• Title/Summary/Keyword: fine-pitch

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Growth Decline and Abnormal Vertical Distribution of Fine Roots of Pitch Pine in Seoul Metropolitan Area (首都圈地域에서 리기다소나무 生長 減少와 잔뿌리의 非正常 垂直分布)

  • Rhyu, Tae-Cheol;Kee-Dae Kim;Joon-Ho Kim
    • The Korean Journal of Ecology
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    • v.17 no.3
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    • pp.261-275
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    • 1994
  • The annual ring widths of tree and the vertical distribution of fine roots were investigated at 33 sites of pitch pine forests in Seoul, its vicinity and rural areas. The annual ring widths among 16 - 20 year-old pitch pines in urban areas were significantly lower than those in rural areas. The annual ring widths for the latest 5 years (1985-1989) for the age class of 11-20, 21-30 and 31-40 year old pines increased in the following order for all the age classes: urban areas< suburbs

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Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology

  • Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Eom, Yong-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.4
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    • pp.65-68
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    • 2013
  • A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

HV-SoP Technology for Maskless Fine-Pitch Bumping Process

  • Son, Jihye;Eom, Yong-Sung;Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Lee, Jin-Ho
    • ETRI Journal
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    • v.37 no.3
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    • pp.523-532
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    • 2015
  • Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

Optimization of Material and Process for Fine Pitch LVSoP Technology

  • Eom, Yong-Sung;Son, Ji-Hye;Bae, Hyun-Cheol;Choi, Kwang-Seong;Choi, Heung-Soap
    • ETRI Journal
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    • v.35 no.4
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    • pp.625-631
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    • 2013
  • For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

Novel reforming of pyrolized fuel oil by electron beam radiation for pitch production

  • Jung, Jin-Young;Park, Mi-Seon;Kim, Min Il;Lee, Young-Seak
    • Carbon letters
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    • v.15 no.4
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    • pp.262-267
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    • 2014
  • Pyrolized fuel oil (PFO) was reformed by novel electron beam (E-beam) radiation, and the elemental composition, chemical bonds, average molecular weight, solubility, softening point, yields, and density of the modified patches were characterized. These properties of modified pitch were dependent on the reforming method (heat or E-beam radiation treatment) and absorbed dose. Aromaticity ($F_a$), average molecular weight, solubility, softening point, and density increased in proportion to the absorbed dose of E-beam radiation, with the exception of the highest absorbed dose, due to modification by free radical polymerization and the powerful energy intensity of E-beam treatment. The H/C ratio and yield exhibited the opposite trend for the same reason. These results indicate that novel E-beam radiation reforming is suitable for the preparation of aromatic pitch with a high ${\beta}$-resin content.

Preparation of pitch from pyrolized fuel oil by electron beam radiation and its melt-electrospinning property

  • Jung, Jin-Young;Lee, Young-Seak
    • Carbon letters
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    • v.15 no.2
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    • pp.129-135
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    • 2014
  • Spinnable pitch for melt-electrospinning was obtained from pyrolized fuel oil by electron beam (E-beam) radiation treatment. The modified pitch was characterized by measuring its elemental composition, softening point, viscosity, molecular weight, and spinnability. The softening point and viscosity properties of the modified pitch were influenced by reforming types (heat or E-beam radiation treatment) and the use of a catalyst. The softening point and molecular weight were increased in proportion to absorbed doses of E-beam radiation and added $AlCl_3$ due to the formation of pitch by free radical polymerization. The range of the molecular weight distribution of the modified pitch becomes narrow with better spinning owing to the generated aromatic compounds with similar molecular weight. The diameter of melt-electrospun pitch fibers under applied power of 20 kV decreased 53% ($4.7{\pm}0.9{\mu}m$) compared to that of melt-spun pitch fibers ($10.2{\pm}2.8{\mu}m$). It is found that E-beam treatment for reforming could be a promising method in terms of time-savings and cost-effectiveness, and the melt-electrospinning method is suitable for the preparation of thinner fibers than those obtained with the conventional melt-spinning method.

