• Journal of Korean Ophthalmic Optics Society
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• v.15 no.1
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• pp.55-60
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• 2010

Purpose: We investigated the changes of plastic lens after etching of coating films by comparing uncoated lens. Methods: CR-39, middle index and high index lenses of 0 (zero) diopter were etched at $80^{\circ}C$ and room temperature using a coating remover, and then changes of refractive power, transmittance and surface morphology were investigated. Results: There were no differences in refractive power and transmittance between uncoated and etched lenses. The etching rate was similar in both CR-39 and middle index lens, but in the case of high index lens, it was slower and less steady than the others. From the SEM observation of lens surface, etching damage was found out on the surface of etched lens. It was shown the least damage in middle index lens but the most damage in high index lens. Conclusions: If the etching of coating films is demanded on condition that the surface of ophthalmic lenses are not damaged, a using of most adequate coating remover based on lens material should be considered, and a caution for proper etching conditions is required.

• Journal of Korean Society of Environmental Engineers
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• v.39 no.9
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• pp.542-547
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• 2017

This paper was to analyze the membrane characterization of hydrophilicity, surface morphology and membrane chemical anlysis of three commercial microfiltration/ultrafiltration membranes, and evaluate the filtration performance of a seawater to assess the availability for pretreatment of desalination process. From the results of contact angle, Mem-3, fabricated with polyacrylonitrile, was highly hydrophilic. It find out that Mem-3 has more anti-biofouling property. In Field emission scanning electron microscope (FESEM), Mem-1 (polyethylene) and Mem-2 (Polyvinylidenefluoride) showed the sponge-like shape and Mem-3 showed finger-like shape. Membrane chemical analysis by energy dispersive spectrometer (EDS) presented that Mem-2 was mostly fluoride and Mem-3 had s high ratio of N (32.47%) due to the nitrile group. The permeation flowrate per time on suction pressures using deionized water (D.I. water) tends that permeation rate of Mem-3 more increased when the pressure was increased compared to other membranes. From the results of turbidity and total suspended solids (TSS) removal, turbidity of permeate was 0.191 NTU to 0.406 NTU and TSS was 2.2 mg/L to 3.0 mg/L in all membranes, indicating that it was not suitable for the pretreatment of seawater desalination by short-term experiments.

• Elastomers and Composites
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• v.46 no.2
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• pp.164-170
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• 2011

In this study, silicone rubber filled with environmentally-friendly perlite was prepared by mechanical mixing in order to improve thermal properties, such as heat and fire resistances. We found that the properties of silicone rubber composites depended on perlite concentration by various characterization methods. Thermogravimetric analysis(TGA) indicated that the initial degradation temperature of silicone/perlite composite was higher than that of pristine silicone rubber. The gas torch test showed that the opposite side temperature of composite materials was remarkably low as compared to that of pristine silicone rubber. In addition, the composites containing 5 wt% and 10 wt% of perlite showed remarkable thermal stability at elevated temperatures according to the results of both fireproof furnace tests under the RABT condition and carbonization furnace tests. The images from a scanning electron microscope(SEM) showed the degree of dispersion of perlite in silicone rubber. Finally, it was confirmed that limited oxygen index(LOI) was increased with perlite concentration.

• Korean Journal of Microbiology
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• v.41 no.2
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• pp.152-156
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• 2005

In the present study, lactic acid bacterium that has antibacterial activity against Helicobacter pylori was isolated from feces of newborn baby. The selection was based on the ability to inhibit the growth of H. pylori and to withstand harsh environmental conditions such as acidic pH and high bile concentration. By biochemical test and 16S rDNA sequencing, selected strain was turned out to be an Pediococcus acidilactici, therefore designated to P. acidilactici GMB7330. In order to investigate the inhibitory effects of P. acidilactici GMB7330 on the growth of H. pylori, we have tested in vitro studies such as cell viability and urease test. These results showed that antibacterial activity of P. acidilactici GMB7330 significantly decreased the viable cell count and urease activity of H. pylori. Antibacterial activity of P. acidilactici GMB7330 against H. pylori remained after pH adjustment to neutral, and the concentration of lactate produced from P. acidilactici GMB7330 was not enough to inhibit H. pylori. On the basis of the analysis by transmission electron microscope, it demonstrated that addition of P. acidilactici GMB7330 destroyed the cell structure of H. pylori. These results strongly suggested that P. acidilactici GMB7330 produce antibacterial substances to be able to inhibit the growth of H. pylori other than lactic acid.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Journal of dental hygiene science
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• v.14 no.2
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• pp.140-149
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• 2014

The purpose of this study was to investigate the influence of etching surface treatment and aging treatment of zirconia on the shear bond strength between zirconia core and veneered ceramic. Four groups of zirconia-ceramic specimens were prepared; 1) NEZ group (no etching zirconia), 2) EZ group (etching zirconia), 3) ANEZ group (aging and no etching zirconia), 4) AEZ group (aging and etching zirconia). The shear bond strength between zirconia and porcelain was measured using Instron Universal Testing Machine. Surface texture with crystalline structure of zirconia surface was examined by the field emission scanning electron microscopy (FE-SEM) with ingredient analysis. The fractured surfaces of specimens were examined to determine the failure pattern by a digital microscope. The mean${\pm}$standard deviation of shear bond strengths were $23.47{\pm}3.47$ Mpa in NEZ, $28.30{\pm}4.34$ Mpa in EZ, $21.85{\pm}4.65$ Mpa in ANEZ, $24.65{\pm}3.65$ Mpa in AEZ group, respectively, and were significantly different (p<0.05). The average shear bond strength was largest in EZ group, followed by AEZ, NEZ, and ANEZ groups. Most specimens in NEZ group showed adhesive failure and most specimens in EZ, AEZ, and ANEZ group showed mixed failure. Surface of etching treatment group (EZ and AEZ) showed complex micro-structure and irregular surface texture which may facilitate mechanical interlocking, while untreated zirconia surface presented simpler micro-structure. In conclusion, an etching treatment improved bonding strength between zirconia and porcelain by forming mechanical interlocking.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.45-50
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• 2014

Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

• Journal of Dental Rehabilitation and Applied Science
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• v.19 no.4
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• pp.269-279
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• 2003

This study investigated the mechanical properties of precious metal-ceramic alloy joined by the laser-welding and the soldering compared with the parent metal. Twenty-four tensile specimens were cast in precious metal-ceramic alloy and divided into three groups of eight. All specimens in the control group(group 1) were left in the as-cast condition. Group 2 and 3 were the test specimens, which were sectioned at the center. Eight of sectioned specimens were joined by soldering with a propane-oxygen torch, and the remaining specimens were joined by laser-welding. After joining, each joint diameter was measured, and then tested to tensile failure on an Instron machine. Failure loads were recorded, and then fracture stress(ultimate tensile strength), 0.2% yield strength and % elongation calculated. These data for three groups were subjected to a one-way analysis of variance(ANOVA). Neuman-Keuls post hoc test was then used to determine any significant differences between groups. The fracture locations, fracture surfaces were examined by SEM(scanning electron microscope). The results were as follows: 1) The tensile strength and 0.2% yield strength of the soldered group($280.28{\pm}49.35MPa$, $160.24{\pm}26.67MPa$) were significantly less than both the as-cast group($410.99{\pm}13.07MPa$, $217.82{\pm}17.99MPa$) and the laser-welded group($383.56{\pm}59.08MPa$, $217.18{\pm}12.96MPa$). 2) The tensile strength and 0.2% yield strength of the laser-welded group were about each 98%, 99.7% of the as-cast group. There were no statistically significant differences in these two groups(p<0.05). 3) The percentage elongations of the soldered group($3.94{\pm}2.32%$) and the laser-welded group($5.06{\pm}1.08%$) were significantly less than the as-cast group($14.25{\pm}4.05%$) (p<0.05). 4) The fracture of the soldered specimens occurred in the solder material and many porosities were showed at the fracture site. 5) The fracture of the laser-welded specimens occurred also in the welding area, and lack of fusion and a large void was observed at the center of the fracture surface. However, the laser-welded specimens showed a ductile failure mode like the as- cast specimens. The results of this study indicated that the tensile strengths of the laser-welded joints were comparable to those of the as-cast joints and superior to those of the soldered joints.

• The Journal of Korean Academy of Prosthodontics
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• v.44 no.5
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• pp.642-653
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• 2006

Purpose : The purpose of this study was to investigate the effect of the output energy(voltage) of laser welding on the strength and properties of joint of cast titanium(CP Gr II) and titanium alloy(Ti-6Al-4V). Material and method : Cast titanium and its alloy rods(ISO6871) were prepared and perpendicularly cut at the center of the rod. After the cut halves were fixed in a jig, and the joints welded with a laser-welding machine at several levels of output voltage of $200V{\sim}280V$. Uncut specimens served as the non-welded control specimens The pulse duration and pulse spot size employed in this study were 10ms and 1.0mm respectively. Tensile testing was conducted at a crosshead speed of 0.5mm/min. The ultimate tensile strength(MPa) was recorded, and the data (n=6) were statistically analyzed by one-way analysis of variance(ANOVA) and Scheffe's test at ${\alpha}$=0.05. The fracture surface of specimens investigated by scanning electron microscope (SEM). Vickers microhardness was measured under 500g load of 15seconds with the optimal condition of output voltage 280V. Results : The results of this study were obtained as follows, 1. When the pulse duration and spot size were fixed at 10ms and 1.0mm respectively, increasing the output energy(voltage) increased UTS values and penetration depth of laser welded to titanium and titanium alloy. 2. For the commercial titanium grade II, ultimate tensile strength(665.3MPa) of the specimens laser-welded at voltage of 280V were not statistically(p>0.05) different from the non-welded control specimens (680.2MPa). 3. For the titanium alloy(Ti-6Al-4V), ultimate tensile strength(988.3MPa) of the specimens laser-welded at voltage of 280V were statistically(p<0.05) different from the non-welded control specimens (665.0MPa). 4. The commercial titanium grade II and titanium alloy(Ti-6Al-4V) were Vickers microhardness values were increased in the fusion zone and there were no significant differences in base metal, heat-affected zone.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.7-15
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• 2006

In-situ observation of electromigration in thin film pattern of 63Sn-37Pb solder was performed using a scanning electron microscope system. The 63Sn-37Pb solder had the incubation stage of electromigration for edge movement when the current density of $6.0{\times}10^{4}A/cm^2$ was applied the temperature between $90^{\circ}C\;and\;110^{\circ}C$. The major diffusion elements due to electromigration were Pb and Sn at temperatures of $90-110^{\circ}C\;and\;25-50^{\circ}C$, respectively, while no major diffusion of any element due to electromigration was detected when the test temperature was $70^{\circ}C$. The reason was that both the elements of Sn and Pb were migrated simultaneously under such a stress condition. The existence of the incubation stage was observed due to Pb migration before Sn migration at $90-110^{\circ}C$. Electromigration behavior of 63Sn-37Pb solder had an incubation time in common for edge drift and void nucleation, which seemed to be related the lifetime of flip chip solder bump. Diffusivity with $Z^*$(effective charges number) of Pb and Sn were strongly affect the electromigration-induced major diffusion element in SnPb solder by temperature, respectively.