• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.72-77
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• 2008

This paper investgated on fabrication process and tolerance of resistance body with a uniform thickness formed by the process of cavity type on organic substrate for application of embedded resistor. To improve the tolerance of resistance value according to a position of PCB cause by conventional screen printing, we introduced the process of cavity type from organic substrate. A resistor with a desired shape and volume was precisely formed by the process of cavity using a resistor paste and screen printing. This method can increase PCB's productivity by shortening its production time because process conditions of a screen prining device can be set quickly without any affection on its position accuracy.

• Journal of Korea Multimedia Society
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• v.4 no.1
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• pp.82-90
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• 2001

Genetic Algorithm(GA) has known as a method of solving NP problem in various applications. Since a major drawback of the GA is that it needs a long computation time, the hardware implementation of Genetic Algorithm is focused on in recent studies. This paper proposes a new type of embedded one chip computer fort Hardware Implementation of Genetic Algorithm. The proposed embedded one chip computer consists of 16 Bit CPU care and hardware of genetic algorithm. In contrast to conventional hardware oriented GA which is dependent on main computer in the process of GA, the proposed embedded one chip computer is independent on main computer. Conventional hardware GA uses the fixed length of chromosome but the proposed embedded one chip computer uses the variable length of chromosome by employing the efficient 16 bit Pipeline Unit. Experimental results show that the proposed one chip computer is applicable to the design of evolvable hardware for Random NRZ bit synchronization circuit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.760-763
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• 2003

Low Temperature Cofired Ceramics (LTCC) technology is a promising technology to integrate many devices in a module by embedding passive components. For the module substrate, most LTCC structures have dielectric constants below 10 to reduce signal delay time. Some components, which need high dielectric constants, have not been yet embedded in LTCC module. So, embedding capacitor with high capacitance by applying another dielectrics with high dielectric constants in LTCC is an important issue to maximize circuit density in LTCC module. In this study, electrical properties of embedded capacitor fabricated by dielectric paste of high dielectric constants (K-100) and co-firing behavior with LTCC were investigated. To prevent camber development of co-fired structure, constrained sintering process was tested. Dielectric properties of embedded capacitors were calculated from their capacitance and impedance value. Temperature coefficient of capacitance were also measured.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1042-1045
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• 2003

In this paper, we present a new method for the monitoring of Electric Control Unit's(ECU) self-diagnostic and the sensor signals of vehicle through Web. In order to measure the ECU's self-diagnostic and sensor signals, the interfaced circuit is designed to communicate ECU and terminal according to the ISO, SAE regulation of communication protocol standard. Microprocessor 80C196KC is used for communicating ECU's self-diagnostic signals and the results are sent to the Embedded Linux System(ELS) through RF module. ELS is developed by SA1110, RF module, Embedded Linux. All commands related in ECU communication are executed through Web. The CGI program composed in web server is executed by user and will return sensor signals from ECU Software on Embedded Linux system is developed to monitor the ECU's sensor signals using the arm compiler tool chain in which RS232 port is programmed by half duplex method. The possibility for remote measurement of ECU sensor signal through Web is verified through the developed systems and algorithms.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.6
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• pp.284-292
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• 2008

The density of Memory has been increased by great challenge for memory technology; therefore, elements of memory become more smaller than before and the sensitivity to faults increases. As a result of these changes, memory testing becomes more complex. In addition, as the number of storage elements per chip increases, the test cost becomes more remarkable as the cost per transistor drops. Recent development in system-on-chip(SoC) technology makes it possible to incorporate large embedded memories into a chip. However, it also complicates the test process, since usually the embedded memories cannot be controlled from the external environment. We present a ARM processor-programmable built-in self-test(BIST) scheme suitable for embedded memory testing in the SoC environment. The proposed BIST circuit can be programmed vis an on-chip microprocessor.

• Journal of Drive and Control
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• v.20 no.4
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• pp.17-26
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• 2023

A forklift is an industrial vehicle that lifts or transports heavy objects using a hydraulically operated fork, and is equipped with an automatic transmission for the convenience of repetitive transportation, loading, and unloading work. The Transmission Control Unit (TCU) is a key component in charge of the shift control function of an automatic transmission. It consists of an electric circuit with an input/output signal interface function and firmware running on a microcontroller. To develop TCU firmware, the development process of shifting algorithm design, firmware programming, verification test, and performance improvement must be repeated. A simulator is a device that simulates a mechanical system having dynamic characteristics in real time and simulates various sensor signals installed in the system. The embedded transmission simulator is a simulator that is embedded in the TCU firmware. information related to the mechanical system that is necessary for TCU normal operation. In this study, an embedded transmission simulator applied to the originally developed forklift TCU firmware was designed and used to verify various forklift shift control algorithms.

• Journal of Digital Contents Society
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• v.18 no.3
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• pp.607-612
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• 2017

The use of RaspberryPi in building an embedded system may be difficult for users in understanding the circuit and the hardware cost. This paper proposes a solution that can test the systems virtually. The solution consists of three elements; (i) editor, (ii) interpreter and (iii) simulator and provides nine full modules and also allows the users to configure/run/test their own circuits like real environment. The task of abstraction for modules through the actual circuit test was carried out on the basis of the data sheet and the specification provided by the manufacturer. If we can improve the level of quality of our solution, it can be useful in terms of cost reduction and easy learning. To achieve this end, the electrical physics engine, the level of interpreter that can be ported to the actual board, and a generalization of the simulation logic are required.

• Smart Media Journal
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• v.7 no.1
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• pp.37-44
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• 2018

Utilizing sequence control and numerical computing, embedded devices are used in a variety of automated systems, including those at industrial sites, in accordance with their control program. Since embedded devices are used as a control system in corporate industrial complexes, nuclear power plants and public transport infrastructure nowadays, deliberate attacks on them can cause significant economic and social damages. Most attacks aimed at embedded devices are data-coded, code-modulated, and control-programmed. The control programs for industry-automated embedded devices are designed to represent circuit structures, unlike common programming languages, and most industrial automation control programs are designed with a graphical language, LAD, which is difficult to process static analysis. Because of these characteristics, the vulnerability analysis and security related studies for industry automation control programs have only progressed up to the formal verification, real-time monitoring levels. Furthermore, the static analysis of industrial automation control programs, which can detect vulnerabilities in advance and prepare for attacks, stays poorly researched. Therefore, this study suggests a method to present a discussion on an industry automation control program designed to represent the circuit structure to increase the efficiency of static analysis of embedded industrial automation programs. It also proposes a medium term translation technology exploiting LLVM IR to comprehensively analyze the industrial automation control programs of various manufacturers. By using LLVM IR, it is possible to perform integrated analysis on dynamic analysis. In this study, a prototype program that converts to a logical expression type of medium language was developed with regards to the S company's control program in order to verify our method.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.626-628
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• 2004

This paper describes an 8-bit CMOS folding A/D converter for set-top box. Modular low-power, high-speed CMOS A/D converter for embedded systems aims at design techniques for low-power, high-speed A/D converter processed by the standard CMOS technology. The time-interleaved A/D converter or flash A/D converter are not suitable for the low-power applications. The two-step or multi-step flash A/D converters need a high-speed SHA, which represents a tough task in high-speed analog circuit design. On the other hand, the folding A/D converter is suitable for the low-power, high-speed applications(Embedded system). The simulation results illustrate a conversion rate of 40MSamples/s and a Power dissipation of 80mW(only analog block) at 2.5V supply voltage.