• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.5
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• pp.58-64
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• 2011

In this paper, research on the manufacturing technology of hexagonal structure core is investigated. Also the optimal forming process of the honeycomb core is developed and the rolling process is analyzed using finite element code, $DEFORM^{TM}$-3D. The standard honeycomb has a uniform hexagonal structure defined by the material, cell size, cell wall thickness and bulk density. Honeycomb core products can be made from any thin, flat material. The most common cell configuration is the hexagon but there are many other shapes for special applications. Because of the precision shape and the thin thickness, the honeycomb core is not easy to manufacture in the metal forming process. Through this study it was confirmed that after the rolling process, the section of honeycomb close to the standard shape can be obtained. This result is reflected to the manufacturing process design for the honeycomb core.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.1
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• pp.32-37
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• 2002

The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.72-77
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• 2001

The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design, and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1410-1413
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• 2003

Drawing is a basic plastic deformation method and productive manufacturing process make wire. rod and variety section geometry bar. Study for the rod drawing process of rod was researched long littles. but non-axisymmetric drawing process is weak. So metal flow is very irregular in non-axisymmetric drawing process and difficult to define about material deformation generally. In this paper, to solve material deformation, use finite element method and then define suitable shape for rod to hexagonal drawing dies. And research corner filling rate and surface roughness for the high strength steel hexagonal bar produced defined dies.

• Bulletin of the Korean Chemical Society
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• v.26 no.3
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• pp.418-422
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• 2005

By introducing spin-coating method to the evaporation induced self-assembly (EISA) process, a simple and reproducible route in controlling the mesophase of silica thin films has been developed for the first time in this work. When a comparatively solvent-rich Si-sol (The atomic ratio of TEOS : F127 : HCl : $H_2O$ : EtOH = 1 : 0.006 : 0.2 : 9.2 : 30) was used as coating solution, the mesophase of resultant silica films was selectively controlled by adjusting the spin-on speed. The cubic mesophase has been obtained from the coating at a low rpm, such as 600 rpm, while the 2-D hexagonal mesophase is formed at a high rpm, such as 2,500 rpm. At a medium coating speed, a mixture of cubic and hexagonal mesophase has been found in the fabricated films. The present results confirm that the evaporation rate of volatile components at initial step is critical for the determination of mesopore structures during the EISA process.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.205-209
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• 2009

Wetting properties between silver-copper-titanium braze alloys with different titanium contents up to 2.8 mass% and hexagonal boron nitride ceramics were investigated using sessile drop method at 1123K in Argon. The final contact angle is less than $30^{\circ}$ when the Ti content was over 0.41 mass%. Meanwhile, the contact angle curves show different behavior. In case of using braze alloy containing 2.8 mass% of titanium, the initial contact angle is acute angle just after the melting of braze. In case of brazes containing titanium less than 2.26 mass%, the contact angle is larger than $90^{\circ}$ at the beginning and slowly decreases to acute angle. The reaction layer of titanium nitride is observed at the interface. In addition, the reaction of Ti in the braze and N in the bulk h-BN seemed to show diffusion limited spreading.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.192-192
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• 2012

The next generation electronics need to not only be smaller but also be more flexible. To meet such demands, electronic devices using two dimensional (2D) atomic crystals like graphene, hexagonal boron nitride (h-BN), molybdenum disulfate ($MoS_2$) and organic thin film have been studied intensely. In this talk, I will demonstrate the $MoS_2$ field effect transistor (FET) toward performance enhancement by insulating h-BN substrate.

• Journal of Magnetics
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• v.12 no.4
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• pp.141-143
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• 2007

We have fabricated (0001) oriented hexagonal $HoMnO_3$ thin films with thickness of 300 nm using Pulsed Laser Deposition (PLD) technique on $Pt(111)/Ti/SiO_2/Si$ substrates. The XRD $\theta-2\theta$ pattern shows only (0002), (0004), and (0008) reflection of a hexagonal phase, and the full width at half maximum (FWHM) of (0004) peak is under $1.6^{\circ}$. The chemical state of Mn from XPS spectra of the films reveals the presence of $Mn^{3+}$ only. The temperature dependence of dielectric constant shows a weak anomaly at magnetic $N\acute{e}el$ temperature $(T_N)$, which is about 70 K.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.591-591
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• 2013

Fully and partially grown hexagonal boron nitride (h-BN) on Cu foil, synthesized by chemical vapor deposition method, was studied using Raman and SEM measurements. Fully and partially grown samples were successfully made from borane-ammonia complex to controlling pressure and growth time. The fully grown h-BN and partially grown h-BN exhibits a ~1,370 $cm^{-1}$ B-N vibrational mode ($E_{2g}$) Especially, well-aligned triangular h-BN monolayer was observed on some domain of Cu foil using SEM measurements.

• ETRI Journal
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• v.30 no.4
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• pp.615-617
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• 2008

A novel and compact elliptic-function bandpass filter is proposed in this letter. The techniques of slot etching and the addition of open stubs are applied to enhance the self-inductance and self-capacitance of hexagonal open-loop resonators. Thus, size reduction and improved transmission performance are obtained. Compared to the performance of the conventional design, the central frequency and insertion loss are reduced by 28% and 3.1 dB, respectively. Measurements show that the proposed filter has a fraction bandwidth of 23% at the central frequency of 1.84 GHz, and its insertion loss in the passband is less than -1.5 dB. The bandpass filter occupies only 12 mm${\times}$21.2 mm (approximately $0.24{\lambda}_g{\times}0.14{\lambda}_g$).