• 한국세라믹학회지
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• 제28권4호
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• pp.261-268
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• 1991

The dielectric properties and microstructure of SrTiO3-based grain boundary layer (GBL) capacitor were investigated, and SrTiO3 GBL capacitor was made by penetrating the Frit (PbO-Bi2O3-B2O3 system). The Nb2O5-doped SrTiO3 ceramics were fired for 4-hours, at 145$0^{\circ}C$ in H2-N2 atomsphere to get semiconductive ceramics. The grain size of SrTiO3 sintered at reduction atmosphere had increased as the amount of Nb2O5 increases and then decreased as the amount of Nb2O5 exceeded 0.2 mole%. Insulating reagents which contained PbO-Bi2O3-B2O3 system frit and oxide mixture were printed on the each semiconductive ceramics and fired at varying temperature and for different holding time. The optimum dielectric properties could be obtained by second heat treatment at 110$0^{\circ}C$ for 1 hour, when frit paste was printed. A SrTiO3-based GBLC had the apparent permitivity of about 3.2$\times$104, the dielectric loss of 0.01~0.02 and the stable temperature coefficient of capacitance. The influence of frit paste on dielectric properties was similiar to that of oxide paste but the stability of temperature property of capacitance was improved.

• 한국전기전자재료학회논문지
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• 제26권9호
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• pp.646-650
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• 2013

$(Na,K)NbO_3$-based piezoelectric ceramics were synthesized by a liquid phase sintering method with a selected glass frit. The effects of the content of the glass frit and the sintering temperature on the microstructure and the electrical properties of the samples were investigated. With the 0.1 wt% of glass frit content, $(Na_{0.52}K_{0.44}Li_{0.06})(Nb_{0.84}Ta_{0.10}Sb_{0.06})O_3$ (NKL-NTS) ceramics showed the maximum values of the relative density (99.1%) and the electro-mechanical coupling factor ($k_p$: 0.32) at the sintering temperature of $1,050^{\circ}C$. It might mean that a liquid phase sintering with a suitable glass frit having the lower flow temperature could improve the relative density and the piezoelectric properties.

• 마이크로전자및패키징학회지
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• 제3권2호
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• pp.39-50
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• 1996

본 연구에선 주어진 조성의 알루미나 green sheet에 대하여 텅스텐의 입경 및 산화 물의 조성을 변화시키므로써 수축률을 제어하여 camber를최소화하여 결합강도를 최대로 하 는 텅스텐 페스트조성을 찾아내는 것을 목적으로 하였다. 본 실험에서 사용한 텅스텐 분말 의 입경은 0.35$\mu$m, 0.6$\mu$m, 0.72$\mu$m, $1.5\mu$m, 1.9$\mu$m, 3.2$\mu$m이며 frit는 Al2O3, MgO, SiO2 와 Al2O3, CaO, SiO2를 사용하여 각각의 조성에 따라 함량을 변화시키며 실험하였다. 소성 은 154$0^{\circ}C$로 습윤 수소분위기에서 시행하였으며 사용된 알루미나 green sheet의 알루미나 중심 입경은 2.8$\mu$m이었다. 분석은 주사전자 현미경으로 미세구조를 관찰하였고 EPMA Line Profile로 원소 분석을 하였으며 잔류응력을 측정하기 위하여 XRD분석을 하였다. Frit 을 함유하지 않은 경우 텅스텐 분말의 입경이 1.9$\mu$mdlfEo 최대 접합 강도를 나타내었다. Frit을 함유한 경우 Mgo계 frit조성에서는 MgO/Al2O3/SiO3=1/1/1일 때 CaO계 frot 조성에 서는 CaO/Al2O3/SiO2=1/2/1일 때 최대 접합 강도를 나타내었다. Frit 함량을 변화시킨 경우 MgO계는 10wt%함유하였을 때 CaO 계는 5wt%함유하였을 때 최대 접합강도를 나타내었 다. Frit 함량을 변화시킨 경우 MgO계는 10wt%함유하였을 때, CaOr계는 5wt%함유하였을 때 최대 접합강도를 나타내었다.

• Bulletin of the Korean Chemical Society
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• 제27권4호
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• pp.524-528
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• 2006

Three different style capillary columns, a packed capillary with temporary quartz wool frit, a packed capillary with immobilized frit, and an immobilized packed-capillary, were easily prepared with a commercially available (S)-N-(3,5-dinitro-benzoyl)leucine-N-phenyl-N-alkylamide derived chiral stationary phase. Liquid chromatographic chiral separations of some racemic amino acid derivatives on these columns were performed and the results were compared to each other. The packed capillary with immobilized frit showed some merits in chiral chromatography.

• 한국세라믹학회지
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• 제46권5호
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• pp.488-492
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• 2009

Porous frit-bonded SiC ceramics were successfully prepared at a temperature as low as $800^{\circ}C$ from SiC, frit, and microbeads (glass or polymer). The effects of SiC starting particle size and microbead addition on microstructure, porosity, and flexural strength were investigated. The addition of hollow glass microbead improved the strength of frit-bonded SiC ceramics without the loss of porosity by acting additional binder phase between SiC grains. The 65 ${\mu}m$-sized SiC resulted in lower porosity and higher strength than 50 ${\mu}m$-sized SiC because of higher packing density. Typical flexural strengths of frit-bonded SiC were 23 MPa at 46% porosity and 19 MPa at 49% porosity.

