• 제목/요약/키워드: flexible substrates

검색결과 381건 처리시간 0.027초

RF 파워가 플렉시블 기판에 성장시킨 GZO 박막의 전기적 및 광학적 특성에 미치는 영향 (Effects of RF power on the Electrical and Optical Properties of GZO Thin Films Deposited on Flexible Substrate)

  • 정양희;강성준
    • 한국정보통신학회논문지
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    • 제18권10호
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    • pp.2497-2502
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    • 2014
  • 본 연구에서는 고주파 마그네트론 스퍼터링 법으로 RF 파워 (50~80 W) 를 변화시켜가며 PES 플라스틱 기판 위에 GZO ($Ga_2O_3$ : 5 wt %, ZnO : 95 wt %) 박막을 제작하여, 광학적 및 전기적 특성을 조사하였다. XRD 측정을 통해 공정 조건에 관계없이 모든 GZO 박막이 c 축으로 우선 성장함을 확인할 수 있었고, 70W에서 제작한 GZO 박막이 반가폭 $0.44^{\circ}$로 가장 우수한 결정성을 나타내었다. 박막의 표면을 AFM 으로 조사한 결과, 표면 거칠기 값은 RF 파워 70 W 에서 제작한 박막에서 가장 낮은 값인 0.20 nm 를 나타내었다. Hall 측정 결과, RF 파워 70 W에서 제작한 GZO 박막에서 가장 낮은 비저항 $6.93{\times}10^{-4}{\Omega}{\cdot}cm$ 값과 가장 높은 캐리어 농도 $7.04{\times}10^{20}cm^{-3}$ 및 이동도 $12.70cm^2/Vs$ 값을 나타내었다. 모든 GZO 박막은 RF 파워에 무관하게 가시광 영역에서 약 80 % 정도의 투과율을 나타냈으며, 캐리어 농도의 증가에 따라 에너지 밴드갭이 청색 편이 되는 Burstein-Moss 효과도 관찰할 수 있었다.

공정압력이 SiO2 버퍼층을 갖는 PES 기판위에 증착한 ITZO 박막의 전기적 및 광학적 특성에 미치는 영향 (Effect of Working Pressure on the Electrical and Optical Properties of ITZO Thin Films Deposited on PES Substrate with SiO2 Buffer Layer)

  • 정양희;최병균;강성준
    • 한국전자통신학회논문지
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    • 제14권5호
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    • pp.887-892
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    • 2019
  • 본 연구에서는 플라스틱 기판 중에서 가장 내열성이 우수하다고 알려진 PES 기판위에 버퍼층으로 20nm두께로 $SiO_2$ 박막을 플라즈마 화학기상증착 법으로 증착한 후, ITZO 박막을 고주파 마그네트론 스퍼터링 법으로 증착하여 공정압력에 따른 ITZO 박막의 전기적 및 광학적 특성을 조사하였다. 공정압력 3 mTorr 에서 증착한 ITZO 박막이 $8.02{\times}10^{-4}{\Omega}-cm$의 비저항과 $50.13{\Omega}/sq.$의 면저항으로 가장 우수한 전기적 특성을 보였다. 모든 ITZO 박막의 가시광 영역(400-800 nm)에서 평균 투과도는 공정압력에 무관하게 80 %이상으로 나타났다. 재료평가지수는 3 mTorr에서 증착한 ITZO 박막에서 $23.90{\times}10^{-4}{\Omega}^{-1}$로 가장 큰 값을 나타내었다. 본 연구를 통해 ITZO 박막이 차세대 플렉시블 디스플레이 소자에서 ITO 박막을 대체할 매우 유망한 재료라는 것을 알 수 있었다.

마이크로 인몰드 공정기술 기반 전자소자 제조 및 응용 (Recent Progress in Micro In-Mold Process Technologies and Their Applications)

  • 김성현;권영우;홍석원
    • 마이크로전자및패키징학회지
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    • 제30권2호
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    • pp.1-12
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    • 2023
  • 전 세계적 모바일 스마트 기기 혁명은 사람이 접하는 모든 공간에서 독립된 형태의 전기회로를 요구하고 있으며, 전자기기간 연결된 사물인터넷의 구현은 사용자 측면에서 운용이 쉽고 지속 가능한 디지털 생태계 인프라 구축에서 매우 중요한 위치를 차지하고 있다. 이러한 기술은 자동차 전장품, 가정용 가전제품 및 웨어러블 기기의 생산 기술 발전으로 이어지고 있으며, 특히 최근 소개된 인몰드 전자기기(in-mold electronics, IME)는 기존의 대량 공정의 장점을 극대화할 수 있는 기술로 대두되고 있다. 이 기술은 평평한 2차원 기판에 기능성 잉크를 인쇄하고, 3차원 형상으로 열/사출 성형하여 경량화 및 저비용으로 장치를 생산해내는 경제성 강점을 이유로 산업적인 가치를 평가받고 있다. 본 논문에서는 인몰드 전자 장치의 제조기술 및 응용 측면에 대한 가장 최신의 국내외 연구 그룹에서 제안된 기술 개발을 소개하고자 한다. 신체 표면상에서 독립된 형태의 바이오센서 전자소자의 운용을 위한 생체 모사 기술, 에너지 소자, 생체신호 모니터링 센서들을 인몰드 기술로 구현하는 기술 및 장치 구성은, 4차 산업혁명과 함께 성장 중인 유연인쇄전자 기술과 융합되어 회로 기판 제조기술의 혁신을 가져올 것으로 기대된다.