Cation Deficiencies in Needles and Fine Roots of Pitch Pine in Seoul Metropolitan Area (首都圈地域에서 리기다소나무 잎과 잔뿌리 속의 陽이온 부족)

  • Rhyu, Tae-Cheol;Kim, Kee-Dae;Kim, Joon-Ho
    • The Korean Journal of Ecology
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    • v.17 no.3
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    • pp.277-286
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    • 1994
  • The contents of major elements were determined in current-year and previous-year needles and fine roots of pitch pine (Pinus yzgida) at 33 sites in Seoul and its vicinity. Contrary to Ca and Al in needles, N, P, Mg and K contents in current-year needles were higher than those in previous-year needles. The N, P, K and Al contents in current-year needles in Seoul were not significantly different from those in rural areas. In contrast, Ca and Mg contents in needles in Seoul were significantly lower than those in suburbs and rural areas. The N /Ca and N /Mg ratios in needles in urban Seoul were higher than those in rural areas. Mg contents in fine roots in soil of 0-5 cm depth increased along with distance from the center of Seoul, while Al contents in fine root in soil of 5-10 cm depth decreased along with distance from the center of Seoul. Al contents in fine roots in soil layer in Seoul and suburbs were higher than those in rural areas. Al contents in fine roots in litter layer were 1 /3 - 1 /2 times lower than those in soil layer for all areas. A1 content in fine roots in deep soil was higher than that in top soil. Therefore growth decline of pitch pine in Seoul and suburbs was thought to be caused by Ca and Mg deficiency in plant tissues and Al toxicity to fine roots. Abnormal vertical distribution of fine roots of pitch pine in Seoul and its vicinity were interpreted as the result of growth reduction of fine roots by Al toxicity in deep layer of acid soil.

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Design and Analysis of NCP Packaging Process for Fine-Pitch Flexible Printed Circuit Board (미세피치 연성인쇄회로기판 대응을 위한 NCP 패키징 공정설계 및 분석)

  • Shim, Jae-Hong;Cha, Dong-Hyuk
    • Journal of Institute of Control, Robotics and Systems
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    • v.16 no.2
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    • pp.172-176
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    • 2010
  • Recently, LCD (Liquid Crystal Display) requires various technical challenges; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP (Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF (Anisotropic Conductive Film). In this paper, we analyzed the process of the NCP for COF (Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we obtained the stable values of the design parameters for successful NCP process.

Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application (플립칩용 웨이퍼레벨 Fine Pitch 솔더범프 형성)

  • 주철원;김성진;백규하;이희태;한병성;박성수;강영일
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.11
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    • pp.874-878
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    • 2001
  • Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

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Si Deep Etching Process Study for Fine Pitch Probe Unit

  • Han, Myeong-Su;Park, Il-Mong;Han, Seok-Man;Go, Hang-Ju;Kim, Hyo-Jin;Sin, Jae-Cheol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.296-296
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    • 2012
  • LCD panel 검사를 위한 Probe unit은 대형 TV 및 모바일용 스마트폰을 중심으로 각광을 받고 있는 소모성 부품으로 최근 pitch의 미세패턴화가 급속히 진행되고 있다. 본 연구에서는 Slit Wafer 제작 공정을 최적화하기 위해 25 um pitch의 마스크를 설계, 제작하였다. 단공과 장공을 staggered 형태로 배열하여 25 um/25 um line/space pitch로 설계하였다. 또한 단위실험을 위해 직접 25 um pitch로 설계하여, 동일한 실험조건을 적용하여 최적 조건을 찾고자 하였다. 반응변수는 Etch rate 및 profile angle로 결정하였으며, 약 200~400 um 에칭된 slit의 상단과 하단의 폭, 그리고 식각깊이를 SEM 측정사진을 통해 정한 후 etch rate 및 profile angle을 결정하였다. 인자는 식각속도 및 wall의 각도를 결정하는 식각 및 passivation 가스의 유량, chamber 압력(etching/passivation), 식각시간 등으로 정하였으며, 이들의 최대값과 최소값 2 수준으로 실험계획을 설계하였다. 식각 조건에 따라 8회의 실험을 수행하였다. 가스의 유량은 SF6 400 sccm, C4F8 400 sccm, 식각 싸이클 시간은 5.2~10.4 sec, passivation 싸이클시간 4 sec로 하였으며, 압력은 식각시 7.5 Pa, passivation 시 10 Pa로 할 경우가 가장 sharp하게 나타났다. Coil power 와 platen power는 각각 2.6 KW, 0.14 KW로 하였으며, 최적화를 위한 인자의 값들은 이 범위에서 조절하였다. 이러한 인자의 조건 조절을 통해 etch rate는 5.6 um/min~6.4 um/min, $88.9{\sim}89.1^{\circ}$의 profile angle을 얻을 수 있었다.

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