• Journal of the Korean Ceramic Society
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• v.47 no.3
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• pp.262-267
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• 2010

a-SiC has been thought as an ideal candidate for conventional silicon at many applications. However, the uniformity problem of deposition has been a obstacle for conventional use of a-SiC:H films. a-SiC:H films were deposited on (100) silicon wafer by RPECVD system in various temperature. HMDS and $H_2$ gas were used as a precursor and a carrier gas, respectively. The flow rate of HMDS source and $C_2H_2$ dilution gas was fixed in order to study the carbon effect on the film stoichiometric and bonding properties. The plasma power varied from 200 to 400W. We used three types of source delivery line to control the uniformity and film properties of deposited film. We showed that the change of source delivery line has effect on the film uniformity of deposited film and this change of line did not affect on film properties. Also, the change of deposition conditions has effect on the film uniformity.

• Journal of Korean Ophthalmic Optics Society
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• v.7 no.2
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• pp.175-180
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• 2002

Use spctrophotometer to estimate thin film uniformity of lens, Compare, and analyze thin film uniformity availability selecting two peaks of Reflectance(R%) measuring on spectrum. Wavelength dependence's Reflectance in position of center, middle and edge of lens etc... obtain thin film's thickness (t) from Wavelength region (${\lambda}_1,{\lambda}_2$) of two peaks of Reflectance. $$t=\frac{1}{2(n^2-\sin^2{\theta})^{1/2}}{\times}\frac{{\lambda}_1{\lambda}_2}{{\lambda}_2-{\lambda}_1}$$ If Reflectance pattern is uniformity value in position of center middle of lens, edge etc... thin film has uniformity. Applied thin film uniformity estimation method to 1st layer $MgF_2$(n=1.38) coating lens. It was about thin film's thickness difference 360nm. Can analyze coating lens' thin film uniformity easily from Reflectance relationship measurement about Wavelength dependence.

• 한국전산유체공학회:학술대회논문집
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• 2010.05a
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• pp.567-570
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• 2010

With continuously increasing flat panel display size, uniformity of thin film deposition has been drawing more attentions and associated fabrication methodologies are being actively investigated. Since the convective flow field of mixture gas plays a significant role for deposition characteristics of thin film in an APCVD system, it is greatly important to maintain uniform distribution and consistent concentration of mixture gas species. In this paper, computational study has been performed for the improvement of flow uniformity of mixture gas in an APCVD reactor during thin film deposition process. A diffuser slit has bee designed to spread the locally concentrated gas flow exiting from the flow distributor. A uniform flow distributor has been developed which has less dependency on operating conditions for global flow uniformity

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1444-1447
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• 2004

For the OLED evaporation process, thin film thickness uniformity is of great practical importance. In order to achieve the better thickness uniformity, geometric simulation of film thickness distribution profile is required. In this paper, a geometric modeling algorithm is introduced for process simulation of full-color OLED evaporating system. The physical fact of the evaporation process is modeled mathematically. Based on the developed method, the uniformity of the organic layer thickness can be successfully controlled.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.38 no.3
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• pp.21-28
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• 2015

As film products are increasingly used in a wide range of areas, from producing traditional flexible packaging to high-tech electronic products, a higher level of quality is demanded. Most film products are made in the form of rolled finished goods, therefore, various quality issues related to their shape characteristics must be addressed. The thickness of the film products is one of the most common and important critical-to-quality attributes (CTQs). Particularly, the degree of thickness uniformity is more important than other thickness parameters, because it will be potential causes of many secondary thickness-related quality problems, such as wrinkles or faulty windings. To control the degree of thickness uniformity, the fixed bending region is oneof the most important CTQs to manage. Fixed bending regions are special points in the transverse direction of a rolled product with consistent minute variations of the thickness gap. This paper describes the measurement and analysis of thickness uniformity data, which were performed in a real manufacturing field of biaxial oriented polypropylene (BOPP) film. In previous researches, quality function deployment (QFD) or fault tree analysis were used to find the most critical process attributes out to controlthe CTQ of thickness uniformity. Whereas, this paper uses traditional control charts to find the most critical process attributes out in this problem. In addition, the selection of one of the major critical process attributes (CTPs) that is expected to affect the CTQ of thickness uniformity is also described. The selected critical-to-process attributes are the controlled temperatures along the transverse direction. A dramatic improvement in thickness uniformity was observed when the selected CTPs were controlled.