• 한국전기전자재료학회논문지
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• 제28권9호
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• pp.571-576
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• 2015

In this study, we developed a lead-free $P_2O_5-V_2O_5-ZnO$ glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to $45.4{\times}10^{-7}/^{\circ}C$, which is very close to that of the glass substrate ($44.0{\times}10^{-7}/^{\circ}C$). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.21-21
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• 2009

후막 광식각 기술을 이용하여 형성된 Ag 전극과 LTCC 기판 사이의 접착력을 향상시키기 위하여 무기 바인더로서 anorthite, diopside 및 MLS-62 glass frit을 첨가하여 감광성 Ag paste를 제조하였다. 소성 후의 glass pool effect를 감소시키기 위해 attrition mill을 통하여 미세 glass 분말을 준비하였다. Glass frit은 Ag powder의 5vol%~25vol%의 함량으로 첨가하여 감광성 Ag paste를 제조하였고 패턴 형성 후 $850^{\circ}C$에서 1시간 소결하였다. 전극과 기판 사이의 접착력은 micro-ball shear test 법으로 측정하였으며, Ag 전극 부착력은 glass frit의 함량 증가에 따라 증가하다가 감소하는 경향을 보이는데, 이는 과량의 glass frit 첨가로 인한 전극 내부에 액상 풀의 형성에 기인한 것으로 보여진다. Ag 전극의 면저항은 glass frit의 함량이 증가함에 따라 $0.13m{\Omega}{/\square}$에서 $2.06m{\Omega}{/\square}$까지 증가하는 경향을 나타내었다. 소성 전후의 전극 패턴의-수축율은 $100{\mu}m$의 선폭을 기준으로 glass frit의 첨가랑이 증가할수록 43.3%에서 35.0%로 감소하였으며, 그 결과 최소 선폭 $25{\mu}m$의 미세 전극 패턴의 형성이 가능하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.42.2-42.2
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• 2011

$TiO_2$ films were modified by adding a glass frit as a light scattering particle and applied to an anode electrode in dye-sensitized solar cells (DSSCs) to enhance the adhesion between $TiO_2$ and fluorine doped transparent oxide (FTO). Low melting point glass frits at contents of (3 to 7wt%) were added to the nano crystalline $TiO_2$ films. The light scattering properties, photovoltaic properties and microstructures of the photo electrodes were examined to determine the role of the low glass transition temperature ($T_g$) glass frit. Electrochemical impedance spectroscopy, Brunauer-Emmett-Teller method and scratch test were conducted to support the results. The DSSC with the $TiO_2$ film containing 3wt% low Tg glass frit showed optimal performance (5.1%, energy conversion efficiency) compared to the $TiO_2$-based one. The photocurrent density slightly decreased by adding 3wt% of the frit due to its large size and non conductivity. However, the decrease of current density followed by the decrease of electron transfer due to the large frit in $TiO_2$ electrode was compensated by the scattering effect, high surface area and reduced the electron transfer impedance at the electrolyte-dye-$TiO_2$ interface. The stability of the photo electrodes was improved by the frit, which chemically promoted the sintering of $TiO_2$ at relatively low temperature ($450^{\circ}C$).

• 한국세라믹학회지
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• 제46권2호
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• pp.175-180
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• 2009

Multilayer ceramic capacitors (MLCCs) have continually been made smaller in size and larger in capacity in resent years. However, the end termination electrode is still thick in many MLCCs. In this study, we used small grain glass frit to embody thin film and highly densification in the end termination by improve sintering driving force with well-dispersion and rising surface energy. Pastes were fabricated using size changed glass frit, such as 0.1 ${\mu}m$, 0.5 ${\mu}m$, 1.0 ${\mu}m$, 4.0 ${\mu}m$. Fabricated pastes were applied 05A475KQ5 chip and fired various sintering temperatures to analyze sintering behavior of pastes. Consequently, small glass frit used pastes have many merits than larger, such as well-dispersion, improve cornercoverage and surface roughness, possibility of low temperature sintering. However, we confirmed that small glass frit used pastes have narrow sintering window by rapid completion of sintering densification.

• 한국재료학회지
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• 제18권5호
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• pp.283-288
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• 2008

The effect of sintering aids and glass-frit on the densification and resistivity of silver paste was investigated in an effort to enhance the sintered density and electrical conductivity of the silver electrode. To prepare Pb-free silver paste for use at low sintering temperatures, two commercial silver powders ($0.8\;{\mu}m$ and $1.6\;{\mu}m$ in size) and 5wt.% lab-synthesized nanoparticles (30-50 nm in size) as a sintering aids were mixed with 3 wt.% or 6 wt.% of glass frit ($Bi_2O_3$-based) using a solvent and three roll mills. Thick films from the silver paste were prepared by means of screen printing on an alumina substrate followed by sintering at $450^{\circ}C$ to $550^{\circ}C$ for 15 min. Silver thick films from the paste with bimodal particles showed a high packing density, high densification during sintering and low resistivity compared to films created using monomodal particles. Silver nanoparticles as a sintering aid enhanced the densification of commercial silver powder at a low sintering temperature and induced low resistivity in the silver thick film. The glass frit also enhanced the densification of the films through liquid phase sintering; however, the optimum content of glass frit is necessary to ensure that a dense microstructure and low resistivity are obtained, as excessive glass-frit can provoke low conductivity due to the interconnection of the glass phase with the high resistivity between the silver particles.