spectra before and after curing of PCS fiber. The properties of SiC fiber was affected greatly by the degree of cure. The SiC fiber produced by controlling fiber tension during heat treatment showed good properties. The SiC fiber exposed to $1000^{\circ}C$ at air from 1 min. up to maximum 50 hrs showed around 60% reduction in tensile strength. We found that large amount of carbon content on the fiber surface after long-term exposure has resulted in lower tensile strength.

• Journal of the Korea Concrete Institute
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• v.17 no.5 s.89
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• pp.709-716
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• 2005

The objective of this study is to develop a high ductile fiber reinforced mortar, ECC(Engineered Cementitious Composite) with using raw material commercially available in Korea. A single fiber pullout test and a wedge splitting test were employed to measure the bond properties in a matrix and the fracture toughness of mortar matrix respectively, which are used for designing mix proportion suitable for achieving strain-hardening behavior at a composite level. Test results showed that the properties tended to increase with decreasing water-cement ratio. A high ductile fiber reinforced mortar has been developed by employing micromechanics-based design procedure. Micromechanical analysis was initially peformed to properly select water-cement ratio, and then basic mixture proportion range was determined based on workability considerations, including desirable fiber dispersion without segregation. Subsequent direct tensile tests were performed on the composites with W/C's of 47.5% and 60% at 28 days that the fiber reinforced mortar exhibited high ductile uniaxial tension property, represented by a maximum strain capacity of 2.2%, which is around 100 times the strain capacity of normal concrete. Also, compressive tests were performed to examine high ductile fiber reinforced mortar under the compression. The test results showed that the measured value of compressive strength was from 26MPa to 34 MPa which comes under the strength of normal concrete at 28 days.

• Journal of the Korea Concrete Institute
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• v.20 no.5
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• pp.565-572
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• 2008

It is a trend to increase safekeeping properties in financial company as the world economy situation has been globalized and advanced. The development of a securable vault door resisting to malicious trespass is needed. Therefore, this study focuses on developing high performance concrete placed at the inside of the vault door, and all materials used in this study is easy to obtain in domestic considering economic competitiveness. The compressive strength over 170 MPa was targeted, and structurally strengthening was also planned in order to resist to over $3,000^{\circ}C$ heating by torch and extreme impact loading by hammer drilling machine. Several types of fibers and reinforcing structures were used in order to resist those external heating and loading. This purpose was required to satisfy UL 608 standard of a vault door. Consequently, the result from this study is expected to be applied to construction field of major facilities, which should guarantee the safety from an external attack such as terror.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.1
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• pp.111-116
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• 1998

Silicon nitride is hard and tough ceramic material. Hereby, mechanical machinability is very poor. It has also high electrical resistance. Silicon nitride of extremely high electrical resistivity becomes conductive ceramic composite by adding 30 wt% TiN. Ceramics with high electrical conductivity can be electrical discharge machined. Using by the Electrical Discharge Machining (EDM) technique. $Si_3N_4-TiN$ ceramic composite with high electrical conductivity is utilized to make metal working tool. These tool materials have severe wear problem as well as oxidation. Post HIP processing after sintering $Si_3N_4-TiN$ ceramic composites was performed. The tribological property of $Si_3N_4-TiN$ composite as a function of content of TiN was investigated in air, at room temperature. The hardness, fracture toughness, and flexural strength were compared with the wear volume. SEM observation of wear tracks can make an explanation of wear mode of $Si_3N_4-TiN$ composite.

• Fire Science and Engineering
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• v.27 no.6
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• pp.21-25
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• 2013

Fire resistance steel, grading 490 MPa, had developed by using Thermo-mechanical control process (TMCP) and it has better performance at welding, seismic resistance than those of the ordinary structural steel, But the fire resistance performance is required to verify against the ordinary fire resistance, FR 490. Therefore this study was done to make database of mechanical properties at high temperature and to evaluate the structural stability at high temperature in terms of materials and structural member such as H-section from that of FR 490. The result of this study was that the structural stability of TMCP was lower than that of ordinary FR 490 at the range up about $700^{\circ}C$.