• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.11-15
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• 2001

In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.1-5
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• 2003

In this project, the efficiency of localized heating for micro systems packaging is developed by using a forced potential scheme microheater. Less than 0.2 Mpa contact pressure was used for bonding with a 200 mA current input for $50{\mu}m$ width, $2{\mu}m$ height and $8mm{\times}8mm$, $5mm{\times}5mm$, $3mm{\times}3mm$ sized phosphorus-doped poly-silicon microheater. The temperature can be raised at the bonding region to $800^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3 minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional microheaters. For performing the gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for conducting a gross leak check. The pass ratio of bonded dies was 67%, for conventional localized heating, and 85% for our newly developed FP scheme. The bonding strength was more than 25Mpa for FP scheme packaging, which shows that FP scheme can be a good candidate for micro-scale hermetic packaging.

• Korean Journal of Optics and Photonics
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• v.33 no.5
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• pp.210-217
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• 2022

In this paper, a study is conducted on the acceptable tolerance of an alignment device to reduce the optical loss caused by the alignment tolerance of a window hermetic optical connector. To increase the transmission distance of optical signals and fiber-optic communication systems, it is necessary to maintain and improve the high optical efficiency of the connectors used to bond optical fibers. In the case of the window hermetic optical connector, the optical system is aligned through an alignment device. At this time, since the two connectors are used together, each component is fixed, and further alignment is impossible. The alignment tolerance of the housing system and pin used to align the optical system of the connector causes optical loss, leading to serious problems in the fiber-optic communication system. Thus, to find the acceptable tolerance required for manufacturing the optical-connector alignment device, tolerance analysis is performed on the components of the optical connector, such as the ball lens and the window. We also implement single-mode and multimode optical-connector systems, respectively. Based on the results, we determine an acceptable tolerance value for the alignment device.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.249-272
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• 2005

• Transactions on Electrical and Electronic Materials
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• v.15 no.2
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• pp.91-95
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• 2014

This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11b
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• pp.869-874
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• 2002

Hermetic rotary compressor is one of the most important components for air conditioning system since it has a great effect on both the performance and the noise and vibration of the system. Noise and vibration of rotary compressor is occurred due to gas pulsation during compression process and unbalanced dynamic force. In order to reduce noise and vibration, It is necessary to identify sources of noise and vibration and effectively control them. Many approaches have been tried to identify noise sources of compressor. However, compressor noise source identification has proven to be difficult since the characteristics of compressor noise are complicated due to the interaction of the compressor parts and gas pulsation. In this work, Statistical Energy Analysis has been used to trace the energy flow in the compressor and identify transmission paths from the noise source to the sound field.

• Tribology and Lubricants
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• v.29 no.2
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• pp.105-110
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• 2013

Refrigeration and air-conditioning compressors used in home appliances, including refrigerators and air conditioners, are typically hermetic-type reciprocating compressors. Because the shell is sealed by welding, it should be designed to have a semi-permanent life. The energy consumption of a hermetic-type reciprocating compressor is low, but because it operates continuously to maintain a constant temperature inside the refrigerator, it has a certain base load. In this type of compressor, the driving motor operates at a high speed (about 3,000 - 3,600 rpm), which causes valve damage, friction, wear, and high-frequency noise. Many studies have been conducted to solve these problems. To enhance the reliability and efficiency of the reciprocating compressor, the design conditions and operating environment of journal bearings should be considered. Dynamic behavior analysis should be carried out in terms of the discharge pressure. The results showed that the load (discharge pressure) increases in the forward lookup zone and decreases in the backward lookup zone. When the revolution speed is increased, the maximum load decreases in the region where the maximum load operates.

• Journal of Information Display
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• v.3 no.1
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• pp.11-16
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• 2002

This paper presents a study on the tubeless Plasma Display Panel (PDP) packaging using glass-to-glass electrostatic bonding with intermediate amorphous silicon. The bonded sample sealing the mixed gas with three species showed high strength ranging from 2.5 MPa to 4 MPa. The glass-to-glass bonding for packaging was performed at a low temperature of $180^{\circ}C$ by applying bias of 250 $V_{dc}$ in ambient of mixed gases of He-Ne(27 %)-Xe(3 %). The tubeless packaging was accomplished by bonding the support glass plate of $30mm{\times}50mm$ on the rear glass panel and the capping glass of $20mm{\times}20mm$. The 4-inch color AC-PDP with thickness of 8 mm was successfully fabricated and fully emitted as white color at a firing voltage of 190V.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.5
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• pp.418-426
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• 2005

Efficiency of the compressor is most important parameter in the domestic refrigerator which runs year around. With developed analytical model about heat transfer analysis in the hermetic compressor, parametric study was performed to know the effect on efficiency by design and material modification of the compressor. Volumetric efficiency of the compressor increased approximately $3\%$ when insulation is increased about $50\%$ in suction component. However, the insulation effect on discharge component was only $1\%$. When the thermal conductivity of the discharge plenum is reduced from 300 to 20 $W/m{\cdot}K$, volumetric efficiency increased about $3.1\%$. There is no attraction in efficiency increment with variation of outside surface area of the compressor and radial heat transfer coefficient of the solid component in the compressor shell.