Journal of Institute of Control, Robotics and Systems (제어로봇시스템학회논문지)

Institute of Control, Robotics and Systems (제어로봇시스템학회)
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Design and Analysis of NCP Packaging Process for Fine-Pitch Flexible Printed Circuit Board

미세피치 연성인쇄회로기판 대응을 위한 NCP 패키징 공정설계 및 분석

  • 심재홍 (한국산업기술대학교 메카트로닉스공학과) ;
  • 차동혁 (한국산업기술대학교 메카트로닉스공학과)
  • Published : 2010.02.01
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Abstract

Recently, LCD (Liquid Crystal Display) requires various technical challenges; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP (Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF (Anisotropic Conductive Film). In this paper, we analyzed the process of the NCP for COF (Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we obtained the stable values of the design parameters for successful NCP process.

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References

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