• Advances in concrete construction
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• 제14권2호
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• pp.139-151
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• 2022

Filling materials poured into precast member joint are subjected to restraint stress by the precast member and joint reinforcement. The induced stress will likely cause cracks at early ages and performance degradation of the entire structure. To prevent these issues and design reasonable joints, it is very important to analyze and evaluate the restrained shrinkage cracks of filling materials at various restraint conditions. In this study, a new time zero-that defines the shrinkage development time of a filling material-is proposed to calculate the accurate amount of shrinkage. The tensile stresses and strengths at different ages were compared through the ring test (AASHTO PP34) to evaluate the crack potential of the restrained filling materials at various restraint conditions. The mixture which contained an expansive additive and a shrinkage reducing agent exhibited high resistance to shrinkage cracking owing to the high-drying shrinkage compensation effect. The high-performance, fiber-reinforced cement composite, and ultra-high-performance, fiber-reinforced cement composite yielded very high resistance to shrinkage and cracking owing to the pull-out property of steel fibers. To this end, multiple nonlinear regression analyses were conducted based on the test results. Accordingly, a modified tensile stress equation that considered both the geometric shape of the specimen and the intrinsic properties of the material is proposed.

• 한국재료학회지
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• 제22권7호
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• 한국생물공학회:학술대회논문집
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• 한국생물공학회 2003년도 생물공학의 동향(XII)
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• pp.591-594
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• 2003

기존 재료들의 단점인 재료의 전이성, 염증 유발, 효과의 단기 지속 등의 문제를 해결하기 위하여 PLGA 미립구를 주 재료로 하는 주사 충전재를 개발하였다. 생쥐 실험 결과 염증 반응이 적고 장기 이동성이 없으며 부피 유지 효과가 우수하다는 결론을 내렸으며 추가적으로 장기 추가 보완 실험을 실시하여 비뇨기과, 성형외과적 주사용 충전재로써의 적합성을 조사하겠다.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.37-42
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• 2007

반도체 소자의 집적도가 높아짐에 따라 3D SiP에 대한 관심이 높아지고 전기도금법을 이용한 구리 via filling이 활발히 연구되어왔다. Via filling시 via 입구와 바닥에 전류밀도 차이로 인해 via 내부에 결함이 발생하기 쉽다. 여러 가지 유기물 첨가제와 전류인가 방식의 변화를 통한 via filling을 하였다. 첨가된 유기물은 PEG, SPS, JGB, PEI를 사용하였다. 유기물이 첨가된 용액을 이용하여 펄스와 역펄스 방법을 이용하여 via filling을 하였다. 유기물의 첨가에 따른 도금된 구리 입자의 크기 및 형상에 관하여 고찰하였으며 도금 후 via 시편의 단면을 FESEM으로 관찰하였다. JGB에 비하여 PEI를 사용한 경우 치밀한 도금층을 얻을 수 있었다. 2 step via filling을 사용한 경우 via filling 시간을 단축시킬 수 있었다.

• 한국재료학회지
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• 제16권9호
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• pp.529-532
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• 2006

Sn-filled $Co_8Sb_{24}$ skutterudites were synthesized by the encapsulated induction melting process. Single ${\delta}-phase$ was successfully obtained by subsequent annealing and confirmed by X-ray diffraction analysis. Temperature dependences of Seebeck coefficient, electrical resistivity and thermal conductivity were examined from 300 K to 700 K. The positive Seebeck coefficient confirmed the p-type conductivity of the Sn-filled $Co_8Sb_{24}$. Electrical resistivity increased with increasing temperature, which shows that the Sn-filled $Co_8Sb_{24}$ skutterudite is a highly degenerate semiconductor. Thermal conductivity was reduced by Sn-filling because the filler atoms acted as phonon scattering centers in the skutterudite lattice. Thermoelectric figure of merit was enhanced by Sn filling and its optimum filling content was considered to be $z{\leq}0.5$ in the $Sn_zCo_8Sb_{24}$ system.

• Imaging Science in Dentistry
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• 제47권3호
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• pp.189-197
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• 2017

Purpose: To quantify artifacts from different root filling materials in cone-beam computed tomography (CBCT) images acquired using different exposure parameters. Materials and Methods: Fifteen single-rooted teeth were scanned using 8 different exposure protocols with 3 different filling materials and once without filling material as a control group. Artifact quantification was performed by a trained observer who made measurements in the central axial slice of all acquired images in a fixed region of interest using ImageJ. Hyperdense artifacts, hypodense artifacts, and the remaining tooth area were identified, and the percentages of hyperdense and hypodense artifacts, remaining tooth area, and tooth area affected by the artifacts were calculated. Artifacts were analyzed qualitatively by 2 observers using the following scores: absence (0), moderate presence (1), and high presence (2) for hypodense halos, hypodense lines, and hyperdense lines. Two-way ANOVA and the post-hoc Tukey test were used for quantitative and qualitative artifact analysis. The Dunnet test was also used for qualitative analysis. The significance level was set at P<.05. Results: There were no significant interactions among the exposure parameters in the quantitative or qualitative analysis. Significant differences were observed among the studied filling materials in all quantitative analyses. In the qualitative analyses, all materials differed from the control group in terms of hypodense and hyperdense lines (P<.05). Fiberglass posts did not differ statistically from the control group in terms of hypodense halos(P>.05). Conclusion: Different exposure parameters did not affect the objective or subjective observations of artifacts in CBCT images; however, the filling materials used in endodontic restorations did affect both types of assessments.