New Approaches for Overcoming Current Issues of Plasma Sputtering Process During Organic-electronics Device Fabrication: Plasma Damage Free and Room Temperature Process for High Quality Metal Oxide Thin Film

  • Hong, Mun-Pyo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.100-101
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    • 2012
  • The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

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동시 스퍼터링으로 제조한 AZO-ITO 혼합박막의 증착 중 수소 혼입 영향 분석 (Effect of H2 Addition on the Properties of Transparent Conducting Oxide Films Deposited by Co-sputtering of ITO and AZO)

  • 김혜리;김동호;이성훈;이건환
    • 한국표면공학회지
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    • 제42권6호
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    • pp.267-271
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    • 2009
  • Multicomponent transparent conducting oxide films were deposited on glass substrates at 150 by dual magnetron sputtering of AZO and ITO targets. In the case of mixing a limited amount of ITO (10W), resistivity of TCO films was significantly increased compared to the AZO film; from $3.5{\times}10^{-3}$ to $9.7{\times}10^{-3}{\Omega}{\cdot}cm$. Deterioration of the electrical conductivity is attributed to the decreases in carrier concentration and Hall mobility. Improvement of the conductivity could be obtained for the films prepared with ITO powers larger than 40 W. The lowest resistivity ($\rho$) of $7.3{\times}10^{-4}{\Omega}{\cdot}cm$ was achieved when ITO power was 100 W. Effects of $H_2$ incorporation on the electrical and optical properties of AZO-ITO films were investigated in this work. Addition of small amount of hydrogen resulted in the increase of carrier concentration and the improvement of electrical conductivity. It is apparent that the roughness of AZO-ITO films decreases dramatically after the transition of microstructure from polycrystalline to amorphous phase, which gives practical advantages such as an excellent uniformity of surface and a high etching rate. AZO-ITO films grown at sputtering ambient with hydrogen gas are expected to be applicable to optoelectronic devices such as organic light emitting diodes and flexible displays due to their sufficient electrical and structural properties.

Na2S 하부층을 이용한 Cu(In,Ga)Se2 광흡수층의 저온증착 및 Cu(In,Ga)Se2 박막태양전지에의 응용 (Low-temperature Deposition of Cu(In,Ga)Se2 Absorber using Na2S Underlayer)

  • 신해나라;신영민;김지혜;윤재호;박병국;안병태
    • Current Photovoltaic Research
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    • 제2권1호
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    • pp.28-35
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    • 2014
  • High-efficiency in $Cu(In,Ga)Se_2$ (CIGS) solar cells were usually achieved on soda-lime glass substrates due to Na incorporation that reduces deep-level defects. However, this supply of sodium from sodalime glass to CIGS through Mo back electrode could be limited at low deposition temperature. Na content could be more precisely controlled by supplying Na from known amount of an outside source. For the purpose, an $Na_2S$ layer was deposited on Mo electrode prior to CIGS film deposition and supplied to CIGS during CIGS film. With the $Na_2S$ underlayer a more uniform component distribution was possible at $350^{\circ}C$ and efficiency was improved compared to the cell without $Na_2S$ layer. With more precise control of bulk and surface component profile, CIGS film can be deposited at low temperature and could be useful for flexible CIGS solar cells.

Ni 박막 위치에 따른 GZO 투명전도막의 전기광학적 물성 변화 (Influence of Ni Thin Film Position on the Opto-electrical Properties of GZO Films)

  • 문현주;전재현;공태경;서기웅;오정현;김선경;최동혁;손동일;김대일
    • 열처리공학회지
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    • 제28권3호
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    • pp.121-125
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    • 2015
  • GZO single layer, Ni buffered GZO(GZO/Ni), Ni intermediated GZO (GZO/Ni/GZO) and Ni capped GZO (Ni/GZO) films were prepared on poly-carbonate (PC) substrates by RF and DC magnetron sputtering without intentional substrate heating and then the influence of the Ni (2 nm thick) thin film on the optical, electrical and structural properties of GZO films were investigated. As deposited GZO single layer films show the optical transmittance of 81.3% in the visible wavelength region and a resistivity of $1.0{\times}10^{-2}{\Omega}cm$, while GZO/Ni/GZO trilayer films show a lower resistivity of $6.4{\times}10^{-4}{\Omega}cm$ and an optical transmittance of 74.5% in this study. Based on the figure of merit, it can be concluded that the intermediated Ni thin film effectively enhances the opto-electrical performance of GZO films for use as transparent conducting oxides in flexible display applications.

