• 제목/요약/키워드: grain boundary layer

검색결과 154건 처리시간 0.025초

ZnO-Bi2O3-Sb2O3 세라믹스의 전기적 특성 (Electrical Properties of ZnO-Bi2O3-Sb2O3 Ceramics)

  • 홍연우;신효순;어동훈;김종희;김진호
    • 한국전기전자재료학회논문지
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    • 제21권8호
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    • pp.738-748
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    • 2008
  • In this study, it has been investigated on the changing behavior of electrical properties in $ZnO-Bi_2O_3-Sb_2O_3$ (Sb/Bi=2.0, 1.0 and 0.5) ceramics. The samples were prepared by conventional ceramic process, and then characterized by I-V, C-V curve plots, impedance and modulus spectroscopy (IS & MS) measurement. The electrical properties of ZBS systems were strongly dependent on Sb/Bi. In ZBS systems, the varistor characteristics were deteriorated noticeably with increasing Sb/Bi and the donor density and interface state density were increased with increasing Sb/Bi. On the other hand, we observed that the grain boundary reacted actively with the ambient oxygen according to Sb/Bi ratio. Especially the grain boundaries of Sb/Bi=0.5 systems were divided into two types, i.e. sensitive to oxygen and thus electrically active one and electrically inactive intergranular one with temperature. Besides, the increased pyrochlore and $\beta$-spinel phase with Sb/Bi ratio caused the distributional inhomogeneity in the grain boundary barrier height and the temperature instability. To the contrary, the grain boundary layer was relatively homogeneous and more stable to temperature change and kept the system highly nonlinear at high Bi-rich phase contents.

알루미나 세라믹스의 기계적 특성에 미치는 MgO출발물질의 영향 (Effect of Starting Material for MgG on the Mechanical Properties of Alumina Ceramics)

  • 조용익;정상귀;조성용;김승재
    • 한국세라믹학회지
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    • 제39권1호
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    • pp.51-56
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    • 2002
  • 고순도 알루미나 분말에 소결조제로서 초산 마그네슘과 질산 마그네슘을 1000ppm첨가하여 제작한 소결체에 대해서 소결조제로 사용한 MgO의 출발물질의 종류가 소결체 특성에 미치는 영향을 고찰하였다. 초산 마그네슘과 질산 마그네슘을 사용해서 제작한 소결체에 대해서 소결온도 1$600^{\circ}C$에서 상대밀도의 급격한 감소가 확인되었고 SEM관찰결과 소결조제로 사용한 두 종류의 출발물질을 첨가한 경우에 동일하게 소결체의 outer layer에서는 입성장 및 기공이 형성되어있고 inner layer에서는 알루미나 입계에 제2상의 존재가 관찰되었다. 이 시편의 EPMA을 이용한 원소분석결과로부터 소결온도 1$600^{\circ}C$에서 알루미나 입계에 존재하는 제2상은 Mg를 함유한 혼합물이라는 것을 알 수 있었다.

뇌임펄스전류에 의한 ZnO 피뢰기의 열화특성 (Degradation Properties of ZnO Surge Arresters Due to Lightning Impulse Currents)

  • 이수봉;이복희
    • 조명전기설비학회논문지
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    • 제23권4호
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    • pp.79-85
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    • 2009
  • 이 논문은 피임펄스전류의 입사에 따른 ZnO 피뢰기의 열화 특성에 대하여 기술하였다. 뇌서지에 의한 ZnO 피뢰기의 열화특성을 분석하기 위해 시료 ZnO 피뢰기에 8/20[${\mu}s$], 2.5[kA]의 표준뇌임펄스전류를 인가하였다. 뇌임펄스전류를 인가한 것과 인가하지 않은 ZnO 피뢰기에 흐르는 상용주파수 AC 및 DC 누설전류를 측정하였다. 그 결과 임펄스전류의 인가횟수가 증가함에 따라 누설전류는 증가하였고 AC전압에서 누설전류의 비 대칭성은 뚜렷하게 나타났다. 뇌임펄스전류를 인가하지 않은 ZnO 피뢰기의 ZnO 입자는 균일한데 반해 뇌임펄스전류를 인가한 ZnO 피뢰기의 ZnO 입자는 불균일하게 변형되었다. 또한 뇌임펄스전류 인가에 따른 $Bi_2O_3$의 감소가 입계층의 결핍을 발생시키며 입계층의 결핍에 의한 전류의 집중이 ZnO 피뢰기 소자의 비선형 특성의 열화에 대한 중요한 요인으로 작용한 것으로 밝혀졌다.