• Journal of the Korean Vacuum Society
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• v.2 no.4
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• pp.480-485
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• 1993

Factros considered building the magnetron sputtering system for TFT LCD (thin film transistor liquid crystal display0 metallization were thin film thichnes uniformity, temperature uniformity and the pressure gradient of sputtering gas flow in vacuum chamber, base pressure, and the stability fo the carrier moving . The system was consisted of a deposition chamber, a pre-heating chamber, a RF-precleaning chamber and a load/unload lock chamber. The system was designed to handle a substrate with dimension of 400$\times$400mm. The temperautre uniformity of a heater table developed showed $250 ^{\circ}C\pm$5% accuracyon the substrate glass. A base pressure of 1.8 $\times$10-7 torr was obtained after 24 hours pumping with a cryo pump. After an aluminum target was installed in a sputtering source and the film wa sdeposited on the glass, the uniformity, reflectivity and sheet resistance of the deposited film were measured.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.218-218
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• 2011

The CIGS Solar Cells have the highest conversion efficiency in the film-type solar cells. They consist of p-type CuInSe2 film and n-type ZnO film. The CdS films are used as buffer layer in the CIGS solar cells since remarkable difference in the lattice constant and energy band gap of two films. The CdS films are toxic and make harmful circumstances. The CdS films deposition process need wet process. In this works, we design and make the hitter and lamp reflection part in the sputtering system for the ZnS films deposition as buffer layer, not using wet process. Film thickness, SEM, and AFM are measured for the uniformity valuation of the ZnS films. We conclude the optimum deposition temperature for the films uniformity less than 1.6%. The ZnS films deposited by the sputtering system are more dense and uniform than the CdS films deposited by the Chemical Bath Deposition Method(CBD) for the CIGS Solar Cells.

• Journal of Korean Vacuum Science & Technology
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• v.3 no.2
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• pp.101-106
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• 1999

The main consideration factor to design a magnetron of the sputtering system for TFT-LCD metallization is high sheet resistance (Rs) uniformity which is provided by the high target erosion and high current efficiency. The present study has developed a rectangular magnetron for TFT-LCD to bve considered full target erosion and high film uniformity. After an aluminum-2 at.% and alloy target was installed in a magnetron source and the film was deposited on the glass of 600${\times}$720 mm, the Rs uniformity of the deposited film was measured as functions of the magnet tilt and magnet scanning configuration. And the target erosion profile was observed with the target voltage. When sputtered at 4mtorr and 10kW, the magnet tilt for the high Rs uniformity of 8.38% was 7mm. The plasma voltage at the dwell home and end for full-face target erosion, when scanned the magnetron was 120% compared to the mean voltage of the other area.

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.35-40
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• 2008

In OLED vacuum evaporation process, the essential requirements include good uniformity of the film thickness over a glass substrate. And, it is commercially significant to improve the consuming efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. In this paper, to achieve the better thickness uniformity and the better organic material consuming rate, a process optimization algorithm was developed by understanding vacuum evaporation process parameters that affect the material consuming efficiency and the uniformity of film thickness. Based on the method developed in this study, the vacuum evaporation process of OLED was successfully controlled. The developed method allowed the manufacture of high quality OLED displays with cheaper fabrication cost.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.262-267
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• 2000

This paper describes a weight in motion(WIM) sensor to measure the weight of a vehicle in motion. The main sensing element of the WIM sensor is the PVDF(Polyvinylidene fluoride) film that shows rapid response to an external excitation. Due to the property of rapid response, it is possible to measure the weight of a vehicle in motion with high speed. In the development of the WIM sensor, the dominant target value was the uniformity of the sensor. To increase the uniformity, We employed shrinkable tube made of rubber to enhance the uniformity, and performed the rolling of the brass tube repeatedly. The uniformity of the sensor was examined experimentally. It was comparable to that of a WIM sensor of the MSI which was the benchmark of this development. This paper also describes the mechanical modeling of the sensor and the suitable charge amplifier for the sensor.