• Transactions of the Korean Society of Mechanical Engineers B
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• v.39 no.5
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• pp.449-453
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• 2015

Recently, surfaces with micro and nano structures are the focus of various research and engineering fields to enhance wetting characteristics of the surfaces. Hydrophilic surfaces with hierarchical structures are generally characterized by the interfacial behavior of water droplets. In this study, the interfacial behavior of water droplets is experimentally investigated considering the scale of structures. Using the dry etching and conventional lithography method, quantitative hierarchical structured surfaces are developed. The behavior of the liquid-vapor interface on the test sections is visualized using an automatic goniometer and a high-speed camera. On the basis of the visualized data, the interfacial behavior of water droplets is intensively investigated according to surface geometrical characteristics.

• The Journal of Advanced Prosthodontics
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• v.7 no.2
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• pp.108-114
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• 2015

PURPOSE. The aim of this study was to evaluate effect of different surface treatment methods on the bond strength between aged composite-resin core and luting agent. MATERIALS AND METHODS. Seventy-five resin composites and also seventy-five zirconia ceramic discs were prepared. 60 composite samples were exposed to thermal aging (10,000 cycles, 5 to $55^{\circ}C$) and different surface treatment. All specimens were separated into 5 groups (n=15): 1) Intact specimens 2) Thermal aging-air polishing 3) Thermal aging- Er:YAG laser irradiation 4) Thermal aging- acid etching 5) Thermal-aging. All specimens were bonded to the zirconia discs with resin cement and fixed to universal testing machine and bond strength testing loaded to failure with a crosshead speed of 0.5 mm/min. The fractured surface was classified as adhesive failure, cohesive failure and adhesive-cohesive failure. The bond strength data was statistically compared by the Kruskal-Wallis method complemented by the Bonferroni correction Mann-Whitney U test. The probability level for statistical significance was set at ${\alpha}$=.05. RESULTS. Thermal aging and different surface treatment methods have significant effect on the bond strength between composite-resin cores and luting-agent (P<.05). The mean baseline bond strength values ranged between $7.07{\pm}2.11$ and $26.05{\pm}6.53$ N. The highest bond strength of $26.05{\pm}6.53$ N was obtained with Group 3. Group 5 showed the lowest value of bond strength. CONCLUSION. Appropriate surface treatment method should be applied to aged composite resin cores or aged-composites restorations should be replaced for the optimal bond strength and the clinical success.

• The Journal of Advanced Prosthodontics
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• v.5 no.2
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• pp.126-132
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• 2013

PURPOSE. Post surface conditioning is necessary to expose the glass fibers to enable bonding between fiber post and resin cement. The purpose of the present study was to evaluate the effect of different surface conditioning on tensile bond strength (TBS) of a glass fiber reinforced post to resin cement. MATERIALS AND METHODS. In this in vitro study, 40 extracted single canal central incisors were endodontically treated and post spaces were prepared. The teeth were divided into four groups according to the methods of post surface treatment (n=10): 1) Silanization after etching with 20% $H_2O_2$, 2) Silanization after airborne-particle abrasion, 3) Silanization, and 4) No conditioning (Control). Adhesive resin cement (Panavia F 2.0) was used for cementation of the fiber posts to the root canal dentin. Three slices of 3 mm thick were obtained from each root. A universal testing machine was used with a cross-head speed of 1 mm/minute for performing the push-out tests. Two-way ANOVA and Tukey post hoc tests were used for analyzing data (${\alpha}$=0.05). RESULTS. It is revealed that different surface treatments and root dentin regions had significant effects on TBS, but the interaction between surface treatments and root canal regions had no significant effect on TBS. There was significant difference among $H_2O_2$ + Silane Group and other three groups. CONCLUSION. There were significant differences among the mean TBS values of different surface treatments. Application of hydrogen peroxide before silanization increased the bond strength between resin cements and fiber posts. The mean TBS mean values was significantly greater in the coronal region of root canal than the middle and apical thirds.

• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.291-296
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• 2010

Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: $10{\mu}m$ sized $Al_2O_3$ powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/$HNO_3$/$CH_3COOH$) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.