침탄처리한 SCM420H의 미끄럼 마모 특성에 미치는 침탄 조건의 영향 (Effects of Carburizing Process on Sliding wear Behavior of Carburized SCM420H Steel)

  • 이한영;이규헌
    • Tribology and Lubricants
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    • 제36권1호
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    • pp.18-26
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    • 2020
  • The effects of the carburizing process on the sliding wear behavior of SCM420H steel have been investigated. In particular, the effects of grain boundary corrosion observed in the surface layer after gas carburizing and the effects of hardness of the carburized cases after heat-treatment on the sliding wear properties were examined. Pin specimens carburized by two methods (gas carburizing and vacuum carburizing) were tempered at two temperatures of 180℃ and 400℃ after oil-quenching, respectively. Sliding wear tests were carried out against heattreated SKH51 steel at several sliding speeds using a pin-on-disc type test machine. As results, it can be found that there is no difference in the wear behavior between the pins carburized using two methods. This implies that the grain boundary corrosion that formed in the surface layer after gas carburizing has no effect on the sliding wear behavior of carburized SCM420H steels. Additionally, there is no significant difference in the wear behavior between carburized pins tempered at 400℃ and at 180℃ after oil-quenching, regardless of the carburizing method. This is because carburized pins tempered at 400℃ have a troostite structure, which exhibits higher tribochemical reactivity even though its hardness is lower than that of martensite structure. In this respect, it can be considered that good wear resistance of carburized cases is maintained at least until the effective case depth.

$(Sr_{1-x}.Ca_x)TiO_3$입계층 세라믹의 유전 및 전기전도특성에 관한 연구 (A study on the dielectric and electrical conduction properties of$(Sr_{1-x}.Ca_x)TiO_3$ grain boundary layer ceramics)

  • 최운식;김충혁;이준웅
    • E2M - 전기 전자와 첨단 소재
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    • 제8권5호
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    • pp.611-618
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    • 1995
  • The (Sr$_{1-x}$ .Ca$_{x}$)TiO$_{3}$+0.6[mol%]Nb$_{2}$O$_{5}$ (0.05.leq.x.leq.0.2) ceramics were fabricated to form semiconducting ceramics by sintering at about 1350[.deg. C] in a reducing atmosphere(N$_{2}$ gas). Metal oxides, CuO, was painted on the both surface of the specimens to diffuse to the grain boundary. They were annealed at 1100 [.deg. C] for 2 hours. The 2nd phase formed by thermal diffusing from the surface lead to a very high apparent dielectric constant. According to increase of the frequency as a functional of temperature, all specimens used in this study showed the dielectric relaxation, and the relaxation frequency was above 106 [Hz], it move to low frequency with increasing resistivity of grain. The specimens showed three kinds of conduction mechanisms in the temperature range 25-125 [.deg. C] as the current increased: the region I below 200 [V/cm] shows the ohmic conduction. The region rt between 200 [V/cm] and 2000 [V/cm] can be explained by the Poole-Frenkel emission theory, and the region III above 2000 [V/cm] is dominated by the tunneling effect.fect.

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입계확산에 의한 반도성 $SrTiO_3$ 세라믹스의 입계구조 및 전기적 특성 변화 (The Effect of Grain Boundary Diffusion on the Boundary Structure and Electrical Characteristics of Semiconductive $SrTiO_3$ Ceramics)

  • 김태균;조남희
    • 한국세라믹학회지
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    • 제34권1호
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    • pp.23-30
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    • 1997
  • SrCO3 TiO2, 그리고 Nb2O5를 출발원료로 하여 환원분위기하에서 반도성 SrTiO3 소결첼르 제조하였다. 반도성 다결정 소결체 내에서 acceptor 역할을 할 수 있는 Na과 K 이온을 입계를 따라 80$0^{\circ}C$~120$0^{\circ}C$ 온도범위에서 확산시킨 후, 열처리조건에 따른 입계의 전기적 화학적 특성을 고찰하였다. 이차열처리한 소결체의 입계에는 일정한 전기적 포텐셜장벽과 이에 상관된 전자고갈영역이 형성되어 비선형적인 전류-전압 특성을 보이고 문턱전압(threshold voltage)은 10~70V, 입계포텐셜장벽은 0.1~2eV의 크기를 나타내었다. Na과 K 이온은 입계로부터 입자내부로 확산하여 20~50 nm 깊이의 확산층을 형성하며, 이들 확산층에서 Na 또는 K과의 치환에 기인하여 Sr농도가 감소하였으며 치환에 따른 전기적 중성유지를 위하여 산소 vacancy 농도가 증가하였다.

