• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.33-36
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• 2000

Active-controlled field emitter arrays (ACFEAs) are developed by monolithically integrating molybdenum field emitter arrays with amorphous silicon thin film transistors (a-Si：H TFTs) on glass substrate. Transfer and output characteristics of the fabricated ACFEAs showed that the emission currents of FEAs can be accurately controlled by the gate bias voltages of TFTs. Also, the emission currents of the ACFEAs kept stable without any fluctuations during the 30 min-operation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.05a
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• pp.124-128
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• 1995

We have fabricated the vacuum magnetic device with a lateral field emitter arrays constructed on n-Si wafer, and investigated its magnetic characteristics. The device is consited to tip-arrayed emitter. gate and split-anode, The fabricated vacuum magnetic device has showed a good linearity of magnetic field and a high sensitivity compared with the conventional semiconductor magnetic device.

• Journal of the Korean Vacuum Society
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• v.2 no.3
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• pp.331-334
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• 1993

여러 종류의 수직 또는 수평 형태의 field emitter array가 연구되었다. 그 중 수평형의 FEA는 emitter가 동일 평면 위에 구성되어 있고, gate는 고주파의 응용을 위하여서는 더욱 적합하다. 이 빗살 모양의 FEA의 구조, emission 성질, 응용에 대하여 설명한다.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.1049-1052
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• 2007

Extremely sharp and uniform Transfer Mold FEAs with thin film low work function TiN emitter material have been fabricated by controlling the thickness of the coated emitter materials to realize high efficient, high reliable and low-cost vacuum nanoelectronic devices..Their tip radii are 8.3-13.8 nm. Turn-on electric fields of the Ni FEAs and TiN-FEAs resulted in the low electric field values of $31.6\;V/{\mu}m$ and $44.2V/{\mu}m$,respectively, at the short emitter/anode distance: less than $30\;{\mu}m$, which are lower than those of conventional FE As such as Spindt type FEAs and carbon nan otube FEAs The Transfer Metal Mold fabrication method is one of the best methods of changing emit ter materials with sharp and uniform emit ter shapes.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.219-220
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• 2000

We propose a new method for the formation of an aluminum parting layer in the fabrication of field emitter arrays, in which we used a reflow property of aluminum at a lower temperature than the deformation point of glass. After the sputtered aluminum layer on the gate metal was etched for the formation of gate holes, we carried out a rapid thermal annealing process, by which the aluminum slightly diffused into the gate hole. This reflowed aluminum could be used as a parting layer and emitter arrays were easily fabricated using this method.

• Transactions on Electrical and Electronic Materials
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• v.14 no.1
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• pp.28-31
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• 2013

A volcano shaped gated Si-FEA (silicon field emitter array) was simply fabricated using sputtering as a gate electrode deposition and lift-off for the removal of the oxide mask, respectively. Due to the limited step coverage of well-controlled sputtering and the high aspect ratio in Si dry etch caused by high RF power, it was possible to obtain Si FEAs with a stable volcano shaped gate structure and to realize the restriction of gate leakage current in field emission characteristics. For 100 tip arrays and 625 tip arrays, gate leakage currents were restricted to less than 1% of the anode current in spite of the volcano-shaped gate structure. It was also possible to keep the emitters stable without any failure between the Si cathode and gate electrode in field emission for a long time.

• Journal of Information Display
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• v.1 no.1
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• pp.63-69
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• 2000

In order to improve both the level and the stability of electron emission, Mo and Co silicides were formed from Mo mono-layer and Ti/Co bi-layers on single crystal silicon field emitter arrays (FEAs), respectively. Using the slope of Fowler-Nordheim curve and tip radius measured from scanning electron microscopy (SEM), the effective work function of Mo and Co silicide FEAs were calculated to be 3.13 eV and 2.56 eV, respectively. Compared with silicon field emitters, Mo and Co silicide exhibited 10 and 34 times higher maximum emission current, 10 V and 46 V higher device failure voltage, and 6.1 and 4.8 times lower current fluctuation, respectively. Moreover, the emission currents of the silicide FEAs depending on vacuum level were almost the same in the range of $10^{-9}{\sim}10^{-6}$ torr. This result shows that silicide is robust in terms of anode current degradation due to the absorption of air molecules.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.154-154
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• 2000

FED(Field emission display)의 FEAs(Field emitter arrays)에 형성되어 있는 micro-tip 은 tip 표면의 오염이나 진공내부의 잔류가스에 대단히 민감하다. 특히, emitter 물질의 일함수 및 겉모양 같은 기하학적 요소에 민감한 전계방출 소자의 특성상 tip 선단이 oxidation 될 경우 일함수가 증가하여 전자방출에 필요한 구동전압이 증가하고 전자 방출의 불균일성이 커지는 문제점이 발생한다. 이에 고진공의 동작 환경 및 FEAs 제작과정이나 공기의 노출에 발생하는 tip 표면의 오염물질 제거가 요구된다. 따라서 본 연구에서는 40$\times$40mm2 FEAs에 laser power, scan speed을 달리하며 laser(cw Nd-YAG, 1064nm)을 조사하였다. laser cleaning 효과를 보기 위해 laser irradiation 전, 후에 진공도 5$\times$10-7torr irradiation 후에 emitter tip의 뚜렷한 기하학적 모양의 변화를 볼 수는 없었지만, I-V 특성이 향상 되는 것을 볼 수 있었다.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.7
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• pp.521-524
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• 1999

Nb silicide was formed on the Si micro-tip arrays in order to improve field emission properties of Si-tip field emitter array. After silicidization of the tips, the etch-back process, by which gate insulator, gate electrode and photoresist were deposited sequentially and gate holes were defined by removing gradually the photoresist by $O_2$ plasma from the surface, was applied. Si nitride film was used as a protective layer in order to prevent oxygen from diffusion into Nb silicide layer and it was identified that the NbSi2 was formed through annealing in $N_2$ ambient at $1100^{\circ}C$ for 1 hour. By the Nb silicide coating on Si tips, the turn-on voltage was decreased from 52.1 V to 32.3 V and average current fluctuation for 1 hour was also reduced from 5% to 2%. Also, the fabricated Nb silicide-coated Si tip FEA emitted electrons toward the phosphor and light emission was obtained at the gate voltage of 40~50 V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.347-350
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• 2001

A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.