• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.410-413
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• 2004

In this paper, a simulator system for Fuel Cell Hybrid Electric Vehicles(FCHEV) is implemented using DSP boards with CAN bus. The subsystems of a FCHEV i.e., the fuel cell system, the battery system, the vehicle dynamics with the transmission mechanism are coded into 3 DSP boards. The power distribution control algorithm and battery SOC control are also coded into a DSP board. The real-time monitoring program is also developed to examine the control performance of power control and SOC control algorithms.

• Journal of information and communication convergence engineering
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• v.14 no.3
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• pp.184-190
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• 2016

We present experimental demonstrations of electromagnetic bandgap (EBG) structures for the wideband suppression of radiated emissions from a power bus in high-speed printed circuit boards (PCBs). In most of the PCB designs, a parallel plate waveguide (PPW) structure is employed for a power bus. This structure significantly produces the wideband-radiated emissions resulting from parallel plate modes. To suppress the parallel plate modes in the wideband frequency range, the power buses based on the electromagnetic bandgap structure with a defected ground structure (DGS) are presented. DGSs are applied to a metal plane that is connected to a rectangular EBG patch by using a via structure. The use of the DGS increases the characteristic impedance value of a unit cell, thereby substantially improving the suppression bandwidth of the radiated emissions. It is experimentally demonstrated that the DGS-EBG structure significantly mitigates the radiated emissions over the frequency range of 0.5 GHz to 2 GHz as compared to the PPW.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.8
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• pp.76-85
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• 2003

In this paper, a technical method for removing the solder from PCBs has been proposed to simplify the pulverizing process and to get higher quality of materials for recycling of the electronic parts in the Printed Circuit Boards (PCBs). There are several techniques to remove the solder from PCB, such as physical and chemical method, vibration, suction and blowing and so on. Among them, the suction technique turned out the best method by investigation. In the suction method, there are three variables for removing the solder. They are a temperature of the thermal wire, a velocity of moving PCB and a gap between PCB and thermal wire. To find the optimal variables for the system, an experiment has been conducted by a trial and error method. The optimal variables were found $220^{\circ}C$ of temperature, 11.58mm/s of velocity, 10mm of gap (A gap between suction hole and bottom of PCBs is 5mm). The result of the experiment shows that 50% of the solder were removed.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.

• Journal of IKEEE
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• v.20 no.4
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• pp.416-419
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• 2016

When the integration density and operating frequency increase in the electronic circuits, it is important to improve the signal transmission characteristics. In this paper, the signal transmission characteristics of the printed circuit boards are analyzed with the curvature of the pads. From the simulation results, signal transmission characteristics are improved when pad curvature increases. Pad curvature more effects on signal transmission characteristics when the thickness of the transmission line and the length of the transmission decrease.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.621-624
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed boards(PCR) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor meta1s, such as Al and Cu and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure. wear resistance, corrosion protection and thermal stability In this study fundamental aspects of electroless nickel deposition were studied with effort of complexeing agents of different kinds. Then the property of electroless deposit are controlled by the composition of the deposition solution the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Journal of the Korean BIBLIA Society for library and Information Science
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• v.14 no.2
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• pp.159-178
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• 2003

Electronic reference service was defined as reference service designed for remote users and identified by a specific link from a library' website. This study examined whether academic libraries deliver web-based electronic reference services to remote users. Particularly, four types of electronic bulletin board services, free bulletin board, FAQ, Q＆A and reference question-response service were measured in terms of 8 types of questions and 12 contents of questions. The result showed that there was few differences among 4 services. Guidelines for effective use of electronic bulletin board services in academic libraries were suggested: standardization of service names, easy access to menu services, definition of each menu, search function for contents and standard web forms.

• Proceedings of the IEEK Conference
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• 2004.06a
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• pp.269-272
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• 2004

Printed circuit boards (PCB) replaced conventional wiring in most electronic equipment I, reducing the size and weight of electronic equipment while improving reliability, uniformity, precision and performance. PCB is used in all kinds of electronic products because they can be mass-produced with very high circuit density and also enable easier trouble-shooting. This paper presents the analyses of the patent information of Build-up PCB which is seen as the most promising solution, as its substrate supports multi-level packaging, thinner board profiles and smaller pitches.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.477-485
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• 2016

As expensive and valuable metals being used in electronic and semiconducting industries are abandoned as industrial wastes after use of them, it is required to recover them from e-wasted electronics parts. Gold which is used for printed circuit boards or electronic equipments, accessories, etc., is one of e-Wasted materials and recently indium, gallium, zirconium, cobalt, molybdenum and lithium are bacome valuable metals to be recovered from the e-wastes. Since the amount of precious metals is now being faced with scarcity, lean too much on area and instability of supply, and industrial demands are rapidly increasing every year, it becomes more important to recover the valuable metals from the industrial wastes. In this review, we introduced technologies and research trend of the recovery processes of valuable metals from the e-wastes in high-tech devices over the world.