Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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The evolution of reliability of Sn-Bi binary solder paste

Sn-Bi 공정 조성 솔더 페이스트의 특성평가

  • 박부근 ((재)포항산업과학연구원 신뢰성 평가 센터 신뢰성 평가실) ;
  • 박재현 ((재)포항산업과학연구원 신뢰성 평가 센터 신뢰성 평가실)
  • Published : 2007.11.15
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Abstract

Sn-Bi eutectic solder alloy have is good wetting and physical properties. The results of solder paste properties test, melting point is about $139^{\circ}C$ and spread test is represent spread properties of $7{\sim}16%$. The results of shear strength after as reflowed, thermal shock test, high temperature storage test of 500hr and 1000hr at $100^{\circ}C$. The shear strength value range is from 6000 to 11000gf, pull strength value range is from 2200 to 3300gf.

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