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MgO/Al2O3가 소결조제로 첨가된 Si3N4 세라믹스의 수열 조건에서의 부식열화 거동 (Corrosive Degradation of MgO/Al2O3-Added Si3N4 Ceramics under a Hydrothermal Condition)

  • 김원주;강석민;박지연
    • 한국재료학회지
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    • 제17권7호
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    • pp.366-370
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    • 2007
  • Silicon nitride ($Si_3N_4$) ceramics have been considered for various components of nuclear power plants such as the mechanical seal of a reactor coolant pump (RCP), the guide roller for a control rod drive mechanism (CRDM), and a seal support, etc. Corrosion behavior of $Si_3N_4$ ceramics in a high-temperature and high-pressure water must be elucidated before they can be considered as components for nuclear power plants. In this study, the corrosion behaviors of $Si_3N_4$ ceramics containing MgO and $Al_2O_3$ as sintering aids were investigated at a hydrothermal condition ($300^{\circ}C$, 9.0 MPa) in pure water and 35 ppm LiOH solution. The corrosion reactions were controlled by a diffusion of the reactive species and/or products through the corroded layer. The grain-boundary phase was preferentially corroded in pure water whereas the $Si_3N_4$ grain seemed to be corroded at a similar rate to the grain-boundary phase in LiOH solution. Flexural strengths of the $Si_3N_4$ ceramics were significantly degraded due to the corrosion reaction. Results of this study imply that a variation of the sintering aids and/or a control (e.g., crystallization) of the grain-boundary phase are necessary to increase the corrosion resistance of $Si_3N_4$ ceramics in a high-temperature water.

강제대류시 고순도 Al괴의 응고조직에 미치는 유동의 영향 (A Study on the Effect of Fluid Flow on the Microstructure of High Purity Al Ingot under Forced Flow)

  • 김경민;김헌주;하기윤;윤의박
    • 한국주조공학회지
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    • 제13권6호
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    • pp.540-546
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    • 1993
  • The effects of fluid flow on the purification of aluminum were studied. As the revolution rate(N) increased, the size of columnar grain decreased gradually. The concentration of solidified crystal was decreased with increasing distance from chill and revolution rate(N). Distribution boundary layer thickness(${\delta}$) was calculated from the solute distribution obtained in solid experimentally and by use of BPS equation. The value of ${\delta}$ changed from about $60{\mu}m$ at N value of 27rpm to about $15{\mu}m$ at N value of 1000rpm. From this result, high purification was obtained by decreasing the diffusion boundary layer under forced convection.

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Ni-NiAl 확산대에서 $Ni_3Al$ 상의 형성과 반응확산 (Reaction diffusion and formation of$Ni_3Al$ phase at the Ni-NiAl diffusion couple)

  • 정승부
    • Journal of Welding and Joining
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    • 제15권3호
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    • pp.128-135
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    • 1997
  • Reaction diffusion and formation of $Ni_3Al$phase with $L1_2$ structure have been studied in temperature range of 1432K to 1573K using the diffusion couple of (Ni-40, 5at%Al)/(Ni-14, 1at%Al) and (Ni-49, 2at%Al)/ (Nickel). The layer growth of Ni$_{3}$Al pyhase in the annealed diffusion couple was measured by optical microscope and electron probe microanalyzer (EPMA). The layer growth of $Ni_3Al$phase in diffusion zone obeyed the parabolic law without any indication of grain boundary effects. The layer growth of $Ni_3Al$phase in temperature range of 1423K to 1573K was mainly controlled by the volume diffusion mechanism. The rate of layer growth of $Ni_3Al$phase was found to be colsely related to the composition of intermetallic compound NiAl phase. The activation energy for layer growth of $Ni_3Al$phase was calculated to be 127kJ/mol.

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Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)

  • Kim, Jeonga;Park, Cheolho;Cho, Kyung-Mox;Hong, Wonsik;Bang, Jung-Hwan;Ko, Yong-Ho;Kang, Namhyun
    • Electronic Materials Letters
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    • 제14권6호
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    • pp.678-688
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    • 2018
  • The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.