• Restorative Dentistry and Endodontics
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• v.7 no.1
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• pp.77-83
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• 1981

The purpose of this study was to observe the bonding strength between tooth surface (enamel and dentin) and restorative filling materials which are two composite resins (Clearfil and Concise) and Glass ionomer cement, after etching with 50% phoshoric acid and 37% citric acid. To measure the bonding strength in enamel, the labial surface of upper anterior tooth was cut flatly with using carborundum disk and polished with sand paper disk, and to measure in dentin, the dentin surface was prepared by grinding upper part of posterior tooth horizontally. After washing the tooth surface with water and drying with air blast, the prepared tooth surface was etched. In glass ionomer cement, 50% phosphoric acid and 37% citric acid were used, in Clearfil 40% phosphoric acid was used and in Concise, 50% phosphoric acid and 37% citric acid were used as etchant for 1 minute. After the copper band which is 5 mm in diameter and 5 mm in height was fixed on the prepared surface and each filling material was inserted into the copper band, the hooking loop was inserted into filled material in the copper band before setting to make it easily that the load is applied on the specimen. After all specimens were immersed in water at $37^{\circ}C$ for 1 week, this specimen was placed on the load cell of tensile test apparatus, and specimen was pulled at the cross-head speed of 0.8 mm per minute. The following results were obtained 1) In glass ionomer cement, the bond strength obtained by 37% citric acid was higher than one obtained by 50% phosphoric acid in enamel and dentin surfaces. The bond strength obtained in non-etched surface was much less than one by etchants in enamel and dentin surface. 2) In Clearfil, the bond strength obtained by 40% phosphoric acid was 4 times more than one obtained by non etch ant. 3) In Concise, the bond strength obtained by 50% phosphoric acid was almost same as one obtained by 37% citric acid, and the bond strength obtained by non etch ant was much less than one obtained by etchants.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.413-423
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• 1998

Dental ceramics exhibit excellent esthetic property, compressive strength, chemical durability, biocompatibility and translucency. This study evaluated the shear bond strength of composite resin to the new heat-pressed ceramic material (IPS-Empress System) depending on the surface treatments and bonding agents. The surface treatments were etching with 4.0% hydrofluoric acid, application of silane, and the combination of the two methods. Composite resin was bonded to ceramic with four kinds of dentin bonding agents(All-Bond 2, Heliobond, Scotch bond Multi-purpose and Tenure bonding agents). The ceramic specimen bonded with composite resin was mounted in the testing jig, and the universal testing machine(Zwick 020, Germany) was used to measure the shear bond strength with the cross head speed of 0.5 mm/min. The results obtained were as follows 1. The mean shear bond strength of the specimens of which the ceramic surface was treated with the combination of hydrofluoric acid and silane before bonding composite resin was significantly higher than those of the other surface treatment groups(p<0.05). 2. In the case of All-Bond 2 and Scotchbond Multi-purpose bonding agent group, the surface treatment methods did not influenced significantly on the shear bond(p>0.05). 3. Of the four bonding agents tested, the shear bond strength of Heliobond was significantly lower than those of other bonding agents regardless of the surface treatment methods(p<0.05). 4. The highest shear bond strength($12.55{\pm}1.92$ MPa) was obtained with Scotchbond Multipurpose preceded by the ceramic surface treatment with the combination of 4% hydrofluoric acid and silane.

• Korean Journal of Metals and Materials
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• v.48 no.7
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• pp.667-673
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• 2010

Copper filling into TSV (through-silicon-via) and reduction of the filling time for the three dimensional chip stacking were investigated in this study. A Si wafer with straight vias - $30\;{\mu}m$ in diameter and $60\;{\mu}m$ in depth with $200\;{\mu}m$ pitch - where the vias were drilled by DRIE (Deep Reactive Ion Etching) process, was prepared as a substrate. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to reduce the time required complete the Cu filling into the TSV, the PPR (periodic pulse reverse) wave current was applied to the cathode of a Si chip during electroplating, and the PR (pulse-reverse) wave current was also applied for a comparison. The experimental results showed 100% filling rate into the TSV in one hour was achieved by the PPR electroplating process. At the interface between the Cu filling and Ti/ Au functional layers, no defect, such as a void, was found. Meanwhile, the electroplating by the PR current showed maximum 43% filling ratio into the TSV in an hour. The applied PPR wave form was confirmed to be effective to fill the TSV in a short time.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.2
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• pp.148-156
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• 2008