• Restorative Dentistry and Endodontics
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• 제33권2호
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• pp.115-124
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• 2008

본 연구의 목적은 수 종의 레진계 임시수복재의 중합수축 및 수화팽창을 측정하고 레진계 임시수복재와 와동면 사이의 미세누출을 평가하고자 하였다. 본 실험의 재료는 5종의 광중합형 레진계 임시충전재 Fermit, Quicks, Provifil, Spacer, Clip와 대조군으로 석고계 충전재 Caviton을 사용하였다. 'Bonded disc method'를 이용하여 중합수축을 측정하였고, 미리 중합된 디스크 형태의 시편을 생리식염수에 담그고 LVDT로 7 일 동안 수화팽창을 기록하였다. 발거된 120개의 상, 하악 대구치에 1 급 와동을 형성한 후 각각 20개씩 6개의 군으로 나누어 각 재료를 충전한 후, 1000 회의 Thermocycling을 실시하고 2% methylene blue 염색 용액을 이용하여 미세누출을 평가하였다. 연구결과는 다음과 같다. 1. Fermit의 중합수축이 가장 적었고 (0.22%) Spacer (0.38%), Quicks (0.64%) Provifil (0.67%), Clip (0.67%) 의 순이었다. 2. 모든 재료는 24 시간 이내에 급격한 수화팽창을 나타냈고 7 일 후 수화팽창은 Caviton이 가장 컸다 (11.5%). 레진계 임시수복재는 0.43-1.1%가량 팽창하였다. 3. Fermit의 미세누출이 가장 많았으며 Quicks의 미세누출이 가장 적었다. Spacer와 Clip은 Caviton과 비슷한 정도의 미세누출을 보였다. 4. 중합수축 또는 수화팽창과 미세누출 사이의 직접적 인 상관관계는 관찰할 수 없었다.

• Journal of Welding and Joining
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• 제31권3호
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• pp.11-16
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• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.

• 한국지반신소재학회논문집
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• 제13권2호
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• pp.21-29
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• 2014

시멘트 페이스트를 사용한 충전재는 현장 시공 시 실제 주입량이 지나치게 커서 비효율적이며, 설계기준에 비해 과도한 강도를 발현하여 시멘트 사용에 따른 환경성 문제를 지니고 있다. 이에 대한 대안으로 기존의 시멘트 페이스트를 대체함과 동시에 경제성과 환경성을 고려하여 현장에서 발생되는 현장토를 충전재로 재활용한 고화처리 충전재의 현장 적용성을 평가하였다. 또한, 현장 재하시험 및 하중전이 계측을 수행하여 말뚝의 축방향 지지거동을 분석하였다. 그 결과 고화처리 충전재는 기존 시멘트 페이스트에 비해 유동성과 재료분리저항성 및 부착강도에서는 좋은 성능을 발휘하였고, 동재하시험에 의한 주면마찰력은 다소 떨어졌으나 수평지지력 및 인발력 등은 유사하였고, 설계지지력 이상 도출되어 기준에 부합된 결과를 나타내었다.

• 대한금속재료학회지
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• 제48권7호
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• pp.667-673
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• 2010

Copper filling into TSV (through-silicon-via) and reduction of the filling time for the three dimensional chip stacking were investigated in this study. A Si wafer with straight vias - $30\;{\mu}m$ in diameter and $60\;{\mu}m$ in depth with $200\;{\mu}m$ pitch - where the vias were drilled by DRIE (Deep Reactive Ion Etching) process, was prepared as a substrate. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to reduce the time required complete the Cu filling into the TSV, the PPR (periodic pulse reverse) wave current was applied to the cathode of a Si chip during electroplating, and the PR (pulse-reverse) wave current was also applied for a comparison. The experimental results showed 100% filling rate into the TSV in one hour was achieved by the PPR electroplating process. At the interface between the Cu filling and Ti/ Au functional layers, no defect, such as a void, was found. Meanwhile, the electroplating by the PR current showed maximum 43% filling ratio into the TSV in an hour. The applied PPR wave form was confirmed to be effective to fill the TSV in a short time.