Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Low Temperature Hermetic Packaging for MEMS Devices

  • Choi Won Kyoung (Packaging Center, Samsung Advanced Institute of Technology) ;
  • Wang Qian (Packaging Center, Samsung Advanced Institute of Technology) ;
  • Kim Won Bae (Packaging Center, Samsung Advanced Institute of Technology) ;
  • Moon Changyoul (Packaging Center, Samsung Advanced Institute of Technology)
  • Published : 2005.09.01
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