Statement of problems: Self-etch adhesives exhibit some clinical benefits such as ease of manipulation and reduced technique-sensitivity. Nevertheless, some concern remains regarding the bonding effectiveness of self-etch adhesives to enamel, in particular when so-called 'mild' self-etch adhesives are employed. This study compared the microtensile bond strengths to ground enamel of the two-step self-etch adhesive Clearfil SE Bond (Kuraray) to the three-step etch-and- rinse adhesive Scotchbond Multi-Purpose (3M ESPE) and the one-step self-etch adhesive iBond (Heraeus Kulzer). Purpose: The purpose of this study was to determine the effect of a preceding phosphoric acid conditioning step on the bonding effectiveness of a two-step self-etch adhesive to ground enamel. Material and methods: The two-step self-etch adhesive Clearfil SE Bond non-etch group, Clearfil SE Bond etch group with prior 35% phosphoric acid etching, and the one-step self-etch adhesive iBond group were used as experimental groups. The three-step etch-and-rinse adhesive Scotchbond Multi-Purpose was used as a control group. The facial surfaces of bovine incisors were divided in four equal parts cruciformly, and randomly distributed into each group. The facial surface of each incisor was ground with 800-grit silicon carbide paper. Each adhesive group was applied according to the manufacturer's instructions to ground enamel, after which the surface was built up using Light-Core (Bisco). After storage in distilled water at $37^{\circ}C$ for 1 week, the restored teeth were sectioned into enamel beams approximately 0.8*0.8mm in cross section using a low speed precision diamond saw (TOPMET Metsaw-LS). After storage in distilled water at $37^{\circ}C$ for 1 month, 3 months, microtensile bond strength evaluations were performed using microspecimens. The microtensile bond strength (MPa) was derived by dividing the imposed force (N) at time of fracture by the bond area ($mm^2$). The mode of failure at the interface was determined with a microscope (Microscope-B nocular, Nikon). The data of microtensile bond strength were statistically analyzed using a one-way ANOVA, followed by Least Significant Difference Post Hoc Test at a significance level of 5%. Results: The mean microtensile bond strength after 1 month of storage showed no statistically significant difference between all adhesive groups (P>0.05). After 3 months of storage, adhesion to ground enamel of iBond was not significantly different from Clearfil SE Bond etch (P>>0.05), while Clearfil SE Bond non-etch and Scotchbond Multi-Purpose demonstrated significantly lower bond strengths (P<0.05), with no significant differences between the two adhesives. Conclusion: In this study the microtensile bond strength to ground enamel of two-step self-etch adhesive Clearfil SE Bond was not significantly different from three-step etch-and-rinse adhesive Scotchbond Multi-Purpose, and prior etching with 35% phosphoric acid significantly increased the bonding effectiveness of Clearfil SE Bond to enamel at 3 months.

• Restorative Dentistry and Endodontics
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• v.36 no.4
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• pp.280-289
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• 2011

Objectives: The purpose of this study was to evaluate ${\mu}TBS$ (microtensile bond strength) of current dentin bonding adhesives which have different hydrophobicity with low-shrinkage silorane resin. Materials and Methods: Thirty-six human third molars were used. Middle dentin was exposed. The teeth were randomly assigned to nine experimental groups: Silorane self-etch adhesives (SS), SS + phosphoric acid etching (SS + pa), Adper easy bond (AE), AE + Silorane system bonding (AE + SSb), Clearfil SE bond (CSE), CSE + SSb, All-Bond 2 (AB2), AB2 + SSb, All-Bond 3 (AB3). After adhesive's were applied, the clinical crowns were restored with Filtek LS (3M ESPE). The 0.8 mm ${\times}$ 0.8 mm sticks were submitted to a tensile load using a Micro Tensile Tester (Bisco Inc.). Water sorption was measured to estimate hydrophobicity adhesives. Results: ${\mu}TBS$ of silorane resin to 5 adhesives: SS, 23.2 MPa; CSE, 19.4 MPa; AB3, 30.3 MPa; AB2 and AE, no bond. Additional layering of SSb: CSE + SSb, 26.2 MPa; AB2 + SSb, 33.9 MPa; AE + SSb, no bond. High value of ${\mu}TBS$ was related to cohesive failure. SS showed the lowest water sorption. AE showed the highest solubility. Conclusions: The hydrophobicity of adhesive increased, and silorane resin bond-strength was also increased. Additional hydrophobic adhesive layer did not increase the bond-strength to silorane resin except AB2 + SSb. All-Bond 3 showed similar ${\mu}TBS$ & water sorption with SS. By these facts, we could reach a conclusion that All-Bond 3 is a competitive adhesive which can replace the Silorane adhesive system.

• Korean Chemical Engineering Research
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• v.52 no.3
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• pp.382-387
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• 2014

The PC/ABS blends were manufactured with high shear rate processing. Changes of the blend morphology were analyzed according to the screw speed and processing time. To find optimal conditions of the high shear rate processing of the PC/ABS blend, blend morphology and size of the dispersed phase, ABS, were observed with a SEM. Also, tensile properties of the PC/ABS blends were measured to investigate the effect of the high shear rate process with the screw speed of 500 rpm to 3000 rpm for processing times of 10s to 40s. Especially, to observe the dispersed phase of the PC/ABS blend clearly, fracture surfaces of the PC/ABS blend were etched with chromic acid solution. As screw speed and processing time increase, dispersed phase size of the PC/ABS blend decreases and mechanical properties of the blend decrease as well. Especially, at screw speed over than 1000 rpm of high shear rate processing, mechanical properties of the PC/ABS blends decrease drastically due to the degradation of the blend during the high shear rate processing. Consequently, the optimal condition of screw speed of the high shear processing of the PC/ABS blend is set at 1000rpm, in this study. Under optimal condition, the PC/ABS blend has relatively high mechanical properties with the relatively stable micro-structure having nanometer scale dispersed phase.