DC 마그네트론 스퍼터링법으로 증착된 초박형 Al 박막의 투명전극 적용성 연구 (Ultra-thin aluminum thin films deposited by DC magnetron sputtering for the applications in flexible transparent electrodes)

  • 김대균;최두호
    • 마이크로전자및패키징학회지
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    • 제25권2호
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    • pp.19-23
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    • 2018
  • 광전소자용 투명전극으로 적용하기 위한 초박형 Al 박막에 대한 기초연구를 수행하였다. 유리 기판 상에 3-12 nm의 두께를 가지는 Al 박막을 형성하였으며, 박막의 두께가 7 nm 이상일 때부터 면저항이 측정되었으며 두께가 증가할 때 면저항이 점진적으로 감소하였다. 박막 내 그레인 크기(Grain size)는 두께가 증가할수록 비례하여 증가하였다. 광 투과도의 경우 가시광선영역(380~770 nm) 파장 기준으로, 3 nm 박막 두께에서 평균 85%의 투과도가 측정된 데 반하여, 4, 5 nm 두께에서 평균 50, 60%로 급격하게 감소되기 시작하며 그 이후 두께 증가에 따라 투과도가 점진적으로 감소하였다. 본 연구결과는 향후 Oxide/Metal/Oxide(OMO) 구조의 고투과, 저저항 투명전극 적용을 위한 기초 결과로 활용될 것으로 기대된다.

A Review on Transfer Process of Two-dimensional Materials

  • Kim, Chan;Yoon, Min-Ah;Jang, Bongkyun;Kim, Jae-Hyun;Kim, Kwang-Seop
    • Tribology and Lubricants
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    • 제36권1호
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    • pp.1-10
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    • 2020
  • Large-area two-dimensional (2D) materials synthesized by chemical vapor deposition on donor substrates are promising functional materials for conductors, semiconductors, and insulators in flexible and transparent devices. In most cases, 2D materials should be transferred from a donor substrate to a target substrate; however, 2D materials are prone to damage during the transfer process. The damages to 2D materials during transfer are caused by contamination, tearing, and chemical doping. For the commercialization of 2D materials, a damage-free, large-area, and productive transfer process is needed. However, a transfer process that meets all three requirements has yet to be developed. In this paper, we review the recent progress in the development of transfer processes for 2D materials, and discuss the principles, advantages, and limitations of each process. The future prospects of transfer processes are also discussed. To simplify the discussion, the transfer processes are classified into four categories: wet transfer, dry transfer, mechanical transfer, and electro-chemical transfer. Finally, the "roll-to-roll" and "roll-to-plate" dry transfer process is proposed as the most promising method for the commercialization of 2D materials. Moreover, for successful dry transfer of 2D materials, it is necessary to clearly understand the adhesion properties, viscoelastic behaviors, and mechanical deformation of the transfer film used as a medium in the transfer process.

FTS 장치를 이용한 가스 차단막용 SiOx 및 SiOxNy 박막의 공정특성 (Process Characteristics of SiOx and SiOxNy Films on a Gas Barrier Layer using Facing Target Sputtering (FTS) System)

  • 손진운;박용진;손선영;김화민
    • 한국전기전자재료학회논문지
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    • 제22권12호
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    • pp.1028-1032
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    • 2009
  • In this study, the influences of silicon-based gas barrier films fabricated by using a facing target sputtering(FTS) system on the gas permeability for flexible displays have been investigated. Under these optimum conditions on the $SiO_x$ film with oxygen concentration($O_2/Ar+O_2$) of 3.3% and the $SiO_xN_y$ film with nitrogen concentration($N_2/Ar+O_2+N_2$) of 30% deposited by the FTS system, it was found that the films were grown about 4 times higher deposition rate than that of the conventional sputtering system and showed high transmittance about 85% in the visible light range. Particularly, the polyethylene naphthalate(PEN) substrates with the $SiO_x$ and/or $SiO_xN_y$ films showed the enhanced properties of decreased water vapor transmission rate (WVTR) over $10^{-1}\;g/m^2{\cdot}day$ compared with the PEN substrate without any gas barrier films, which was due to high packing density in the Si-based films with high plasma density by FTS process and/or the denser chemical structure of Si-N bond in the $SiO_xN_y$ film.