• Proceedings of the KWS Conference
• /
• 2007.11a
• /
• pp.168-170
• /
• 2007

Sn-Bi eutectic solder alloy have is good wetting and physical properties. The results of solder paste properties test, melting point is about $139^{\circ}C$ and spread test is represent spread properties of $7{\sim}16%$. The results of shear strength after as reflowed, thermal shock test, high temperature storage test of 500hr and 1000hr at $100^{\circ}C$. The shear strength value range is from 6000 to 11000gf, pull strength value range is from 2200 to 3300gf.

• Journal of Welding and Joining
• /
• v.20 no.2
• /
• pp.77-81
• /
• 2002

Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).

• Korean Journal of Materials Research
• /
• v.27 no.10
• /
• pp.557-562
• /
• 2017

The microstructural evolution and modulation of mechanical properties were investigated for a $Ti_{65}Fe_{35}$ hypereutectic alloy by addition of $Bi_{53}In_{47}$ eutectic alloys. The microstructure of these alloys changed with the additional BiIn elements from a typical dendrite-eutectic composite to a bimodal eutectic structure with primary dendrite phases. In particular, the primary dendrite phase changed from a TiFe intermetallic compound into a ${\beta}$-Ti solid solution despite their higher Fe content. Compressive tests at room temperature demonstrated that the yield strength slightly decreased but the plasticity evidently increased with an increasing Bi-In content, which led to the formation of a bimodal eutectic structure (${\beta}$-Ti/TiFe + ${\beta}$-Ti/BiIn containing phase). Furthermore, the (Ti65Fe35)95(Bi53In47)5 alloy exhibited optimized mechanical properties with high strength (1319MPa) and reasonable plasticity (14.2 %). The results of this study indicate that the transition of the eutectic structure, the type of primary phases and the supersaturation in the ${\beta}$-Ti phase are crucial factors for controlling the mechanical properties of the ultrafine dendrite-eutectic composites.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.3
• /
• pp.9-18
• /
• 1999

In this study, Metallugical properties between Sn-3.5Ag, Sn-37Pb eutectic solders and Au/Ni/cu substrate according to time span above the melting point were investigated. A conventional reflow soldering machine wert used for this study and time span above the melting point was determined by changing peak soldering temperature and conveyor speed. As results, scallop type intermetallic compounds of $Ni_3Sn_4$ were formed at joint interface and no Cu-Sn compounds were found at all; Ni layer performed as a barrier for Cu diffusion. As the peak soldering temperature increased, thickness of the intermetallic compound layer increased; maximum thickness of the scallop-layer was 2.2$\mu\textrm{m}$. The shape of scallops were transformed from hemi-sphere type to elliptical shape with smaller size. Micro-hardness of the solder joint decreased as the eutectic structure of Sn-3.5Ag and Sn-37Pb increased.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.4
• /
• pp.23-28
• /
• 2009

We investigated the wafer-level MEMS capping process for which cavity formation in Si wafer was not required. Ni caps were formed by electrodeposition on 4" Si wafer and Ni rims of the Ni caps were bonded to the Cu rims of bottom Si wafer by using epoxy. Then, top Si wafer was debonded from the Ni cap structures by using SnBi layer of low melting temperature. As-evaporated SnBi layer was composed of double layers of Bi and Sn due to the large difference in vapor pressures of Bi and Sn. With keeping the as-evaporated SnBi layer at $150^{\circ}C$ for more than 15 sec, SnBi alloy composed of eutectic phase and Bi-rich $\beta$ phase was formed by interdiffusion of Sn and Bi. Debonding between top Si wafer and Ni cap structures was accomplished by melting of the SnBi layer at $150^{\circ}C$.

• Journal of Welding and Joining
• /
• v.15 no.4
• /
• pp.78-89
• /
• 1997

This study has evaluated the weld metal solidification cracking behavior of several Ni base superalloys (Incoloy 825, Inconel 718 and Inconel 600). Austenitic stainless steels(304, 310S) were also included for comparison. In addition, a possible mechanism of solidification cracking in the fusion zone was suggested based on the extensive microstructural examinations with SEM, EDAX, TEM, SADP and AEM. The solidification cracking resistance of Ni base superalloys was found to be far inferior to that of austenitic stainless steels. The solidification cracking of Incoloy 825 and Inconel 718 was believel to be closely related with the Laves-austenite (Ti rich in 825 and Nb rich in 718) and MC-austenite eutectic phases formed along the grain boundaries during solidification. Cracking in Inconel 600 was always found along the grain boundaries which were enriched with Ti and P. Further, solidifidcation cracking resistance was dependent not only upon the type of love melting phases but also on the amount of the phases along the solidification grain boundaries.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1999.03b
• /
• pp.199-202
• /
• 1999

Many processing times for fabricating complex shaped parts by near net shape process such as thixoforming or semi-solid forming, are required due to the time for die design, induction heating and forming process. Therefore, for the thixoforming process, multi-capacity induction heating process is very important due to the reduction of the processing time and cost. It is indispensable to adopt a power-time heating pattern which manages to conciliate complete eutectic melting at the core with limited overheating at the periphery. The total reheating time is thus dependent on billet diameter; in inches$(pm20%)$. Typically, high frequency is used for the rapid reheating of the billet to the eutectic temperature range and low frequency for the remelting of the desired fraction of liquid and for the radial homogeneization of the liquid fraction. So in this study, the multi-capacity induction heating conditions of ALTHIX 86s alloy to reduce the processing time and cost would be proposed. The suitability of multi-capacity induction heating conditions would be verified through the comparison to Garat's data.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.3
• /
• pp.155-158
• /
• 2014

The phase transformation of Sn-Pb-Bi solder for photovoltaic ribbon during soldering was studied using real-time synchrotron x-ray scattering. At room temperature, Sn and Pb crystal phases in the solder existed separately. By heating to $92^{\circ}C$, a new PbBi alloy crystal phase was formed, which grew further up to $160^{\circ}C$. The Sn crystal phase first started to melt at $160^{\circ}C$, and was mostly melted at $165^{\circ}C$. In contrast, the Pb and PbBi crystal phases started to melt at $165^{\circ}C$, and were mostly melted at $170^{\circ}C$. The useful result was obtained, that the solder's melting temperature decreased from $183^{\circ}C$ to $170^{\circ}C$ by addition of a small amount of Bi atoms to the eutectic Sn62-Pb38 (wt%) solder. Our study first revealed the detailed in-situ phase transformation of Sn-Pb-Bi solder during heating to the eutectic temperature. Considering the results of peel strength and hardness, adding 1 wt% of Bi atoms to the Sn62-Pb38 (wt%) solder produced an appropriate composition.

• Nuclear Engineering and Technology
• /
• v.49 no.8
• /
• pp.1727-1732
• /
• 2017

Pyroprocessing is an alternative method of reprocessing spent fuel, usually involving the dissolving spent fuel in a molten salt media. The National Nuclear Laboratory designed, built, and commissioned a molten salt dynamics rig to investigate the transfer characteristics of molten lithium chloride-potassium chloride eutectic salt. The efficacy and flow characteristics of a high-temperature centrifugal pump and argon gas lift were obtained for pumping the molten salt at temperatures up to $500^{\circ}C$. The rig design proved suitable on an industrial scale and transfer methods appropriate for use in future molten salt systems. Corrosion within the rig was managed, and melting techniques were optimized to reduce stresses on the rig. The results obtained improve the understanding of molten salt transport dynamics, materials, and engineering design issues and support the industrialization of molten salts pyroprocessing.

• Transactions of the Korean hydrogen and new energy society
• /
• v.17 no.2
• /
• pp.174-180
• /
• 2006

The eutectic Mg-23.5%Ni alloy was casted by melting and solidification. The powders of Mg-23.5%Ni and (Mg-23.5%Ni)-10% iron oxide were prepared by mechanical grinding of casted Mg-Ni alloy and casted Mg-Ni alloy+oxide, respectively. As milling time increases, hydriding and dehydriding rates of Mg-Ni and Mg-Ni-oxide alloy powders increase. The additions of iron oxide to Mg-Ni alloy and Mg-Ni-oxide increase hydriding rates and slightly decrease dehydriding rates.